1. Product Overview
The SIR333-A is a high-intensity 5mm Infrared (IR) Emitting Diode. It is molded in a blue plastic package and is designed for applications requiring reliable infrared emission. The device's spectral output is matched with common phototransistors, photodiodes, and infrared receiver modules, making it suitable for various sensing and transmission systems.
1.1 Core Features and Advantages
- High Reliability: Designed for consistent long-term performance.
- High Radiant Intensity: Delivers strong infrared output for effective signal transmission.
- Specific Wavelength: Peak emission wavelength (λp) of 875nm.
- Standard Lead Spacing: 2.54mm pin spacing for easy PCB mounting.
- Low Forward Voltage: Contributes to energy-efficient operation.
- Environmental Compliance: The product is Pb-Free, compliant with RoHS, EU REACH, and Halogen-Free standards (Br < 900ppm, Cl < 900ppm, Br+Cl < 1500ppm).
1.2 Target Applications
- Free air transmission systems.
- Infrared remote control units with high power requirements.
- Smoke detectors.
- General infrared applied systems.
2. Technical Specifications and Objective Interpretation
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.
| Parameter | Symbol | Rating | Unit | Notes |
|---|---|---|---|---|
| Continuous Forward Current | IF | 100 | mA | |
| Peak Forward Current | IFP | 1.0 | A | Pulse Width ≤100μs, Duty ≤1% |
| Reverse Voltage | VR | 5 | V | |
| Operating Temperature | Topr | -40 to +85 | °C | |
| Storage Temperature | Tstg | -40 to +100 | °C | |
| Soldering Temperature | Tsol | 260 | °C | Time ≤5 seconds |
| Power Dissipation (Ta=25°C) | Pd | 150 | mW |
2.2 Electro-Optical Characteristics
These are the typical performance parameters measured at an ambient temperature (Ta) of 25°C.
| Parameter | Symbol | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|---|
| Radiant Intensity | Ie | 7.8 | 20 | --- | mW/sr | IF=20mA |
| Radiant Intensity | Ie | --- | 90 | --- | mW/sr | IF=100mA (Pulsed) |
| Peak Wavelength | λp | --- | 875 | --- | nm | IF=20mA |
| Spectral Bandwidth | Δλ | --- | 80 | --- | nm | IF=20mA |
| Forward Voltage | VF | --- | 1.3 | 1.65 | V | IF=20mA |
| Forward Voltage | VF | --- | 1.4 | 1.8 | V | IF=100mA (Pulsed) |
| Reverse Current | IR | --- | --- | 10 | μA | VR=5V |
| View Angle (Half Angle) | 2θ1/2 | --- | 20 | --- | deg | IF=20mA |
Measurement Tolerances: Forward Voltage: ±0.1V, Radiant Intensity: ±10%, Peak Wavelength: ±1.0nm.
2.3 Thermal Considerations
The device's performance is temperature-dependent. The maximum power dissipation of 150mW is specified at or below 25°C free air temperature. As ambient temperature increases, the allowable power dissipation decreases, which must be considered in thermal design to ensure reliability and prevent overheating.
3. Binning System Explanation
The SIR333-A is available in different performance grades, or \"bins,\" based on its Radiant Intensity measured at a forward current (IF) of 20mA. This allows designers to select a component that precisely matches their application's sensitivity requirements.
| Bin Number | M | N | P | Q | R |
|---|---|---|---|---|---|
| Min. Intensity (mW/sr) | 7.8 | 11 | 15 | 21 | 30 |
| Max. Intensity (mW/sr) | 12.5 | 17.6 | 24 | 34 | 48 |
There is no separate binning indicated for forward voltage or peak wavelength in the provided data; typical values are used.
4. Performance Curve Analysis
4.1 Forward Current vs. Ambient Temperature
This curve shows the derating of the maximum allowable continuous forward current as the ambient temperature rises above 25°C. Designers must reference this graph to avoid exceeding safe operating limits in elevated temperature environments.
