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Phototransistor PD204-6B/L3 Datasheet - 3mm Package - Peak Sensitivity 940nm - English Technical Document

Complete technical datasheet for the PD204-6B/L3 3mm phototransistor, featuring high speed, high sensitivity, and a 940nm peak wavelength. Includes specifications, characteristics, and application notes.
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PDF Document Cover - Phototransistor PD204-6B/L3 Datasheet - 3mm Package - Peak Sensitivity 940nm - English Technical Document

1. Product Overview

The PD204-6B/L3 is a high-speed, high-sensitivity silicon PIN photodiode housed in a standard 3mm plastic package. This device is spectrally matched to visible and infrared emitting diodes, with its peak sensitivity optimized for the 940nm wavelength, making it suitable for a variety of sensing applications requiring fast response and reliable performance.

Key advantages of this component include its fast response time, high photosensitivity, and small junction capacitance, which contribute to efficient signal detection. The product is compliant with RoHS and EU REACH regulations, and is manufactured as a lead-free (Pb-free) device.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device is designed to operate reliably within specified environmental and electrical limits. Exceeding these ratings may cause permanent damage.

2.2 Electro-Optical Characteristics

These parameters define the core performance of the phototransistor under standard test conditions (Ta=25°C).

Tolerances are specified as ±10% for luminous intensity, ±1nm for dominant wavelength, and ±0.1V for forward voltage in related applications.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions. These are essential for design engineers to predict performance in real-world scenarios.

3.1 Power Dissipation vs. Ambient Temperature

This curve shows the maximum allowable power dissipation decreasing as the ambient temperature increases above 25°C. Designers must derate the power handling capability accordingly to ensure long-term reliability.

3.2 Spectral Sensitivity

The spectral response curve confirms the device's peak sensitivity at 940nm and its useful range from approximately 760nm to 1100nm. It highlights the device's suitability for applications using common infrared LEDs.

3.3 Reverse Dark Current vs. Ambient Temperature

Dark current increases exponentially with temperature. This curve is critical for applications operating at elevated temperatures, as higher dark current contributes to noise and can affect the signal-to-noise ratio in low-light conditions.

3.4 Reverse Light Current vs. Irradiance (Ee)

This plot demonstrates the linear relationship between the generated photocurrent (IL) and the incident light intensity (irradiance) over a specified range. It confirms the device's predictable and linear photometric response.

3.5 Terminal Capacitance vs. Reverse Voltage

The junction capacitance (Ct) decreases with increasing reverse bias voltage. A lower capacitance is desirable for high-speed applications, and this curve helps select an optimal operating bias point.

3.6 Response Time vs. Load Resistance

This curve shows how the rise and fall times (tr/tf) are affected by the value of the external load resistor (RL). Faster response is achieved with smaller load resistances, but this trades off against signal amplitude.

4. Mechanical and Package Information

4.1 Package Dimension

The device uses a standard 3mm radial leaded package. The dimensional drawing specifies the body diameter, lead spacing, and lead dimensions. All unspecified tolerances are ±0.25mm. The lens color is black.

4.2 Polarity Identification

The cathode (negative terminal) is typically indicated by a flat spot on the package body or a longer lead. Correct polarity must be observed during circuit assembly for proper reverse-bias operation.

5. Soldering and Assembly Guidelines

The component is suitable for standard PCB assembly processes.

6. Packaging and Ordering Information

6.1 Packing Quantity Specification

The standard packing is as follows: 200-1000 pieces per bag, 4 bags per box, and 10 boxes per carton. This provides flexibility for both prototyping and volume production.

6.2 Label Form Specification

The product label contains key information for traceability and identification:

7. Application Suggestions

7.1 Typical Application Scenarios

The PD204-6B/L3 is well-suited for various optoelectronic sensing applications, including:

7.2 Design Considerations

8. Technical Comparison and Differentiation

Compared to standard photodiodes or phototransistors with slower response times, the PD204-6B/L3 offers distinct advantages:

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between operating in photovoltaic (zero bias) and photoconductive (reverse bias) mode?

In photovoltaic mode (V_R=0V), the photodiode generates a voltage (V_OC). This mode has zero dark current but slower response and less linearity. The PD204-6B/L3 specifications list VOC=0.42V. In photoconductive mode (with reverse bias, e.g., V_R=5V), an external voltage is applied. This reduces junction capacitance (enabling faster response, as seen in the 10ns tr/tf), improves linearity, and allows for a larger active region, but introduces dark current (I_D). For high-speed applications like those intended for this device, photoconductive mode is recommended.

9.2 How do I convert the photocurrent (I_L) into a measurable voltage?

The simplest method is to use a load resistor (R_L) in series. The output voltage is V_out = I_L * R_L. However, as R_L increases, the RC time constant (with the diode capacitance) increases, slowing the response (as shown in the Response Time vs. Load Resistance curve). For optimal performance, especially with small currents and need for speed, a transimpedance amplifier (TIA) is the preferred circuit. It provides a stable, low-impedance output voltage (V_out = -I_L * R_f) while keeping the photodiode at virtual ground, minimizing the effects of capacitance.

9.3 Why is the dark current important, and how does temperature affect it?

Dark current (I_D) is the noise current that flows when no light is present. It sets the lower limit of detectable light. The datasheet specifies a maximum of 10nA at 25°C. This current doubles approximately every 10°C rise in temperature. Therefore, in high-temperature environments or for very low-light detection, dark current can become a significant source of noise and must be accounted for in the circuit design (e.g., through temperature compensation or synchronous detection techniques).

9.4 Can this sensor be used with light sources other than 940nm?

Yes, but with reduced sensitivity. The spectral response curve shows significant sensitivity from 760nm to 1100nm. For example, it will respond to 850nm LEDs, but the generated photocurrent for the same light intensity will be lower than with a 940nm source. Always refer to the relative spectral sensitivity curve (if provided in full) or calculate responsivity at the desired wavelength for accurate design.

10. Practical Design Case Study

Design Case: Infrared Beam Break Sensor for Security Gate.

Objective: Create a reliable, fast sensor to detect when an object interrupts an invisible infrared beam, triggering a security alarm.

Implementation:

  1. Transmitter: A 940nm infrared LED is driven by a pulsed current (e.g., 20mA pulses at 38kHz) to provide immunity against ambient light and reduce average power consumption.
  2. Receiver: The PD204-6B/L3 is placed opposite the transmitter, aligned within its 45° view angle. It is reverse-biased at 5V through a load resistor.
  3. Signal Conditioning: The small AC photocurrent signal from the photodiode (superimposed on the DC dark current) is fed into a high-gain, band-pass amplifier tuned to 38kHz. This filters out DC ambient light and low-frequency noise.
  4. Detection: The amplified signal is then rectified and compared to a threshold. When the beam is unbroken, a strong 38kHz signal is present, and the comparator output is high. When an object breaks the beam, the signal disappears, causing the comparator to switch low and activate the alarm.

Why PD204-6B/L3 is Suitable: Its fast 10ns response time easily handles the 38kHz modulated signal. The high sensitivity at 940nm ensures a good signal-to-noise ratio from the matched IR LED. The low capacitance allows for a responsive circuit even with necessary filtering components.

11. Operating Principle

A PIN photodiode like the PD204-6B/L3 operates on the principle of the internal photoelectric effect. The device structure consists of a wide, lightly doped intrinsic (I) semiconductor region sandwiched between P-type and N-type regions. When photons with energy greater than the semiconductor's bandgap (e.g., infrared light at 940nm for silicon) strike the intrinsic region, they generate electron-hole pairs. When the diode is reverse-biased, the built-in electric field across the depletion region (which extends through the intrinsic layer) sweeps these charge carriers towards the respective terminals, generating a photocurrent (I_L) that is proportional to the incident light intensity. The wide intrinsic region reduces capacitance and allows for efficient collection of carriers generated over a larger volume, contributing to both speed and sensitivity.

12. Industry Trends and Context

Photodetectors like the PD204-6B/L3 are fundamental components in the growing field of optoelectronics and sensing. Current trends driving demand for such devices include:

13. Disclaimer and Usage Notes

Critical usage guidelines derived from the datasheet disclaimer include:

  1. Specifications are subject to change. Always refer to the latest official datasheet for design.
  2. The product meets its published specifications for 12 months from the date of shipment under normal storage conditions.
  3. Characteristic curves show typical performance, not guaranteed minimum or maximum values. Design with appropriate margins.
  4. Strictly adhere to the Absolute Maximum Ratings. Operation beyond these limits can cause immediate or latent failure. The manufacturer assumes no liability for damage resulting from misuse.
  5. The information is proprietary. Reproduction without permission is prohibited.
  6. This component is not designed or qualified for safety-critical applications such as medical life-support, automotive control, aviation, or military systems. For such applications, contact the manufacturer for specially qualified products.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.