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LTS-313AJD LED Display Datasheet - 0.3-inch Digit Height - Hyper Red Color - 2.6V Forward Voltage - English Technical Document

Technical datasheet for a 0.3-inch single-digit seven-segment LED display with AlInGaP Hyper Red chips, featuring high brightness, low power, and wide viewing angle.
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PDF Document Cover - LTS-313AJD LED Display Datasheet - 0.3-inch Digit Height - Hyper Red Color - 2.6V Forward Voltage - English Technical Document

1. Product Overview

This document details the specifications for a compact, single-digit, seven-segment alphanumeric display module. The device is engineered for applications requiring clear, bright numeric indication with minimal power consumption. Its core design philosophy centers on providing excellent readability and reliability in a small form factor.

The display utilizes advanced semiconductor materials to achieve its characteristic output. It is categorized for consistent luminous intensity, ensuring uniformity in batch production and predictable performance in end-user applications.

1.1 Core Advantages and Target Market

The primary advantages of this display include its very low current requirement, which makes it suitable for battery-powered or energy-sensitive circuits. The high brightness and contrast ratio, combined with a wide viewing angle, ensure legibility under various lighting conditions and from different perspectives. The solid-state construction offers inherent reliability and long operational life compared to mechanical or filament-based displays.

Its 0.3-inch digit height positions it ideally for portable instruments, consumer electronics, panel meters, industrial control interfaces, and any embedded system where space is at a premium but clear numeric feedback is essential. The continuous, uniform segment design contributes to an excellent character appearance, enhancing user experience.

2. Technical Specifications Deep Dive

This section provides an objective and detailed analysis of the electrical, optical, and physical parameters defined in the datasheet.

2.1 Photometric and Optical Characteristics

The light-emitting elements are based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor technology, specifically in a Hyper Red color formulation. This material system is known for high efficiency and good temperature stability in the red-orange wavelength region.

2.2 Electrical Parameters

The electrical characteristics define the operating boundaries and typical conditions for the device.

2.3 Thermal and Environmental Ratings

3. Binning System Explanation

The datasheet explicitly states the device is \"categorized for luminous intensity.\" This refers to a common practice in LED manufacturing known as \"binning.\"

Due to inherent minor variations in the semiconductor epitaxial growth and fabrication process, LEDs from the same production batch can have slight differences in key parameters like luminous intensity and forward voltage. To ensure consistency for customers, manufacturers test each LED and sort them into different performance groups or \"bins.\" A product categorized for luminous intensity means the units are guaranteed to meet the specified intensity range (200-600 μcd in this case), and often, tighter bins within that range can be requested for high-uniformity applications. While not detailed in this brief datasheet, other common binning parameters can include dominant wavelength (for color consistency) and forward voltage.

4. Performance Curve Analysis

The datasheet references typical characteristic curves. While the specific graphs are not provided in the text, we can infer their standard content and significance based on the parameters listed.

4.1 Current vs. Voltage (I-V) Curve

A typical I-V curve would show the exponential relationship between forward current and forward voltage. The curve would pass through the typical VF point of 2.1V at 20mA. This curve is essential for designing the current-limiting circuitry, whether using a simple resistor or a constant-current driver.

4.2 Luminous Intensity vs. Forward Current (IV vs. IF)

This graph would show how brightness increases with current. It is typically linear over a range but will saturate at higher currents due to thermal and efficiency droop. The curve would show the intensity at the test condition of 1mA and illustrate performance up to the maximum continuous current.

4.3 Temperature Dependence

Characteristic curves noted at temperatures other than 25°C would illustrate key dependencies:

4.4 Spectral Distribution

A spectral plot would visualize the emitted light's power distribution across wavelengths, centered around 650nm (peak) with a 20nm half-width, confirming the Hyper Red color point.

5. Mechanical and Package Information

The device has a gray face with white segments, which enhances contrast by reducing ambient light reflection. The package dimensions are provided in millimeters with a standard tolerance of ±0.25mm. The exact footprint and pin spacing are critical for PCB layout. The internal circuit diagram confirms a common cathode configuration for all segments and the decimal points. This means all the cathodes (negative terminals) of the LED segments are connected internally to common pins (1 and 6), while each segment anode (positive terminal) has its own dedicated pin. This configuration is common and simplifies multiplexing in microcontroller-driven applications.

6. Pin Connection and Circuit Interface

The 10-pin device has the following pinout:

  1. Common Cathode
  2. Anode F (Top segment)
  3. Anode G (Center segment)
  4. Anode E (Bottom-left segment)
  5. Anode D (Bottom segment)
  6. Common Cathode (tied internally to pin 1)
  7. Anode RDP (Right Decimal Point)
  8. Anode C (Bottom-right segment)
  9. Anode B (Top-right segment)
  10. Anode A (Top segment)

Note: The datasheet also mentions \"Rt. and Lt. Hand Decimal,\" indicating the device includes both right and left decimal points, though only the right decimal point (RDP) anode is listed in the pin connection table. The left decimal point is likely internally connected to another segment anode or is not separately accessible in this version. The common cathode connection on pins 1 and 6 allows for flexibility in PCB routing and heat dissipation.

