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LTP-2058AKD LED Display Datasheet - 2.3-inch (58.42mm) Height - 5x8 Dot Matrix - Hyper Red (650nm) - English Technical Document

Complete technical specifications for the LTP-2058AKD, a 2.3-inch 5x8 dot matrix LED display using AlInGaP Hyper Red technology. Includes electrical, optical, mechanical data, and application guidelines.
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PDF Document Cover - LTP-2058AKD LED Display Datasheet - 2.3-inch (58.42mm) Height - 5x8 Dot Matrix - Hyper Red (650nm) - English Technical Document

1. Product Overview

The LTP-2058AKD is a single-digit, alphanumeric display module designed for applications requiring clear, legible character output. Its core function is to visually represent ASCII or EBCDIC coded characters through a grid of individually addressable light-emitting diodes (LEDs).

Core Advantages & Target Market: The device's primary advantages include a substantial 2.3-inch (58.42 mm) character height for excellent visibility, a wide viewing angle provided by its single-plane design, and solid-state reliability inherent to LED technology. Its low power requirement and compatibility with standard character codes make it suitable for industrial control panels, instrumentation, point-of-sale terminals, and other embedded systems where durable, low-maintenance, and easily readable displays are needed.

2. Technical Specifications Deep Dive

This section provides an objective analysis of the device's key performance parameters as defined in the datasheet.

2.1 Photometric & Optical Characteristics

The optical performance is central to the display's function. The device utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material for its LED chips, which are fabricated on a non-transparent GaAs substrate. This technology is known for high efficiency in the red-orange spectrum.

2.2 Electrical Parameters

Understanding the electrical limits and operating points is essential for reliable circuit design.

2.3 Thermal Characteristics

Thermal management is implied through the derating specifications and temperature ranges.

3. Binning System Explanation

The datasheet indicates the device is \"categorized for luminous intensity.\" This refers to a binning process where manufactured units are sorted (binned) based on measured luminous intensity. This ensures designers can select parts with consistent brightness levels for their application, which is crucial for multi-digit displays where uniform appearance is desired. While specific bin codes are not listed in this document, typical bins would group LEDs with similar IV values.

4. Performance Curve Analysis

The datasheet references \"Typical Electrical/Optical Characteristic Curves.\" Although the specific graphs are not provided in the text, such curves typically include:

These curves are vital for designing efficient constant-current drivers and understanding performance under varying thermal conditions.

5. Mechanical & Package Information

The physical construction defines the form factor and assembly interface.

5.1 Pin Connection & Polarity

The 14-pin interface uses a multiplexed anode-column and cathode-row scheme for matrix addressing, which reduces the required driver pins from 40 (5x8) to 13 (5+8).

Pinout: Pin 1: Cathode Row 6 Pin 2: Cathode Row 8 Pin 3: Anode Column 2 Pin 4: Anode Column 3 Pin 5: Cathode Row 5 Pin 6: Anode Column 5 Pin 7: Cathode Row 7 Pin 8: Cathode Row 3 Pin 9: Cathode Row 1 Pin 10: Anode Column 4 Pin 11: Anode Column 3 (Note: Duplicate function as Pin 4, likely a typo or specific internal connection) Pin 12: Cathode Row 4 Pin 13: Anode Column 1 Pin 14: Cathode Row 2

Internal Circuit: The internal diagram shows a common matrix configuration where each LED dot is formed at the intersection of an anode column line and a cathode row line. To illuminate a specific dot, its corresponding anode pin must be driven high (with current limiting) while its corresponding cathode pin is driven low.

6. Soldering & Assembly Guidelines

The key assembly specification provided is the soldering temperature profile: the device can withstand a peak temperature of 260°C for 3 seconds, measured 1/16 inch (1.6mm) below the seating plane. This is a standard wave or reflow soldering condition. Designers should ensure their PCB assembly process adheres to this limit to prevent package damage or LED degradation.

Storage Conditions: Components should be stored within the specified storage temperature range of -35°C to +85°C in a dry environment, typically in moisture-sensitive device (MSD) bags if required.

7. Application Suggestions

7.1 Typical Application Scenarios

7.2 Design Considerations

8. Technical Comparison & Differentiation

Compared to older technologies like incandescent or vacuum fluorescent displays (VFDs), this LED matrix offers:

Compared to modern graphic OLED or TFT modules, it is:

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: How do I calculate the appropriate current-limiting resistor for a single dot? A: Use Ohm's Law: R = (Vsupply - VF) / IF. For example, with a 5V supply, a typical VF of 2.6V at 20mA: R = (5 - 2.6) / 0.02 = 120 Ω. Always use the maximum VF from the datasheet for a conservative design to ensure current doesn't exceed limits.

Q2: What does \"1/16 DUTY\" mean in the test condition for luminous intensity? A: It means the measurement was taken with the LED pulsed on for 1/16th of the total scan cycle time. In a multiplexed 5x8 matrix, a common scanning scheme activates one row at a time. If all 8 rows are scanned, each row is active for 1/8 duty cycle. The 1/16 duty suggests a different scanning pattern or a measurement condition where the peak pulse current is higher, and the average power is kept within limits. The actual operating duty cycle depends on the driver design.

Q3: Can I connect these displays in parallel to make a multi-digit unit? A: They are designed to be stacked horizontally, meaning you place multiple units next to each other on a PCB. You cannot simply connect the pins in parallel because each unit contains a full 5x8 matrix. Each display requires its own set of column drivers, while the row drivers can often be shared across all units in a multi-digit design to simplify the scanning circuitry.

Q4: Why is the dominant wavelength (639nm) different from the peak wavelength (650nm)? A: This is due to the spectral response of the human eye. The LED emits light across a range of wavelengths centered at 650nm (peak). However, the human eye is more sensitive to wavelengths around 555nm (green) and less sensitive to deep red. The dominant wavelength is calculated by finding the single wavelength of pure monochromatic light that would appear to have the same color as the LED's broad spectrum output to a standard human observer. It's the \"perceived\" color point.

10. Operating Principle Introduction

The LTP-2058AKD is an active matrix LED display. Its fundamental principle is electroluminescence from a semiconductor P-N junction. When a forward voltage exceeding the diode's threshold is applied across an anode (column) and cathode (row), electrons and holes recombine in the active AlInGaP layer, releasing energy in the form of photons (light) at a wavelength determined by the material's bandgap. The 5x8 matrix arrangement allows any of the 40 dots to be individually addressed by selecting the correct combination of one column (power source) and one row (ground path). Multiplexing scans through rows rapidly, turning on the necessary columns for each row, to create the illusion of a stable, fully lit character.

11. Technology Trends

While discrete LED dot matrix displays like the LTP-2058AKD remain relevant for specific rugged or cost-sensitive applications, the broader trend in display technology is towards higher integration and functionality. Surface-mount device (SMD) LED arrays and integrated LED driver modules are becoming more common. Furthermore, for applications requiring graphics or more complex characters, segmented LED displays, OLEDs, and small TFT LCDs offer greater flexibility. The principle of matrix addressing remains fundamental, but implementation moves towards chip-on-board (COB) designs and interfaces like I2C or SPI, reducing the component count and simplifying system design compared to direct GPIO matrix driving.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.