Table of Contents
- 1. Product Overview
- 2. Technical Specifications Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics (Ta=25°C)
- 3. Binning System Explanation
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Luminous Intensity vs. Forward Current
- 4.3 Luminous Intensity vs. Ambient Temperature
- 4.4 Forward Current Derating Curve
- 4.5 Spectral Distribution
- 4.6 Radiation Diagram (Viewing Angle Pattern)
- 5. Mechanical & Package Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering & Assembly Guidelines
- 6.1 Moisture Sensitivity and Storage
- 6.2 Reflow Soldering Profile (Pb-free)
- 6.3 Hand Soldering Precautions
- 6.4 Rework and Repair
- 7. Packaging & Ordering Information
- 7.1 Tape and Reel Specifications
- 7.2 Label and Moisture Barrier Bag
- 8. Application Recommendations
- 8.1 Typical Application Scenarios
- 8.2 Critical Design Considerations
- 9. Technical Comparison & Differentiation
- 10. Frequently Asked Questions (FAQs)
- 10.1 What resistor value should I use with a 5V supply for the green LED?
- 10.2 Can I drive this LED without a current-limiting resistor using a constant voltage source?
- 10.3 Why is the maximum forward current different for the Blue (BH) LED?
- 10.4 How do I interpret the luminous intensity tolerance of ±11%?
- 10.5 Is this LED suitable for automotive interior lighting?
- 11. Design and Usage Case Study
- 12. Operating Principle
- 13. Technology Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The 15-13D is a compact, surface-mount device (SMD) LED designed for modern electronic applications requiring miniaturization and high reliability. This series offers three distinct color options based on different semiconductor materials: Brilliant Red (R6, AlGaInP), Brilliant Green (GH, InGaN), and Blue (BH, InGaN). The package is supplied on 8mm tape wound on a 7-inch diameter reel, making it fully compatible with high-speed automated pick-and-place assembly equipment.
The primary advantage of this LED is its significantly reduced footprint compared to traditional lead-frame packages. This enables designers to achieve higher component packing density on printed circuit boards (PCBs), leading to smaller overall board sizes and ultimately more compact end products. The lightweight construction further makes it ideal for portable and miniature applications where weight and space are critical constraints.
The product is manufactured to be Pb-free (lead-free), compliant with the EU RoHS and REACH directives, and meets halogen-free requirements (Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm). It is also produced using ESD (Electrostatic Discharge) safe processes, enhancing its handling reliability.
2. Technical Specifications Deep Dive
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.
- Reverse Voltage (VR): 5V maximum for all color codes. Exceeding this can cause junction breakdown.
- Forward Current (IF): 25 mA for R6 (Red) and GH (Green); 20 mA for BH (Blue). This is the maximum continuous DC current.
- Peak Forward Current (IFP): Applicable under pulsed conditions (1/10 duty cycle @ 1kHz). R6: 60 mA; GH & BH: 100 mA.
- Power Dissipation (Pd): The maximum power the package can dissipate. R6: 60 mW; GH: 95 mW; BH: 75 mW. This is calculated as IF * VF.
- Electrostatic Discharge (ESD) HBM: All variants are rated for 2000V Human Body Model, indicating good inherent ESD robustness for standard handling.
- Operating & Storage Temperature: -40°C to +85°C for operation; -40°C to +90°C for storage.
- Soldering Temperature: Reflow soldering peak temperature: 260°C for a maximum of 10 seconds. Hand soldering: 350°C for a maximum of 3 seconds per terminal.
2.2 Electro-Optical Characteristics (Ta=25°C)
These are the typical performance parameters measured under standard test conditions (IF=20mA, unless otherwise specified).
- Luminous Intensity (Iv): The light output in millicandelas (mcd). R6: 90-140 mcd; GH: 112-180 mcd; BH: 45-70 mcd. A tolerance of ±11% applies.
- Viewing Angle (2θ1/2): Approximately 120 degrees, providing a wide angle of emitted light.
- Peak Wavelength (λp): The wavelength at which the emission intensity is highest. R6: 632 nm (Red); GH: 518 nm (Green); BH: 468 nm (Blue).
- Dominant Wavelength (λd): The single wavelength perceived by the human eye. R6: 624 nm; GH: 525 nm; BH: 470 nm.
- Spectral Bandwidth (Δλ): The width of the emission spectrum at half maximum intensity. R6: 20 nm; GH: 35 nm; BH: 25 nm.
- Forward Voltage (VF): The voltage drop across the LED at the test current. R6: 1.70-2.40V (Typ. 2.00V); GH & BH: 2.70-3.70V (Typ. 3.30V). Tolerance is ±0.05V.
- Reverse Current (IR): Leakage current at VR=5V. R6: Max 10 μA; GH & BH: Not Applicable (NA).
3. Binning System Explanation
The datasheet indicates the product uses a binning system to categorize LEDs based on key parameters, ensuring consistency within a batch. The label explanation on the packaging mentions specific ranks:
- CAT (Luminous Intensity Rank): Groups LEDs based on their measured luminous intensity output.
- HUE (Chromaticity Coordinates & Dominant Wavelength Rank): Sorts LEDs according to their color point or dominant wavelength to minimize color variation in an array.
- REF (Forward Voltage Rank): Classifies LEDs by their forward voltage drop, which is important for current matching in series or parallel circuits.
Designers should consult specific binning charts from the manufacturer for detailed selection when color or intensity matching is critical for the application.
4. Performance Curve Analysis
The datasheet provides typical characteristic curves for each LED type (R6, GH, BH). These graphs are essential for understanding device behavior under non-standard conditions.
4.1 Forward Current vs. Forward Voltage (I-V Curve)
This curve shows the exponential relationship between current and voltage. The "knee" voltage is where the LED begins to emit light significantly. The typical VF values provided are measured at 20mA. Designers use this curve to select appropriate current-limiting resistors.
4.2 Luminous Intensity vs. Forward Current
This graph demonstrates that light output is generally proportional to forward current, but it may become sub-linear at very high currents due to thermal and efficiency effects. It is crucial for determining the drive current needed to achieve a desired brightness.
4.3 Luminous Intensity vs. Ambient Temperature
LED light output decreases as the junction temperature increases. This derating curve is vital for applications operating in elevated temperature environments. It shows the percentage of relative luminous intensity remaining as ambient temperature rises.
4.4 Forward Current Derating Curve
To prevent overheating, the maximum allowable continuous forward current must be reduced as the ambient temperature increases. This curve provides the safe operating area (SOA) for the device across its temperature range.
4.5 Spectral Distribution
This plot shows the relative intensity of light emitted across the wavelength spectrum. It confirms the peak and dominant wavelengths and illustrates the spectral purity (narrowness) of the emitted color.
4.6 Radiation Diagram (Viewing Angle Pattern)
A polar plot illustrating the spatial distribution of light intensity. The 15-13D has a typical lambertian or wide-angle pattern, with intensity decreasing as the angle from the central axis increases, reaching half intensity at approximately ±60 degrees (120-degree total viewing angle).
5. Mechanical & Package Information
5.1 Package Dimensions
The 15-13D package has nominal dimensions of 1.5mm (length) x 1.3mm (width) x 0.8mm (height). Tolerances are typically ±0.1mm unless otherwise specified. The component features an anode mark (typically a notch, green dot, or other indicator) on the top of the package for polarity identification. A suggested PCB land pattern (pad layout) is provided, but designers are advised to modify it based on their specific PCB manufacturing process and thermal/mechanical requirements.
5.2 Polarity Identification
Correct polarity is essential for LED operation. The package includes a visual marker denoting the anode (+) terminal. During PCB design and assembly, this marker must be aligned with the corresponding anode pad on the board layout to ensure proper orientation.
6. Soldering & Assembly Guidelines
6.1 Moisture Sensitivity and Storage
The LEDs are packaged in a moisture-resistant barrier bag with desiccant to prevent moisture absorption, which can cause "popcorning" (package cracking) during reflow soldering.
- Do not open the bag until ready for use.
- After opening, unused parts should be stored at ≤30°C and ≤60% RH.
- The "floor life" after bag opening is 168 hours (7 days).
- If exceeded, or if the desiccant indicator has changed color, a bake-out at 60±5°C for 24 hours is required before soldering.
6.2 Reflow Soldering Profile (Pb-free)
A recommended temperature profile is provided for lead-free solder (e.g., SAC305):
- Pre-heating: 150-200°C for 60-120 seconds.
- Time Above Liquidus (TAL): >217°C for 60-150 seconds.
- Peak Temperature: 260°C maximum, held for no more than 10 seconds.
- Ramp-up Rate: Maximum 3°C/sec to 255°C, then max 6°C/sec to peak.
- Ramp-down Rate: Controlled to avoid thermal shock.
Critical Note: Reflow soldering should not be performed more than two times on the same LED assembly.
6.3 Hand Soldering Precautions
If manual soldering is necessary, extreme care must be taken:
- Use a soldering iron with a tip temperature <350°C.
- Limit contact time to ≤3 seconds per terminal.
- Use an iron with a power rating ≤25W.
- Allow a minimum 2-second interval between soldering each terminal to prevent heat buildup.
- Avoid applying mechanical stress to the LED body during soldering.
6.4 Rework and Repair
Repair after initial soldering is strongly discouraged. If unavoidable, a specialized double-head soldering iron should be used to simultaneously heat both terminals, minimizing thermal stress on the LED die and wire bonds. The potential for damage to the LED's characteristics must be evaluated beforehand.
7. Packaging & Ordering Information
7.1 Tape and Reel Specifications
The components are supplied in embossed carrier tape with dimensions tailored for the 15-13D package. The tape is wound onto a standard 7-inch (178mm) diameter reel. Each reel contains 2000 pieces. Detailed reel, carrier tape, and pocket dimensions are provided in the datasheet, with standard tolerances of ±0.1mm.
7.2 Label and Moisture Barrier Bag
The outer moisture-proof bag contains a label with critical information: Customer Part Number (CPN), Manufacturer Part Number (P/N), Quantity (QTY), and the binning codes for Luminous Intensity (CAT), Chromaticity (HUE), and Forward Voltage (REF). A Lot Number (LOT No.) is included for traceability.
8. Application Recommendations
8.1 Typical Application Scenarios
- Backlighting: Dashboard indicators, switch illumination, keypad backlights.
- Telecommunication Equipment: Status indicators on phones, fax machines, routers, and modems.
- LCD Flat Backlighting: Edge-lighting for small monochrome or color LCD displays.
- General Indicator Use: Power status, mode indication, alert signals in consumer electronics, appliances, and industrial controls.
8.2 Critical Design Considerations
- Current Limiting: An external series resistor is MANDATORY to limit forward current. The LED's exponential I-V characteristic means a small voltage increase can cause a large, destructive current surge. The resistor value is calculated as R = (Vsupply - VF) / IF.
- Thermal Management: While the package is small, power dissipation (Pd) must be considered, especially at high ambient temperatures or drive currents. Ensure adequate PCB copper area or thermal vias if operating near maximum ratings.
- ESD Protection: Although rated for 2000V HBM, implementing ESD protection on sensitive input lines or using ESD-safe handling procedures in production is considered good practice.
- Wave Soldering: The datasheet specifies reflow and hand soldering only. Wave soldering is generally not recommended for this type of SMD LED due to excessive thermal exposure.
- Board Flexing: Avoid bending or flexing the PCB after the LEDs are soldered, as this can stress the solder joints and the LED package itself.
9. Technical Comparison & Differentiation
The 15-13D series differentiates itself through its combination of a very small 1.5x1.3mm footprint with relatively high luminous intensity for its size, particularly in the green and red variants. The wide 120-degree viewing angle is suitable for applications requiring broad visibility. Its compatibility with standard SMD assembly and Pb-free reflow processes aligns it with modern, environmentally compliant manufacturing. Compared to larger SMD LEDs (e.g., 0603, 0805), it offers space savings but may require more precise placement equipment. Compared to chip-scale packages, it offers a more robust, encapsulated structure that is easier to handle and solder reliably.
10. Frequently Asked Questions (FAQs)
10.1 What resistor value should I use with a 5V supply for the green LED?
Using typical values: Vsupply = 5V, VF (GH, typ) = 3.3V, IF = 20mA. R = (5V - 3.3V) / 0.020A = 85 Ohms. The nearest standard value would be 82 or 91 Ohms. Always recalculate using the min/max VF from the datasheet to ensure current stays within limits under all conditions.
10.2 Can I drive this LED without a current-limiting resistor using a constant voltage source?
No. This will almost certainly destroy the LED. LEDs are current-driven devices. A constant voltage source cannot regulate the current through the LED's highly non-linear junction. A series resistor or, for better performance, a constant current driver circuit is required.
10.3 Why is the maximum forward current different for the Blue (BH) LED?
The lower maximum continuous current (20mA vs. 25mA for Red/Green) is likely due to differences in the internal semiconductor structure (InGaN for Blue/Green vs. AlGaInP for Red) and its associated thermal characteristics and efficiency at higher current densities, leading to a lower power dissipation (Pd) rating for the blue variant.
10.4 How do I interpret the luminous intensity tolerance of ±11%?
This means the actual measured luminous intensity of any individual LED from a production batch can vary by ±11% from the typical or nominal value stated in the datasheet. For example, a green LED with a typical Iv of 180 mcd could measure anywhere from approximately 160 mcd to 200 mcd. For applications requiring uniform brightness, selecting LEDs from a tight bin (CAT code) is necessary.
10.5 Is this LED suitable for automotive interior lighting?
While it may be used in some non-critical automotive interior applications (like switch backlighting), the datasheet includes a specific application restriction note advising against use in "high reliability applications such as military/aerospace, automotive safety/security systems, and medical equipment." For any automotive application, especially safety-related, a component specifically qualified to automotive-grade standards (e.g., AEC-Q102) must be used.
11. Design and Usage Case Study
Scenario: Designing a multi-status indicator panel for a consumer router.
A designer needs to indicate Power (Green), Internet Activity (Flashing Green), and Ethernet Link (Amber/Red). Space is limited. They choose one 15-13D/GH (Green) for Power, one for Internet (flashed by MCU), and one 15-13D/R6 (Red) for the Ethernet indicator (amber can be approximated by driving a red LED at lower current or using a diffuser).
Implementation: The MCU GPIO pins are 3.3V. For the green LEDs (VF typ 3.3V), the voltage drop is nearly equal to the supply, leaving little headroom for a resistor. The designer might use a lower current (e.g., 10mA) to achieve sufficient brightness while ensuring reliable turn-on, calculating R = (3.3V - 3.3V)/0.01A = 0 Ohms. This is problematic. Instead, they would use a transistor or a GPIO pin configured in a current-sink mode connected to the LED cathode, with the anode tied to a higher voltage rail (e.g., 5V) through an appropriate resistor. This case highlights the importance of matching the driver circuit voltage to the LED's VF.
12. Operating Principle
Light Emitting Diodes (LEDs) are semiconductor p-n junction devices that emit light through a process called electroluminescence. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected across the junction. These charge carriers recombine in the active region near the junction. For efficient LEDs, this recombination occurs in a direct bandgap semiconductor material. The energy released during recombination is emitted as a photon (light particle). The wavelength (color) of the emitted light is determined by the bandgap energy (Eg) of the semiconductor material: E = hc/λ, where h is Planck's constant, c is the speed of light, and λ is the wavelength. The 15-13D uses AlGaInP for red light (larger bandgap for lower energy/longer wavelength) and InGaN for green and blue light (smaller bandgap for higher energy/shorter wavelength). The epoxy resin lens shapes the light output and provides environmental protection.
13. Technology Trends
The 15-13D represents a mature SMD LED technology. General trends in the indicator LED market continue to push towards:
- Further Miniaturization: Even smaller packages (e.g., 1.0x0.5mm, chip-scale) while maintaining or improving light output.
- Higher Efficiency: Improved lumens per watt (lm/W) or millicandelas per milliamp (mcd/mA), reducing power consumption for a given brightness.
- Enhanced Reliability and Robustness: Higher maximum junction temperatures, improved moisture resistance, and better performance under high-temperature operating life (HTOL) tests.
- Integrated Solutions: LEDs with built-in current-limiting resistors, protection diodes (ESD, reverse polarity), or even driver ICs in a single package.
- Broadened Color Gamut and Consistency: Tighter binning for color and intensity to meet the demands of full-color displays and indicator arrays where visual uniformity is critical.
While newer packages exist, the 15-13D remains a reliable and widely used workhorse component for general-purpose indicator applications where its balance of size, performance, and cost is optimal.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |