Table of Contents
- 1. Product Overview
- 2. Technical Parameters Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics (Ts=25°C)
- 3. Binning System Explanation
- 3.1 Luminous Flux Binning
- 3.2 Forward Voltage Binning
- 3.3 Chromaticity Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Forward Current vs. Relative Luminous Flux
- 4.3 Junction Temperature vs. Relative Spectral Power
- 4.4 Relative Spectral Power Distribution
- 5. Mechanical & Packaging Information
- 5.1 Outline Dimensions
- 5.2 Pad Layout & Stencil Design
- 6. Soldering & Assembly Guidelines
- 6.1 Moisture Sensitivity & Baking
- 6.2 Storage Conditions
- 6.3 Reflow Soldering Profiles
- 7. Application Notes & Design Considerations
- 7.1 ESD (Electrostatic Discharge) Protection
- 7.2 Circuit Design
- 7.3 Handling Precautions
- 8. Model Numbering Rule
- 9. Typical Application Scenarios
- 10. FAQ Based on Technical Parameters
- 10.1 What is the recommended operating current?
- 10.2 Why is baking necessary before soldering?
- 10.3 How do I select the correct voltage bin for my design?
- 10.4 Can I drive this LED with a 3.3V or 5V supply directly?
1. Product Overview
The 3020 series is a compact, high-performance surface-mount device (SMD) LED designed primarily for backlighting applications. This single-chip, 0.2W white LED offers a balance of efficiency, reliability, and cost-effectiveness, making it suitable for a wide range of consumer electronics, signage, and indicator applications where consistent white light output is required.
2. Technical Parameters Deep Dive
2.1 Absolute Maximum Ratings
The following parameters define the operational limits of the LED. Exceeding these values may cause permanent damage.
- Forward Current (IF): 90 mA (Continuous)
- Forward Pulse Current (IFP): 120 mA (Pulse width ≤10ms, Duty cycle ≤1/10)
- Power Dissipation (PD): 297 mW
- Operating Temperature (Topr): -40°C to +80°C
- Storage Temperature (Tstg): -40°C to +80°C
- Junction Temperature (Tj): 125°C
- Soldering Temperature (Tsld): 230°C or 260°C for 10 seconds (Reflow)
2.2 Electro-Optical Characteristics (Ts=25°C)
These are the typical performance parameters under standard test conditions.
- Forward Voltage (VF): 3.2 V (Typical), 3.4 V (Maximum) at IF=60mA
- Reverse Voltage (VR): 5 V
- Reverse Current (IR): 10 μA (Maximum)
- Viewing Angle (2θ1/2): 110° (Typical)
3. Binning System Explanation
To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.
3.1 Luminous Flux Binning
For the Cool White variant with a Color Rendering Index (CRI) of 80+, the luminous flux is measured at a forward current of 60mA.
- Code C9: 16 lm (Min) to 17 lm (Max)
- Code D1: 17 lm (Min) to 18 lm (Max)
Tolerance for luminous flux measurement is ±7%.
3.2 Forward Voltage Binning
LEDs are also binned according to their forward voltage drop at a specified current.
- Code B: 2.8 V to 2.9 V
- Code C: 2.9 V to 3.0 V
- Code D: 3.0 V to 3.1 V
- Code E: 3.1 V to 3.2 V
- Code F: 3.2 V to 3.3 V
- Code G: 3.3 V to 3.4 V
Tolerance for voltage measurement is ±0.08V.
3.3 Chromaticity Binning
The document defines specific chromaticity regions (e.g., Wa, Wb, Wc...) with coordinate boundaries (x, y) on the CIE 1931 diagram for color temperatures in the 10000-20000K range. This ensures LEDs from the same bin will have nearly identical perceived color. The allowable coordinate error is ±0.005.
4. Performance Curve Analysis
4.1 Forward Current vs. Forward Voltage (I-V Curve)
The I-V curve shows the relationship between the current flowing through the LED and the voltage across it. It is non-linear, characteristic of a diode. The typical forward voltage (Vf) is specified at 60mA. Designers use this curve to select appropriate current-limiting resistors or design constant-current drivers.
4.2 Forward Current vs. Relative Luminous Flux
This curve illustrates how light output increases with forward current. While output rises with current, efficiency typically decreases at higher currents due to increased thermal effects. Operating at or near the recommended 60mA ensures optimal balance between brightness and longevity.
4.3 Junction Temperature vs. Relative Spectral Power
This graph demonstrates the effect of junction temperature on the LED's spectral output. As temperature increases, the spectral power distribution can shift, potentially affecting color point (especially for white LEDs) and overall light output. Proper thermal management is crucial to maintain consistent performance.
4.4 Relative Spectral Power Distribution
The spectral curve plots the intensity of light emitted at each wavelength. For this white LED, the curve shows a broad peak in the blue region (from the chip's primary emission) combined with a broader yellow-green region from the phosphor coating. The combined output results in white light. Different correlated color temperatures (CCTs) like 2600-3700K (Warm White), 3700-5000K (Neutral White), and 5000-10000K (Cool White) have distinct spectral shapes.
5. Mechanical & Packaging Information
5.1 Outline Dimensions
The LED package has nominal dimensions of 3.0mm (Length) x 2.0mm (Width) x 0.8mm (Height). Detailed mechanical drawings with tolerances are provided: .X dimensions have a tolerance of ±0.10mm, and .XX dimensions have a tolerance of ±0.05mm.
5.2 Pad Layout & Stencil Design
Detailed pad layout (footprint) and recommended stencil aperture drawings are supplied to guide PCB design and solder paste application for optimal soldering yield and reliability. Correct pad design is essential for self-alignment during reflow and strong mechanical bonding.