7. Soldering and Assembly Guidelines

The key guideline provided is the solder temperature limit: 260°C maximum for 3 seconds at 1.6mm below the seating plane. This aligns with standard IPC guidelines for through-hole components. For wave soldering, this means controlling preheat and contact time. For manual soldering, a temperature-controlled iron should be used to avoid prolonged heat application. Standard ESD (Electrostatic Discharge) precautions should be observed during handling, as LEDs are sensitive to static electricity. Storage should be within the specified temperature range in a low-humidity environment.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

8.2 Design Considerations

9. Technical Comparison and Differentiation

Compared to older technologies like incandescent or vacuum fluorescent displays (VFDs), this LED display offers significantly lower power consumption, longer lifespan, and higher shock/vibration resistance. Within the LED display family, the use of AlInGaP for Hyper Red offers advantages over older GaAsP red LEDs, typically providing higher efficiency (more light per mA), better temperature stability, and a more saturated red color. The 0.3-inch size is smaller than common 0.5-inch or 0.56-inch displays, offering higher density or more compact designs. The low current requirement (effective even at 1mA) is a key differentiator for power-constrained designs compared to displays requiring 5-20mA per segment for standard brightness.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the purpose of the two common cathode pins (1 and 6)?

They are internally connected. Providing two pins allows for better current distribution, reduces the current density per pin, aids in PCB layout flexibility (routing from either side), and can improve heat dissipation from the die.

10.2 Can I drive this display directly from a microcontroller pin?

You can connect the segment anodes to microcontroller output pins, but you must include a current-limiting resistor in series with each pin. The microcontroller pin alone cannot safely limit the current. Furthermore, the common cathode current (up to 25mA x number of lit segments) will likely exceed a single microcontroller pin's sink capability, requiring an external transistor or driver IC (like a ULN2003) to switch the cathode.

10.3 What does \"Hyper Red\" mean compared to standard Red?

\"Hyper Red\" is a marketing term often used for AlInGaP LEDs with a dominant wavelength around 630-640nm. It appears as a deeper, more orange-tinted red compared to the slightly longer wavelength (660-670nm) \"Deep Red\" or the shorter, more orange standard \"Red\" (620-625nm). It offers a good balance of visual brightness and color distinction.

10.4 How do I achieve uniform brightness across all digits in a multi-digit design?

Use the multiplexing technique and ensure the current-limiting resistors are identical for all corresponding segments across digits. The intensity matching ratio specification (2:1 max) on the datasheet helps, but for best results, use LEDs from the same production bin or implement software brightness calibration if your driver allows pulse-width modulation (PWM).

11. Design and Usage Case Example

Scenario: Designing a simple 3-digit voltmeter display.

  1. Circuit Topology: Use three LTS-313AJD displays in a multiplexed configuration. The segment anodes (A-G, DP) of all three displays are connected in parallel. Each display's common cathode pins are connected to a separate NPN transistor (e.g., 2N3904) collector, with the emitter to ground. The transistor base is driven by a microcontroller pin via a base resistor.
  2. Microcontroller Role: An ADC reads the voltage. The firmware converts the value to three digits. It then enters a fast loop: it turns off all cathode transistors, outputs the segment pattern for Digit 1 to the parallel anode lines (through series resistors), turns on the cathode transistor for Digit 1, waits a short time (e.g., 2ms), then repeats for Digit 2 and Digit 3. The cycle repeats fast enough (e.g., >60Hz) to appear as a steady, flicker-free display.
  3. Calculations: If each segment is driven at 5mA during its active time, and three segments are lit per digit (e.g., showing \"1\"), the peak current per segment is 5mA. The average current per segment is 5mA / 3 (for 3-digit multiplex) ≈ 1.67mA, which is well within limits and conserves power. The cathode transistor must sink 3 segments * 5mA = 15mA, which is easily handled.

12. Operational Principle Introduction

A seven-segment LED display is an array of light-emitting diodes arranged in a figure-eight pattern. Each diode (segment) is a p-n junction semiconductor device. When a forward voltage exceeding the junction's threshold (approximately 2.1V for this AlInGaP type) is applied, electrons and holes recombine in the active region, releasing energy in the form of photons (light). The specific wavelength (color) of the light is determined by the bandgap energy of the semiconductor material, which is engineered in the AlInGaP compound. By selectively applying current to different combinations of the seven segments (A through G), the numerals 0-9 and some letters can be formed. The common cathode configuration internally connects all the negative sides of these diodes, simplifying external control.

13. Technology Trends and Context

Discrete seven-segment LED displays like this one represent a mature and reliable technology. Current trends in display technology are moving towards higher integration, such as multi-digit modules with built-in controllers (e.g., TM1637 or MAX7219 drivers) that communicate via I2C or SPI, drastically reducing the microcontroller I/O and software overhead. There is also a shift towards organic LED (OLED) and flexible displays for more complex graphics. However, for simple, bright, low-cost, and low-power numeric indication in harsh environments (wide temperature range, high brightness required), discrete LED segments remain a dominant and optimal solution. The ongoing development in LED materials, like more efficient AlInGaP and InGaN (for blue/green), continues to improve the efficiency, brightness, and color options for such displays.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.