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3020 LED Chip Specification - Dimensions 3.0x2.0x0.8mm - Voltage 3.2V - Power 0.2W - White Backlight - English Technical Document

Complete technical datasheet for the 3020 series 0.2W white LED for backlight applications, including electrical, optical, thermal parameters, binning system, and handling guidelines.
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PDF Document Cover - 3020 LED Chip Specification - Dimensions 3.0x2.0x0.8mm - Voltage 3.2V - Power 0.2W - White Backlight - English Technical Document

1. Product Overview

The 3020 series is a compact, high-performance surface-mount device (SMD) LED designed primarily for backlighting applications. This single-chip, 0.2W white LED offers a balance of efficiency, reliability, and cost-effectiveness, making it suitable for a wide range of consumer electronics, signage, and indicator applications where consistent white light output is required.

2. Technical Parameters Deep Dive

2.1 Absolute Maximum Ratings

The following parameters define the operational limits of the LED. Exceeding these values may cause permanent damage.

2.2 Electro-Optical Characteristics (Ts=25°C)

These are the typical performance parameters under standard test conditions.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

3.1 Luminous Flux Binning

For the Cool White variant with a Color Rendering Index (CRI) of 80+, the luminous flux is measured at a forward current of 60mA.

Tolerance for luminous flux measurement is ±7%.

3.2 Forward Voltage Binning

LEDs are also binned according to their forward voltage drop at a specified current.

Tolerance for voltage measurement is ±0.08V.

3.3 Chromaticity Binning

The document defines specific chromaticity regions (e.g., Wa, Wb, Wc...) with coordinate boundaries (x, y) on the CIE 1931 diagram for color temperatures in the 10000-20000K range. This ensures LEDs from the same bin will have nearly identical perceived color. The allowable coordinate error is ±0.005.

4. Performance Curve Analysis

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve shows the relationship between the current flowing through the LED and the voltage across it. It is non-linear, characteristic of a diode. The typical forward voltage (Vf) is specified at 60mA. Designers use this curve to select appropriate current-limiting resistors or design constant-current drivers.

4.2 Forward Current vs. Relative Luminous Flux

This curve illustrates how light output increases with forward current. While output rises with current, efficiency typically decreases at higher currents due to increased thermal effects. Operating at or near the recommended 60mA ensures optimal balance between brightness and longevity.

4.3 Junction Temperature vs. Relative Spectral Power

This graph demonstrates the effect of junction temperature on the LED's spectral output. As temperature increases, the spectral power distribution can shift, potentially affecting color point (especially for white LEDs) and overall light output. Proper thermal management is crucial to maintain consistent performance.

4.4 Relative Spectral Power Distribution

The spectral curve plots the intensity of light emitted at each wavelength. For this white LED, the curve shows a broad peak in the blue region (from the chip's primary emission) combined with a broader yellow-green region from the phosphor coating. The combined output results in white light. Different correlated color temperatures (CCTs) like 2600-3700K (Warm White), 3700-5000K (Neutral White), and 5000-10000K (Cool White) have distinct spectral shapes.

5. Mechanical & Packaging Information

5.1 Outline Dimensions

The LED package has nominal dimensions of 3.0mm (Length) x 2.0mm (Width) x 0.8mm (Height). Detailed mechanical drawings with tolerances are provided: .X dimensions have a tolerance of ±0.10mm, and .XX dimensions have a tolerance of ±0.05mm.

5.2 Pad Layout & Stencil Design

Detailed pad layout (footprint) and recommended stencil aperture drawings are supplied to guide PCB design and solder paste application for optimal soldering yield and reliability. Correct pad design is essential for self-alignment during reflow and strong mechanical bonding.

6. Soldering & Assembly Guidelines

6.1 Moisture Sensitivity & Baking

This LED series is classified as moisture-sensitive according to IPC/JEDEC J-STD-020C. If the original moisture barrier bag is opened and the components are exposed to ambient humidity, they must be baked before reflow soldering to prevent "popcorn" damage.

6.2 Storage Conditions

6.3 Reflow Soldering Profiles

Recommended temperature profiles are provided for both lead-free and leaded solder processes. All temperatures refer to measurements on the top surface of the LED package body.

Adhering to these profiles prevents thermal shock and ensures reliable solder joints without damaging the LED's internal structure or silicone encapsulant.

7. Application Notes & Design Considerations

7.1 ESD (Electrostatic Discharge) Protection

White LEDs are sensitive to electrostatic discharge. ESD can cause immediate failure (dead LED) or latent damage leading to reduced brightness, color shift, and shortened lifespan.

Protection Measures:

7.2 Circuit Design

Proper electrical design is critical for LED performance and longevity.

7.3 Handling Precautions

Physical handling can damage the LED.

8. Model Numbering Rule

The product naming convention allows for precise identification of LED characteristics:

Format: T □□ □□ □ □ □ – □□□ □□

9. Typical Application Scenarios

The 3020 0.2W white LED is ideally suited for applications requiring thin, uniform backlighting with moderate brightness.

10. FAQ Based on Technical Parameters

10.1 What is the recommended operating current?

The technical parameters and binning data are specified at 60mA. This is the recommended typical operating current to balance brightness, efficiency, and long-term reliability. It should not exceed the absolute maximum of 90mA continuous current.

10.2 Why is baking necessary before soldering?

The LED package absorbs moisture from the air. During the rapid heating of reflow soldering, this moisture can vaporize instantly, creating internal pressure that can delaminate the package, crack the silicone, or break wire bonds, leading to failure. Baking removes this absorbed moisture.

10.3 How do I select the correct voltage bin for my design?

Choose a voltage bin that aligns with your driver's output voltage range. Using LEDs from a tighter voltage bin (e.g., all from bin "D") in a parallel configuration will result in better current sharing and more uniform brightness compared to mixing bins with different forward voltages.

10.4 Can I drive this LED with a 3.3V or 5V supply directly?

No. The forward voltage varies (2.8V to 3.4V per bins). Connecting it directly to a fixed voltage source like 3.3V could cause excessive current in some LEDs (those with lower Vf) and insufficient current in others (those with higher Vf). You must use a constant current driver or a series current-limiting resistor calculated for the specific supply voltage and LED forward voltage.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.