6. Soldering & Assembly Guidelines
6.1 Moisture Sensitivity & Baking
This LED series is classified as moisture-sensitive according to IPC/JEDEC J-STD-020C. If the original moisture barrier bag is opened and the components are exposed to ambient humidity, they must be baked before reflow soldering to prevent "popcorn" damage.
- Baking Condition: 60°C for 24 hours.
- Post-Baking: Solder within 1 hour or store in a dry environment (<20% RH).
- Do not bake at temperatures exceeding 60°C.
6.2 Storage Conditions
- Unopened Bag: Temperature 5-30°C, Humidity <85% RH.
- Opened Bag: Temperature 5-30°C, Humidity <60% RH. Store in a sealed container with desiccant or a nitrogen cabinet.
- Floor Life: Use within 12 hours after opening the bag.
6.3 Reflow Soldering Profiles
Recommended temperature profiles are provided for both lead-free and leaded solder processes. All temperatures refer to measurements on the top surface of the LED package body.
- Lead-Free Profile: Peak temperature typically 230°C or 260°C, with time above liquidus (TAL) controlled.
- Leaded Profile: Lower peak temperature, with corresponding TAL.
Adhering to these profiles prevents thermal shock and ensures reliable solder joints without damaging the LED's internal structure or silicone encapsulant.
7. Application Notes & Design Considerations
7.1 ESD (Electrostatic Discharge) Protection
White LEDs are sensitive to electrostatic discharge. ESD can cause immediate failure (dead LED) or latent damage leading to reduced brightness, color shift, and shortened lifespan.
Protection Measures:
- Use grounded anti-static workstations and floors.
- Operators must wear anti-static wrist straps, gloves, and garments.
- Use ionizers to neutralize static charges.
- Employ ESD-safe packaging and handling materials.
- Ensure soldering equipment is properly grounded.
7.2 Circuit Design
Proper electrical design is critical for LED performance and longevity.
- Drive Method: Constant current drivers are strongly recommended over constant voltage sources to ensure stable light output and protect the LED from current spikes.
- Current Limiting: When using a voltage source, a series resistor is mandatory for each LED string to limit current. The preferred circuit design places one resistor per string rather than sharing one resistor across multiple parallel strings, as this improves current matching and reliability.
- Polarity: Always observe correct anode/cathode polarity during assembly to prevent reverse bias damage.
- Power-Up Sequence: Connect the LED to the driver output first, then energize the driver input to avoid voltage transients.
7.3 Handling Precautions
Physical handling can damage the LED.
- Avoid Fingers: Do not handle the silicone lens with bare fingers, as oils and moisture can contaminate the surface, reducing light output.
- Avoid Tweezers: Do not squeeze the silicone body with tweezers, as this can crush the wire bonds or the chip, causing immediate failure.
- Correct Pick-Up: Use vacuum pick-up tools with nozzles appropriately sized to the package's inner diameter to avoid pressing on the soft silicone.
- Avoid Dropping: Dropping can bend the leads, making soldering difficult and causing placement issues.
- Post-Reflow: Do not stack PCBs directly on top of each other after soldering, as this can scratch the lenses and potentially crush the LEDs.
8. Model Numbering Rule
The product naming convention allows for precise identification of LED characteristics:
Format: T □□ □□ □ □ □ – □□□ □□
- Package Code (e.g., 34): 34 corresponds to the 3020 package size. Other codes exist for 285, 3014, 3030, 5050, 3528, etc.
- Chip Count Code: "S" denotes a single small-power chip (as in this 0.2W product).
- Color Code: "W" is used for Cool White (>5000K). Other codes: L (Warm White), C (Neutral White), R (Red), etc.
- Optics Code: "00" for no primary lens, "01" for with lens.
- Luminous Flux Bin Code: e.g., C9, D1.
- Forward Voltage Bin Code: e.g., B, C, D, E, F, G.
9. Typical Application Scenarios
The 3020 0.2W white LED is ideally suited for applications requiring thin, uniform backlighting with moderate brightness.
- LCD Backlighting: Edge-lit or direct-lit backlight units for small to medium-sized LCD displays in appliances, industrial controls, and automotive interiors.
- Signage & Decorative Lighting: Light guides and channel letters where consistent white illumination is needed.
- General Indicator Lighting: Status indicators, panel lighting, and decorative accents in electronic devices.
10. FAQ Based on Technical Parameters
10.1 What is the recommended operating current?
The technical parameters and binning data are specified at 60mA. This is the recommended typical operating current to balance brightness, efficiency, and long-term reliability. It should not exceed the absolute maximum of 90mA continuous current.
10.2 Why is baking necessary before soldering?
The LED package absorbs moisture from the air. During the rapid heating of reflow soldering, this moisture can vaporize instantly, creating internal pressure that can delaminate the package, crack the silicone, or break wire bonds, leading to failure. Baking removes this absorbed moisture.
10.3 How do I select the correct voltage bin for my design?
Choose a voltage bin that aligns with your driver's output voltage range. Using LEDs from a tighter voltage bin (e.g., all from bin "D") in a parallel configuration will result in better current sharing and more uniform brightness compared to mixing bins with different forward voltages.
10.4 Can I drive this LED with a 3.3V or 5V supply directly?
No. The forward voltage varies (2.8V to 3.4V per bins). Connecting it directly to a fixed voltage source like 3.3V could cause excessive current in some LEDs (those with lower Vf) and insufficient current in others (those with higher Vf). You must use a constant current driver or a series current-limiting resistor calculated for the specific supply voltage and LED forward voltage.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |