EHP-C04 High-Power White LED Datasheet - Package 2.04x1.64x0.75mm - Voltage 2.95-4.15V - Power 7.5W (Pulse) - English Technical Documentation

1. Product Overview

The EHP-C04/NT01H-P01/TR is a compact, high-efficiency white light-emitting diode (LED) designed for demanding applications requiring high luminous output. This surface-mount device (SMD) utilizes InGaN chip technology to produce white light. Its primary design goals are to deliver high optical performance within a minimal footprint, making it suitable for space-constrained electronic assemblies.

The core advantages of this LED include its high typical luminous flux of 85 lumens at a drive current of 500mA, resulting in an optical efficiency of approximately 47 lumens per watt. It features built-in Electrostatic Discharge (ESD) protection rated up to 8 kV, enhancing its robustness during handling and assembly. The device is classified under Moisture Sensitivity Level (MSL) 1, indicating an unlimited floor life at conditions ≤30°C/85% RH, which simplifies storage and logistics. Furthermore, it is compliant with RoHS (Restriction of Hazardous Substances) directives and is manufactured as a lead-free (Pb-free) component.

The target market for this LED is broad, encompassing consumer electronics, professional lighting, and automotive applications. Its key specifications position it as an ideal solution for applications where high brightness, reliability, and compact size are critical parameters.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These ratings are specified at a solder pad temperature (T_{solder pad}) of 25°C and must not be exceeded under any operating conditions.

• DC Forward Current (I_F): 350 mA. This is the maximum continuous forward current the LED can handle.
• Peak Pulse Current (I_Pulse): 1500 mA. This high current is permissible only under specific pulsed conditions: a maximum pulse duration of 400ms and a maximum duty cycle of 10% (e.g., 400ms ON, 3600ms OFF). This rating is crucial for flash/strobe applications.
• ESD Resistance (Human Body Model): 8000 V. This specifies the LED's robustness against electrostatic discharge.
• Reverse Voltage (V_R): The datasheet explicitly notes that this LED series is not designed for reverse bias operation. Applying a reverse voltage is not recommended.
• Junction Temperature (T_J): 125 °C. The maximum allowable temperature of the semiconductor junction.
• Operating & Storage Temperature: The device can operate from -40°C to +85°C and be stored from -40°C to +110°C.
• Power Dissipation (Pulse Mode): 7.5 W. This is the maximum power the package can dissipate during pulsed operation, dependent on thermal management.
• Soldering Temperature: 260 °C, with a maximum of 2 allowable reflow cycles.
• Viewing Angle (2θ_1/2): 130 degrees (±5°). This is the full angle at which the luminous intensity is half of the peak value (center).

Critical Design Notes: Operating the LED at its maximum ratings continuously can cause permanent damage and parameter degradation. Applying multiple maximum rating parameters simultaneously is not allowed. Extended operation near maximum limits can lead to potential reliability issues. The reliability tests (1000 hours) assure specifications with less than 30% IV degradation.

2.2 Electro-Optical Characteristics

These characteristics are measured under typical conditions (T_{solder pad}=25°C, 50ms pulse width) and represent the device's performance.

• Luminous Flux (Ф_v): Minimum 70 lm, Typical 85 lm. Measured at I_F=500mA with a tolerance of ±10%.
• Forward Voltage (V_F): Minimum 2.95 V, Maximum 4.15 V at I_F=500mA. Measurement tolerance is ±0.1V. The forward voltage is binned, as detailed in Section 3.
• Correlated Color Temperature (CCT): Ranges from 4500 K to 7000 K at I_F=500mA. This covers cool white to daylight white color temperatures.

2.3 Thermal Characteristics

Effective thermal management is paramount for LED performance and longevity. The junction temperature must be kept below 125°C. The datasheet provides specific guidance for reliability testing under different drive currents, highlighting the need for appropriate thermal substrates:

• For 1500 mA pulse testing, a Metal Core Printed Circuit Board (MCPCB) of 1.0 x 1.0 cm² with good thermal management is required.
• For 1000 mA testing, an FR4 substrate of the same size with good thermal management is used.
• A forward current derating curve is provided, showing how the maximum allowable continuous current decreases as the solder pad temperature increases. This curve is based on maintaining T_J(MAX) = 125°C in torch (continuous) mode.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key parameters. The EHP-C04 uses a multi-parameter binning system.

3.1 Forward Voltage (V_F) Binning

LEDs are grouped by their forward voltage at 500mA into four bins:

• Bin 2932: V_F = 2.95V to 3.25V
• Bin 3235: V_F = 3.25V to 3.55V
• Bin 3538: V_F = 3.55V to 3.85V
• Bin 3841: V_F = 3.85V to 4.15V

This allows designers to select LEDs with similar electrical characteristics for consistent driver design and system performance.

3.2 Luminous Flux (Ф_v) Binning

LEDs are binned based on minimum luminous flux at 500mA:

• F7: 70 lm to 80 lm
• F8: 80 lm to 90 lm
• F9: 90 lm to 100 lm
• J1: 100 lm to 120 lm
• J2: 120 lm to 140 lm
• J3: 140 lm to 160 lm

The typical value of 85 lm falls within the F8 bin. This binning ensures brightness uniformity in multi-LED applications.

3.3 Color Coordinate (White) Binning

The white light chromaticity is defined on the CIE 1931 (x, y) color space diagram. The LEDs are grouped into three primary color bins, each associated with a CCT range:

• Color Bin (1) - 4550K: Covers 4500K to 5000K. Defined by a quadrilateral on the (x,y) chart with specific corner coordinates.
• Color Bin (2) - 5057K: Covers 5000K to 5700K. Defined by its own set of corner coordinates.
• Color Bin (3) - 5770K: Covers 5700K to 7000K. Defined by a third set of corner coordinates.

The color coordinate measurement has an allowance of ±0.01. All bins are defined at I_F=500mA under 50ms pulse operation. This precise binning is critical for applications requiring consistent white point and color rendering.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (IV Curve)

The provided curve shows the relationship between forward voltage (V_F) and forward current (I_F). As expected for an LED, V_F increases with I_F, but not linearly. The curve starts around 2.8V at very low current and rises to approximately 5.0V at 1500mA. This curve is essential for designing the current driver circuit, as it determines the power dissipation (V_F * I_F) and the required driver voltage headroom.

4.2 Luminous Flux vs. Forward Current

This curve depicts the relative luminous output as a function of drive current. The light output increases sub-linearly with current. While driving at higher currents yields more light, it also generates significantly more heat, reducing efficiency and potentially impacting longevity. The curve shows that output begins to saturate at higher currents (e.g., above 1000mA), indicating diminishing returns and increased stress on the device.

4.3 Correlated Color Temperature (CCT) vs. Forward Current

The CCT shows a dependency on drive current. For this LED, the CCT typically increases slightly with current, moving from around 5600K at low current to near 6000K at 1500mA. This shift is important for applications where consistent color temperature across different brightness levels is required.

4.4 Relative Spectral Distribution

The spectral power distribution graph shows a broad emission peak in the blue region (around 450-460 nm) from the InGaN chip, combined with a broader yellow phosphor emission peak. The combined spectrum produces white light. The exact shape and peaks determine the LED's Color Rendering Index (CRI), though a specific CRI value is not provided in this datasheet.

4.5 Radiation Pattern

The polar radiation pattern is provided for both the X and Y axes. The pattern is nearly Lambertian (cosine distribution), which is typical for LEDs with a primary lens designed for wide, uniform illumination. The 130-degree viewing angle is confirmed by this pattern, where the intensity drops to 50% of the center value at ±65 degrees.

4.6 Forward Current Derating Curve

This is a critical graph for thermal design. It plots the maximum allowable continuous forward current against the solder pad temperature. As the pad temperature rises, the maximum safe current decreases linearly. For example, at a solder pad temperature of 75°C, the maximum continuous current is derated to approximately 300mA. This curve must be used to ensure the LED operates within its safe junction temperature limit under real-world thermal conditions.

5. Mechanical and Package Information

5.1 Package Dimensions

The EHP-C04 is housed in a surface-mount package. Key dimensions from the top-view and side-view drawings include:

• Overall Package Size: Approximately 2.04 mm (length) x 1.64 mm (width) x 0.75 mm (height).
• Chip Position: The light-emitting chip is centrally located within the package.
• Anode and Cathode Pads: The package features two solder pads for electrical connection. The anode and cathode are clearly marked in the diagram. Correct polarity is essential for operation.
• Optical Center: The point from which the primary optical axis originates. This is important for optical system alignment.
• Tolerances: Unless otherwise specified, dimensional tolerances are ±0.1 mm.

6. Soldering and Assembly Guidelines

The LED is rated for reflow soldering processes with a peak temperature of 260°C. A maximum of two reflow cycles is permitted. The Moisture Sensitivity Level (MSL) is Class 1, meaning no baking is required prior to reflow, as it has an unlimited floor life at ≤30°C/85% RH. Standard JEDEC soak conditions (168 hours at 85°C/85% RH) apply if baking is ever deemed necessary for other reasons. During assembly, standard ESD precautions should be observed due to the sensitive semiconductor structure.

7. Packaging and Ordering Information

The device is supplied in moisture-resistant packaging suitable for automated assembly, typically on carrier tape and reel. The product labeling on the reel includes fields for the Customer's Product Number (CPN), the manufacturer's Part Number (P/N - EHP-C04/NT01H-P01/TR), and a Lot Number for traceability. The specific carrier tape dimensions are referenced as having been defined in a previous revision of the datasheet.

8. Application Suggestions

8.1 Typical Application Scenarios

• Mobile Phone Camera Flash / Strobe: The high pulse current capability (1500mA) and high luminous flux make it ideal for camera flash applications in mobile devices and digital cameras.
• Torch Lights: Suitable for handheld flashlights and torch applications in devices like digital video cameras.
• General Lighting: Can be used in indoor lighting fixtures, decorative lighting, and entertainment lighting where a compact, bright point source is needed.
• Backlighting: Applicable for TFT-LCD backlighting units, especially smaller panels or as an array for larger ones.
• Automotive Lighting: Suitable for both interior (dashboard, dome lights) and exterior (auxiliary lighting, signature lights) automotive applications, subject to meeting relevant automotive qualifications.
• Signal and Marker Lights: Ideal for exit signs, step lights, and other orientation markers due to its brightness and wide viewing angle.

8.2 Design Considerations

• Thermal Management: This is the single most critical design factor. Use an appropriate PCB (MCPCB is recommended for high-current/pulse operation) and ensure adequate heat sinking to keep the solder pad temperature as low as possible. Refer to the derating curve.
• Current Driving: Use a constant-current LED driver, not a constant-voltage source. The driver should be designed to handle the forward voltage bin range (2.95V-4.15V) and provide the desired current (continuous or pulsed).
• Optics: The 130-degree viewing angle provides a wide beam. For focused beams, secondary optics (lenses, reflectors) will be required. The optical center location should be used for alignment.
• ESD Protection: While the LED has built-in ESD protection, implementing additional board-level ESD protection on sensitive lines is good practice.

9. Technical Comparison and Differentiation

While a direct side-by-side comparison with other models is not provided in the datasheet, the EHP-C04's key differentiating features can be inferred from its specifications:

• High Flux in Compact Size: Delivering 85 lm typical from a package under 2.1mm in length is a significant advantage for miniaturized devices.
• High Pulse Current Capability: The 1500mA pulse rating (at 10% duty cycle) is notably high for its size, specifically targeting camera flash applications.
• Robust ESD Rating: 8kV HBM ESD protection is a strong feature that enhances assembly yield and field reliability compared to LEDs with lower or unspecified ESD ratings.
• MSL Level 1: This simplifies inventory management and assembly processes compared to components with higher MSL ratings that require baking.
• Comprehensive Binning: Three-parameter binning (Flux, V_F, Color) allows for very tight system performance matching, which is critical in multi-LED arrays for uniform brightness and color.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at 1000mA continuously?
A1: The Absolute Maximum Rating for DC forward current is 350mA. Continuous operation at 1000mA would exceed this rating and likely cause rapid failure. The 1000mA and 1500mA levels are for pulsed operation only, under the strict conditions of 400ms max pulse width and 10% max duty cycle, and require excellent thermal management (MCPCB).

Q2: What is the difference between the F8 and J1 luminous flux bins?
A2: The F8 bin guarantees a minimum flux between 80 and 90 lm at 500mA. The J1 bin guarantees a higher minimum flux, between 100 and 120 lm. Selecting a higher bin ensures greater minimum light output but may come at a higher cost.

Q3: How do I interpret the color binning chart?
A3: The chart on page 5 of the datasheet is a CIE 1931 chromaticity diagram. Each numbered bin (1, 2, 3) represents a quadrilateral area on this chart. LEDs are tested, and their measured (x,y) color coordinates must fall within one of these defined areas. Bin 1 corresponds to warmer white (~4550K), Bin 2 to neutral white (~5057K), and Bin 3 to cooler white (~5770K).

Q4: Why is thermal management so emphasized?
A4: LED efficiency drops as temperature rises (efficiency droop). More critically, excessive junction temperature (above 125°C) accelerates degradation mechanisms like phosphor thermal quenching and semiconductor defects, drastically reducing lifespan. Proper heatsinking maintains performance and reliability.

Q5: What does \"Moisture Sensitivity Level 1\" mean for my production?
A5: MSL 1 means the component can be exposed to factory floor conditions (≤30°C/85% RH) for an unlimited time without absorbing harmful levels of moisture that could cause \"popcorning\" (package cracking) during reflow soldering. No baking is required before use, simplifying logistics.

11. Design and Usage Case Studies

Case Study 1: Smartphone Camera Flash Module
A designer is creating a dual-LED flash for a smartphone. They select the EHP-C04 for its high pulse output and small size. They design a compact MCPCB sub-assembly to manage the heat from 1500mA pulses. They specify LEDs from the same luminous flux bin (e.g., F8) and color bin (e.g., Bin 2) to ensure both flashes produce identical brightness and color. The driver IC is selected to deliver precisely timed 400ms pulses. The wide 130-degree angle ensures good scene coverage without requiring a diffuser lens, saving space.

Case Study 2: Compact High-Lumen Flashlight
For a compact tactical flashlight, the goal is maximum output. The designer uses a single EHP-C04 driven at its maximum continuous rating of 350mA. A thermally conductive aluminum PCB is used, and the flashlight body acts as a heatsink. The driver circuit includes thermal feedback to reduce current if the temperature gets too high. The wide beam pattern is collimated using a parabolic reflector aligned with the LED's optical center to create a focused spot with useful spill.

12. Technology Principle Introduction

The EHP-C04 is a phosphor-converted white LED. It is based on a semiconductor chip made from Indium Gallium Nitride (InGaN), which emits light in the blue region of the spectrum (typically around 450-460 nm) when electrical current passes through it. This blue LED chip is coated with a layer of cerium-doped yttrium aluminum garnet (YAG:Ce) phosphor. Part of the blue light from the chip is absorbed by the phosphor, which then re-emits light across a broad spectrum centered in the yellow region. The mixture of the remaining unabsorbed blue light and the converted yellow light is perceived by the human eye as white light. The exact ratio of blue to yellow light, controlled by the phosphor composition and thickness, determines the Correlated Color Temperature (CCT) of the white output. This technology is dominant in the industry due to its high efficiency and relatively simple manufacturing process compared to alternative white LED methods.

13. Technology Development Trends

The field of high-power white LEDs continues to evolve along several key trajectories, all aimed at improving performance, quality, and application range. While the EHP-C04 represents a capable device, ongoing trends include:

• Increased Efficiency (Lumens per Watt): Research focuses on improving the internal quantum efficiency of the blue InGaN chip, enhancing light extraction from the package, and developing more efficient phosphors with narrower emission spectra (e.g., using quantum dots or nitride/oxynitride phosphors) to reduce Stokes losses.
• Improved Color Quality: Moving beyond cool white, there is a strong trend towards LEDs with high Color Rendering Index (CRI >90, even >95) and tunable CCT, often using multi-phosphor blends or multiple LED chips (RGB or RGB+White).
• Higher Power Density and Miniaturization: The drive for smaller, brighter devices continues. This involves advanced packaging techniques like chip-scale packaging (CSP) and flip-chip designs to improve thermal paths and reduce package size relative to the light-emitting area.
• Enhanced Reliability and Lifetime: Improvements in materials (epitaxy, phosphors, encapsulants) and package design (better thermal interfaces, hermetic sealing) are pushing rated lifetimes (L70/B50) from tens of thousands to over 100,000 hours.
• Application-Specific Optimization: LEDs are increasingly being tailored for specific markets. For example, flash LEDs are optimized for very high pulse currents and minimal droop, while horticultural LEDs are tuned to specific plant-growth spectra. The comprehensive binning seen in the EHP-C04 datasheet is part of this trend towards providing precise, application-ready components.