4.2 Spectral Distribution
The graph plots relative radiant intensity against wavelength. It confirms the typical peak wavelength of 875nm and the spectral bandwidth of approximately 80nm (Full Width at Half Maximum). This narrow bandwidth is beneficial for minimizing interference from ambient light and matching optical filters in receivers.
3.3 Peak Emission Wavelength vs. Ambient Temperature
This characteristic shows how the peak wavelength shifts with temperature. Understanding this shift is crucial for applications where the receiver is tuned to a specific wavelength, as system performance may vary across the operating temperature range.
4.4 Forward Current vs. Forward Voltage (IV Curve)
The IV curve is fundamental for circuit design. It shows the non-linear relationship between current and voltage. The typical forward voltage is 1.3V at 20mA, but it increases with current and can vary between units. A current-limiting resistor or constant-current driver is essential.
4.5 Radiant Intensity vs. Forward Current
This plot demonstrates that radiant output increases with forward current, but not linearly. It highlights the significant gain in output when driving the LED at its maximum pulsed current (100mA) compared to the standard 20mA, which is useful for applications requiring longer range or higher signal strength.
4.6 Relative Radiant Intensity vs. Angular Displacement
This polar plot illustrates the view angle or emission pattern. The typical half-angle is 20 degrees, meaning the intensity drops to 50% of its on-axis value at ±20 degrees from the center. This defines the LED's beam width and is critical for aligning it with a receiver or sensor.
5. Mechanical and Package Information
5.1 Package Dimensions
The device is housed in a standard 5mm round LED package. Key dimensions include the overall diameter (5.0mm), the lead spacing (2.54mm), and the lead diameter. A detailed dimensioned drawing is provided in the datasheet for precise PCB footprint design. All unspecified tolerances are ±0.25mm.
5.2 Polarity Identification
The LED has a flat side on the rim of the package, which typically indicates the cathode (negative) lead. The longer lead is usually the anode (positive). Correct polarity must be observed during installation.
6. Soldering and Assembly Guidelines
6.1 Lead Forming
- Bend leads at a point at least 3mm from the base of the epoxy bulb.
- Perform lead forming before soldering.
- Avoid stressing the package during bending.
- Cut leads at room temperature.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
6.2 Soldering Parameters
Hand Soldering: Iron tip temperature: 300°C Max. (30W Max.). Soldering time: 3 sec Max. Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Wave/DIP Soldering: Preheat temperature: 100°C Max. (60 sec Max.). Solder bath temperature: 260°C Max., time: 5 sec Max. Distance from joint to bulb: 3mm Min.
General Rules: Avoid stress on leads at high temperature. Do not solder more than once. Protect the LED from shock while cooling. Avoid rapid cooling processes.
6.3 Cleaning
If necessary, clean only with isopropyl alcohol at room temperature for no more than one minute. Do not use ultrasonic cleaning, as it can damage the internal structure. If ultrasonic cleaning is unavoidable, extreme caution regarding power and assembly condition is required.
6.4 Storage Conditions
Store at 30°C or less and 70% Relative Humidity or less. The recommended storage life after shipping is 3 months. For longer storage (up to one year), use a sealed container with a nitrogen atmosphere and moisture absorbent material. Avoid rapid temperature transitions in humid environments to prevent condensation.
7. Packaging and Ordering Information
7.1 Label Specification
The product label includes several codes: CPN (Customer's Product Number), P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank/Bin), HUE (Dominant Wavelength Rank), REF (Forward Voltage Rank), LOT No. (Lot Number), and a date code (Month).
7.2 Packing Quantities
- 200 to 500 pieces per bag.
- 5 bags per inner carton.
- 10 inner cartons per master (outside) carton.
8. Application Suggestions
8.1 Typical Application Circuits
For basic operation, the LED should be driven with a series current-limiting resistor. The resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - VF) / IF, where VF is the forward voltage from the datasheet (use max value for safety) and IF is the desired forward current (e.g., 20mA). For pulsed operation for longer range (e.g., in remote controls), a transistor switch driven by a microcontroller can be used to provide the high peak current (up to 1A under specified duty cycle).
8.2 Design Considerations
- Optical Alignment: Use the 20-degree view angle to properly align the LED with the receiver's field of view.
- Current Drive: Always use a constant current or a current-limiting resistor. Connecting directly to a voltage source will destroy the LED.
- Thermal Management: Ensure the PCB and environment allow for adequate heat dissipation, especially if operating near maximum ratings.
- Receiver Matching: Choose a photodetector or receiver module whose peak sensitivity aligns with the 875nm emission of this LED.
- Ambient Light Immunity: For systems used in environments with varying light, consider modulating the IR signal and using a receiver with a matching modulation frequency to reject ambient noise.
9. Technical Comparison and Differentiation
The SIR333-A differentiates itself through its combination of high radiant intensity (up to 90 mW/sr pulsed) and a relatively narrow 20-degree view angle. This makes it particularly suitable for applications requiring directed, high-power IR beams, such as long-range remote controls or specific sensor applications. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) is also a key advantage for products targeting global markets. The availability in intensity bins allows for cost optimization based on performance needs.
10. Frequently Asked Questions (FAQs)
10.1 What is the difference between continuous and pulsed forward current ratings?
The continuous forward current (100mA) is the maximum current the LED can handle indefinitely at 25°C. The peak forward current (1.0A) is a much higher current it can tolerate only for very short pulses (≤100μs) at a very low duty cycle (≤1%). This allows for brief, high-intensity bursts of light for long-range transmission without overheating.
10.2 How do I select the correct current-limiting resistor?
Use the formula R = (Vsupply - VF) / IF. For a 5V supply and driving at 20mA, using the maximum VF of 1.65V: R = (5 - 1.65) / 0.02 = 167.5 Ohms. A standard 180 Ohm or 150 Ohm resistor would be a safe choice. Always calculate using the maximum VF to ensure the current does not exceed the desired limit.
10.3 Can I use this LED for data transmission?
Yes, its fast GaAlAs chip material allows it to be modulated at high speeds, suitable for IR data links. The high radiant intensity also supports longer link distances. The design must use appropriate driver circuitry to achieve the required modulation speed.
10.4 Why is the storage condition important?
The epoxy package can absorb moisture from the air. During the high-temperature soldering process, this trapped moisture can rapidly expand, causing internal cracks or delamination (\"popcorning\"), which can lead to immediate or latent failure. Proper storage minimizes this risk.
11. Practical Design and Usage Case
11.1 Case Study: Long-Range IR Remote Control
Objective: Design a remote control that works reliably from up to 15 meters in a typical living room environment.
Solution: Use the SIR333-A driven in pulsed mode. A microcontroller generates a 38kHz carrier signal modulated with the command data. A transistor switch drives the LED with pulses at the peak current of 1A (with ≤1% duty cycle). This high-intensity pulsed output provides the necessary signal strength for the longer range. The receiver module on the TV is tuned to 38kHz, providing excellent rejection of ambient light and noise.
12. Principle Introduction
An Infrared Light Emitting Diode (IR LED) is a semiconductor p-n junction diode that emits non-visible infrared light when electrically biased in the forward direction. Electrons recombine with holes within the device, releasing energy in the form of photons. The wavelength of the emitted light is determined by the energy bandgap of the semiconductor material. The SIR333-A uses Gallium Aluminum Arsenide (GaAlAs), which provides an efficient emission in the near-infrared spectrum around 875nm.
13. Development Trends
The general trend in IR LED technology is towards higher efficiency (more radiant output per electrical watt input), increased power density for longer-range applications, and smaller package sizes for integration into compact devices. There is also a focus on developing LEDs with specific, narrow wavelength peaks for advanced sensing applications (like gas sensing) and improving the speed of modulation for high-bandwidth optical communication (Li-Fi). The drive for environmental sustainability continues to push for broader adoption of halogen-free and other green manufacturing standards.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |