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PLCC-2 Top View Cool White LED Datasheet - 2.0x1.6x0.8mm - 3.1V - 93mW - Automotive Interior Lighting

Technical datasheet for a PLCC-2 packaged Cool White LED. Features include 2240 mcd typical luminous intensity, 120° viewing angle, AEC-Q102 qualification, and RoHS/REACH compliance. Designed for automotive interior lighting applications.
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PDF Document Cover - PLCC-2 Top View Cool White LED Datasheet - 2.0x1.6x0.8mm - 3.1V - 93mW - Automotive Interior Lighting

1. Product Overview

This document details the specifications for a high-brightness, surface-mount LED in a PLCC-2 (Plastic Leaded Chip Carrier) package with a top-view emission design. The primary application focus is automotive interior lighting, where reliability, consistent performance, and compliance with industry standards are paramount. The device emits a cool white light and is engineered to meet stringent automotive-grade requirements, including AEC-Q102 qualification and specific corrosion robustness criteria.

1.1 Core Features and Advantages

The LED offers several key advantages for demanding applications. Its typical luminous intensity of 2240 millicandelas (mcd) at a standard 30mA drive current provides ample brightness for illumination tasks. The wide 120-degree viewing angle ensures uniform light distribution, which is crucial for ambient and indicator lighting. Compliance with AEC-Q102, the global stress test qualification for discrete optoelectronic semiconductors in automotive applications, guarantees performance under harsh environmental conditions. Additional compliance with RoHS, REACH, and halogen-free standards addresses environmental and safety regulations. The device also features an 8kV ESD (Electrostatic Discharge) protection level (HBM) and is rated MSL 3 (Moisture Sensitivity Level), indicating robust handling characteristics for assembly processes.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The primary operating point is defined at a forward current (IF) of 30mA. At this current, the typical forward voltage (VF) is 3.1V, with a specified range from 2.5V (Min) to 3.75V (Max). The resulting typical power consumption is approximately 93mW (3.1V * 0.03A). The key photometric output is a luminous intensity (IV) of 2240 mcd, with a minimum of 1400 mcd and a maximum reaching 4500 mcd, indicating potential performance spread across production bins. The dominant chromaticity coordinates (CIE x, y) are centered around (0.3, 0.3) for the cool white variant, with a tolerance of ±0.005.

2.2 Thermal and Absolute Maximum Ratings

Thermal management is critical for LED longevity. The thermal resistance from the junction to the solder point is specified with two values: an electrical method (Rth JS el) of 75 K/W max and a real method (Rth JS real) of 95 K/W max. The absolute maximum ratings define the operational limits: a maximum continuous forward current of 60mA, a maximum power dissipation of 210mW, and an operating junction temperature (TJ) limit of 125°C. The ambient operating temperature range is from -40°C to +110°C. A brief surge current (IFM) of up to 250mA for pulses ≤10μs is permissible. The device is not designed for reverse bias operation.

3. Performance Curve Analysis

3.1 Current-Voltage and Luminance Relationships

The forward current vs. forward voltage (I-V) curve shows the expected exponential relationship. The relative luminous intensity vs. forward current graph demonstrates that light output increases sub-linearly with current above the standard 30mA point, emphasizing the importance of current regulation for consistent brightness. The forward current derating curve is crucial for design: as the solder pad temperature (TS) increases, the permissible continuous forward current must be reduced. For example, at the maximum recommended TS of 110°C, the maximum allowable IF is 60mA.

3.2 Temperature Dependence and Spectral Output

The relative luminous intensity vs. junction temperature graph shows a negative temperature coefficient; light output decreases as the junction temperature rises. The relative forward voltage also decreases with increasing temperature, which can be used for indirect temperature monitoring. The chromaticity coordinates shift with both forward current and junction temperature, which is important for color-critical applications. The wavelength characteristics graph displays the relative spectral power distribution (SPD) of the cool white phosphor-converted LED, typically showing a blue pump LED peak and a broader yellow phosphor emission band. The radiation pattern diagram visually confirms the Lambertian-like 120° viewing angle.

4. Binning System Explanation

The LED is available in sorted performance groups, known as bins, to ensure consistency within a production lot.

4.1 Luminous Intensity Binning

The datasheet provides an extensive luminous intensity binning table with codes ranging from L1 to GA. Each bin defines a minimum and maximum luminous intensity value in millicandelas (mcd). For this specific part number (2214-C70301H-AM), the possible output bins are highlighted, with the typical value of 2240 mcd falling within the \"BA\" bin (1800-2240 mcd) or \"BB\" bin (2240-2800 mcd). Designers must account for this range when specifying minimum required brightness.

4.2 Color Coordinate Binning (Cool White)

A standard cool white color bin structure is defined using CIE 1931 (x, y) chromaticity coordinates. The structure is presented as a grid of rectangular bins (e.g., L10, L20, K10, etc.), each defined by three coordinate pairs that form a triangle on the chromaticity diagram. This allows for precise selection of LEDs with very similar color appearance, which is essential for multi-LED arrays to avoid visible color differences.

5. Mechanical, Assembly, and Packaging

5.1 Physical Dimensions and Polarity

The mechanical drawing (referenced in the PDF) defines the exact package dimensions for the PLCC-2. Key measurements include the overall length, width, and height, as well as the lead spacing and size. The top-view design means light is emitted perpendicular to the mounting plane. The package includes a polarity indicator, typically a notch or a marked cathode, to ensure correct orientation during PCB assembly.

5.2 Soldering and Reflow Guidelines

A recommended soldering pad layout is provided to ensure reliable solder joints and optimal thermal transfer from the LED's thermal pad to the PCB. The reflow soldering profile specifies the maximum temperature and time constraints to prevent damage. The profile typically follows IPC/JEDEC standards, with a peak temperature of 260°C for a maximum of 30 seconds. The MSL 3 rating requires that the device be baked if exposed to ambient air for longer than 168 hours prior to reflow to prevent \"popcorning\" damage from moisture vaporization.

5.3 Packaging Information

The LEDs are supplied on tape and reel for automated pick-and-place assembly. The packaging information details the reel dimensions, tape width, pocket spacing, and orientation of the components on the tape. This data is essential for programming assembly equipment.

6. Application Guidelines and Design Considerations

6.1 Primary Application: Automotive Interior Lighting

This LED is explicitly designed for automotive interior lighting applications. This includes dashboard backlighting, switch illumination, footwell lighting, door panel lights, and ambient lighting. The AEC-Q102 qualification ensures it can withstand the temperature extremes, humidity, vibration, and long-term reliability demands of the automotive environment.

6.2 Circuit Design and Thermal Management

To ensure stable and long-lasting performance, a constant current driver is strongly recommended over a constant voltage source with a series resistor, especially for automotive voltage buses that can fluctuate. The driver should be designed to limit IF to 30mA for typical use or according to the derating curve if higher ambient temperatures are expected. Effective thermal management is non-negotiable. The PCB should have a sufficiently large copper area connected to the LED's thermal pad to act as a heat sink, keeping the solder point temperature (TS) as low as possible to maintain light output and longevity.

6.3 Precautions for Use

General precautions include avoiding mechanical stress on the LED lens, preventing exposure to sulfur-containing environments (which can corrode silver-plated components), and using appropriate ESD handling procedures during assembly despite the 8kV rating. The device should not be operated in reverse bias. Optical design should consider the 120° viewing angle for the intended light pattern.

7. Ordering and Part Number Information

The part number 2214-C70301H-AM follows a specific coding system. While the full breakdown may be proprietary, it typically encodes information such as the package type (2214 likely refers to a 2.2mm x 1.4mm footprint for PLCC-2), color (C for Cool White), luminous intensity bin, and possibly special features or revisions (AM). Ordering information would specify the quantity per reel and any optional binning selections for color or intensity.

8. Technical Comparison and FAQs

8.1 Differentiation from Standard LEDs

The key differentiators for this LED are its automotive-grade qualification (AEC-Q102) and associated reliability tests, its specific corrosion robustness classification (Class A1), and its compliance with automotive-relevant environmental regulations (REACH, halogen-free). A standard commercial-grade PLCC-2 LED would not be subjected to the same level of rigorous testing and may not perform reliably over the -40°C to +110°C temperature range.

8.2 Frequently Asked Questions

Q: What is the typical efficacy (lumens per watt) of this LED?

A: The datasheet specifies luminous intensity in millicandelas, not lumens. To calculate approximate lumens, the viewing angle must be considered. For a 120° viewing angle and 2240 mcd, the typical luminous flux is roughly 6-8 lumens. At 93mW, this yields an efficacy of approximately 65-85 lm/W.

Q: Can I drive this LED with a 12V automotive battery directly?

A: No. The forward voltage is only about 3.1V. Connecting it directly to 12V would destroy it instantly. A current-limiting circuit, such as a linear constant current driver or a switching buck converter, is mandatory.

Q: How do I select the right intensity bin for my application?

A: Use the minimum luminous intensity value of the bin, not the typical or maximum. Design your optical system to meet brightness requirements even with LEDs from the lowest-performing bin you allow in your purchase order. This ensures yield and consistency.

Q: What does \"Corrosion Robustness Class A1\" mean?

A> This classification, often defined by manufacturer or customer specifications, indicates the LED's passed specific accelerated corrosion tests (e.g., mixed flowing gas tests) that simulate harsh environmental conditions, ensuring the package and leads resist corrosion over the product's lifetime.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.