T-1-3-4-Warm-White-LED-Lamp-334-15-X2C5-1-PSB-Datasheet - Package-5.0mm - Voltage-2.8-3.6V - Power-110mW - English-Technical-Document

1. Product Overview

This document details the specifications for a high-performance warm white LED lamp. The device utilizes an InGaN semiconductor chip combined with a phosphor-filled reflector to convert blue emission into a warm white light. It is housed in a popular T-1 3/4 round package, making it suitable for a wide range of indicator and illumination applications requiring high luminous output.

The core advantages of this LED include its high luminous power and consistent color characteristics, with typical chromaticity coordinates defined. It is designed for reliability and compliance with modern environmental standards, including RoHS, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). The product is available in bulk or taped on reel for automated assembly processes.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The device is designed to operate within strict limits to ensure long-term reliability. The continuous forward current (I_F) is rated at 30 mA, with a peak forward current (I_FP) of 100 mA permissible under pulsed conditions (duty cycle 1/10 @ 1 kHz). The maximum reverse voltage (V_R) is 5 V. The total power dissipation (P_d) must not exceed 110 mW. The operational temperature range is from -40°C to +85°C, while storage can be from -40°C to +100°C. The device can withstand an Electrostatic Discharge (ESD) of 4 kV (Human Body Model). The maximum soldering temperature is 260°C for 5 seconds.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at a standard test condition of 25°C ambient temperature and a forward current of 20 mA.

• Forward Voltage (V_F): Ranges from a minimum of 2.8 V to a maximum of 3.6 V. This parameter is critical for driver design and power supply selection.
• Luminous Intensity (I_V): The minimum luminous intensity is 2850 millicandelas (mcd). The typical value is not specified, but the maximum reaches 7150 mcd, indicating a product family with a significant brightness spread managed through binning.
• Viewing Angle (2θ_1/2): The typical half-angle is 50 degrees, defining the angular distribution of the emitted light.
• Chromaticity Coordinates: The typical color point, according to the CIE 1931 standard, is x=0.40, y=0.39. This places the white light in the warm white region of the color space.
• Zener Protection: The device incorporates a Zener diode for reverse voltage protection, with a typical reverse voltage (V_Z) of 5.2 V at a test current of 5 mA.
• Reverse Current (I_R): The maximum reverse leakage current is 50 μA when 5 V is applied in reverse bias.

3. Binning System Explanation

To ensure consistency in brightness, forward voltage, and color, the LEDs are sorted into specific bins. This allows designers to select parts that meet the precise requirements of their application.

3.1 Luminous Intensity Binning

LEDs are categorized into four primary bins based on their luminous intensity measured at 20 mA. The tolerance within each bin is ±10%.

• Bin P: 2850 mcd (Min) to 3600 mcd (Max)
• Bin Q: 3600 mcd to 4500 mcd
• Bin R: 4500 mcd to 5650 mcd
• Bin S: 5650 mcd to 7150 mcd

3.2 Forward Voltage Binning

Forward voltage is also binned to aid in circuit design, particularly for applications sensitive to voltage drop or power consumption. The measurement uncertainty is ±0.1V.

• Bin 0: 2.8 V to 3.0 V
• Bin 1: 3.0 V to 3.2 V
• Bin 2: 3.2 V to 3.4 V
• Bin 3: 3.4 V to 3.6 V

3.3 Color Binning (Chromaticity)

The color output is tightly controlled and divided into specific regions on the CIE 1931 chromaticity diagram. The defined color ranks are D1, D2, E1, E2, F1, and F2. These groups represent different quadrangles within the warm white spectrum, with F1/F2 being the warmest (lowest correlated color temperature) and D1/D2 being relatively cooler. The measurement uncertainty for the color coordinates is ±0.01. The datasheet groups these into a single selection group (Group 1: D1+D2+E1+E2+F1+F2), indicating all these color ranks are available for this product series.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This spectral distribution curve shows the relative intensity of light emitted across different wavelengths. For a warm white LED, the curve will typically show a dominant peak in the blue region (from the InGaN chip) and a broader peak or plateau in the yellow/red region (from the phosphor conversion). The exact shape defines the color rendering properties of the LED.

4.2 Directivity Pattern

The directivity curve plots relative intensity against the radiation angle, visually confirming the 50-degree typical viewing angle. It shows how the light intensity decreases as you move away from the central axis (0 degrees).

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve shows the exponential relationship between current and voltage for a diode. It is crucial for determining the operating point and for designing current-limiting circuits or constant-current drivers.

4.4 Relative Intensity vs. Forward Current

This graph demonstrates how the light output (relative intensity) increases with the forward current. It is generally linear over a range but may saturate at higher currents due to thermal and efficiency droop effects.

4.5 Chromaticity Coordinate vs. Forward Current

This curve is important for color-critical applications. It shows how the color point (x, y coordinates) may shift as the driving current changes. A stable color point across current levels is desirable.

4.6 Forward Current vs. Ambient Temperature

This derating curve indicates the maximum allowable forward current as the ambient temperature increases. To prevent overheating and ensure reliability, the maximum current must be reduced when operating at high temperatures.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED uses a standard T-1 3/4 round package. Key dimensional notes include:

• All dimensions are in millimeters (mm).
• The general tolerance is ±0.25 mm unless otherwise specified.
• Lead spacing is measured at the point where the leads emerge from the package body.
• The maximum protrusion of the resin under the flange is 1.5 mm.

A detailed dimensioned drawing is provided in the datasheet, specifying the overall diameter, lead length and diameter, seating plane, and optical lens geometry.

6. Soldering and Assembly Guidelines

Proper handling is essential to maintain LED performance and reliability.

6.1 Lead Forming

• Bending should occur at a point at least 3 mm from the base of the epoxy bulb.
• Form leads before soldering the component.
• Avoid applying stress to the LED package during bending, as this can damage internal connections or crack the epoxy.
• Cut leads at room temperature. High-temperature cutting can induce failures.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

6.2 Storage Conditions

• Recommended storage: ≤30°C and ≤70% Relative Humidity.
• Shelf life under these conditions is 3 months from shipment.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

• Maintain a distance of more than 3 mm from the solder joint to the epoxy bulb.
• It is recommended to solder only up to the base of the tie bar on the leadframe.
• Adhere to the maximum soldering temperature of 260°C for 5 seconds.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage.

• Primary Packing: Anti-electrostatic bags.
• Quantity: 200 to 500 pieces per bag.
• Secondary Packing: 5 bags are placed into one inner carton.
• Tertiary Packing: 10 inner cartons are packed into one master (outside) carton.

7.2 Label Explanation

Labels on the packaging contain key information:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number.
• QTY: Quantity of pieces in the package.
• CAT: Code for the combined Luminous Intensity and Forward Voltage bin.
• HUE: Color Rank code (e.g., D1, F2).
• REF: Reference information.
• LOT No: Manufacturing lot number for traceability.

7.3 Model Number Designation

The part number follows a structured format: 334-15/X2C5-□ □ □ □. The blank spaces (□) correspond to specific codes for selecting the desired Color Group, Luminous Intensity Bin, and Forward Voltage Group. This allows users to specify the exact performance characteristics required for their application.

8. Application Suggestions and Design Considerations

8.1 Typical Applications

This high-brightness warm white LED is well-suited for:

• Message and Information Panels: Where high contrast and readability are needed.
• Optical Status Indicators: In consumer electronics, industrial equipment, and automotive dashboards.
• Backlighting: For small LCD displays, membrane switches, or decorative panels.
• Marker and Position Lights: Providing illumination or signaling.

8.2 Design Considerations

• Current Driving: Always use a constant-current driver or a appropriate current-limiting resistor based on the forward voltage bin (V_F) and the supply voltage. Do not exceed the absolute maximum ratings.
• Thermal Management: Although power dissipation is relatively low (110 mW), ensure adequate heat sinking or airflow in high ambient temperature environments, especially if driving near the maximum current. Refer to the forward current vs. ambient temperature derating curve.
• Optical Design: The 50-degree viewing angle provides a fairly broad beam. For focused light, secondary optics (lenses) may be required.
• ESD Protection: While the device has a 4kV HBM rating, standard ESD handling precautions should be followed during assembly.
• Color Consistency: For applications requiring uniform color appearance, specify a tight color bin (HUE) and ensure all LEDs in an array are from the same or adjacent bins.

9. Technical Comparison and Differentiation

This LED differentiates itself primarily through its combination of a classic, widely adopted T-1 3/4 package with high luminous intensity suitable for warm white emission. Compared to smaller SMD LEDs, the through-hole design can be advantageous for prototyping, manual assembly, or applications requiring higher single-point brightness. The inclusion of a Zener diode for reverse voltage protection is a notable feature that enhances robustness in circuit designs where reverse voltage spikes might occur. The detailed and multi-parameter binning system (intensity, voltage, color) offers designers a high degree of control over the final product's performance and consistency, which is critical in batch production.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What driver circuit is recommended?

A simple series resistor is sufficient for basic indicator use. Calculate the resistor value as R = (V_supply - V_F) / I_F. Use the maximum V_F from the bin (e.g., 3.6V for Bin 3) to ensure current does not exceed 20mA under worst-case conditions. For optimal stability and efficiency, especially in arrays or at higher currents, a constant-current driver is recommended.

10.2 How does temperature affect performance?

As ambient temperature rises, the LED's forward voltage decreases slightly, but its internal efficiency can drop, reducing light output for the same current. More critically, excessive temperature can degrade the LED's lifespan. Always consult the Forward Current vs. Ambient Temperature derating curve and ensure the junction temperature remains within safe limits through proper thermal design.

10.3 Can I use this for color-mixing applications?

This is a phosphor-converted warm white LED, not a monochromatic one. It is not designed for RGB color mixing. For color mixing, dedicated red, green, and blue (RGB) LEDs should be used.

10.4 What is the purpose of the Zener voltage specification?

The Zener diode is integrated across the LED for protection. If a reverse voltage exceeding approximately 5.2V is accidentally applied, the Zener diode will conduct, clamping the voltage and potentially protecting the LED junction from damage. The Zener reverse current (I_Z) rating of 100 mA indicates its current-handling capability in this protective role.

11. Design and Usage Case Study

Scenario: Designing a High-Visibility Status Indicator for Industrial Equipment.

An engineer needs a bright, reliable status light for a machine operating in a well-lit factory environment. The light must be clearly visible from various angles and have a warm, distinct color. They select this LED in Bin S (highest intensity, 5650-7150 mcd) and Color Rank F1/F2 for a warm appearance. They design a PCB with a 12V supply rail. Using the maximum V_F of 3.6V and target I_F of 20mA, they calculate a series resistor: R = (12V - 3.6V) / 0.02A = 420Ω. A standard 430Ω, 1/4W resistor is chosen. They follow the assembly guidelines, bending leads 4mm from the body before insertion. The final indicator provides excellent visibility even in ambient light, and the consistent binning ensures all units on the production line look identical.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor. The core is an InGaN (Indium Gallium Nitride) chip. When a forward voltage is applied, electrons and holes recombine within the chip's active region, releasing energy in the form of photons. The specific composition of the InGaN alloy causes this emission to be in the blue wavelength range. To create white light, the blue light is directed onto a phosphor coating inside the reflector cup. The phosphor absorbs a portion of the blue photons and re-emits light at longer, yellow and red wavelengths. The mixture of the remaining blue light and the phosphor-converted yellow/red light is perceived by the human eye as warm white light. The exact shade (correlated color temperature) is determined by the phosphor composition and concentration.

13. Technology Trends and Context

While surface-mount device (SMD) LEDs dominate high-volume production due to their size and suitability for automated assembly, through-hole LEDs like this T-1 3/4 package remain relevant. Their key advantages include ease of manual soldering and prototyping, higher single-point brightness potential due to a larger package and chip, and robustness in certain harsh environments. The trend in white LED technology continues towards higher efficacy (more lumens per watt), improved color rendering index (CRI), and greater color consistency. The integration of protection features like Zener diodes, as seen in this device, reflects a focus on improving reliability and simplifying end-circuit design. Furthermore, compliance with environmental regulations (RoHS, REACH, Halogen-Free) is now a standard requirement, driven by global sustainability initiatives.