1. Product Overview
The LTP-2058AKD is a single-digit, alphanumeric display module designed for applications requiring clear, legible character output. Its core function is to visually represent ASCII or EBCDIC coded characters through a grid of individually addressable light-emitting diodes (LEDs).
Core Advantages & Target Market: The device's primary advantages include a substantial 2.3-inch (58.42 mm) character height for excellent visibility, a wide viewing angle provided by its single-plane design, and solid-state reliability inherent to LED technology. Its low power requirement and compatibility with standard character codes make it suitable for industrial control panels, instrumentation, point-of-sale terminals, and other embedded systems where durable, low-maintenance, and easily readable displays are needed.
2. Technical Specifications Deep Dive
This section provides an objective analysis of the device's key performance parameters as defined in the datasheet.
2.1 Photometric & Optical Characteristics
The optical performance is central to the display's function. The device utilizes AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor material for its LED chips, which are fabricated on a non-transparent GaAs substrate. This technology is known for high efficiency in the red-orange spectrum.
- Luminous Intensity (IV): The average luminous intensity per dot is specified with a minimum of 1650 µcd, typical of 3500 µcd, under a test condition of Ip=32mA and 1/16 duty cycle. This parameter defines the brightness of each individual LED dot.
- Wavelength Characteristics:
- Peak Emission Wavelength (λp): 650 nm (nanometers). This is the wavelength at which the LED emits the most optical power.
- Dominant Wavelength (λd): 639 nm. This is the single wavelength perceived by the human eye, defining the color as \"Hyper Red.\"
- Spectral Line Half-Width (Δλ): 20 nm. This indicates the spread of the emitted light's wavelength, with a smaller value representing a more pure, saturated color.
- Luminous Intensity Matching Ratio (IV-m): 2:1 maximum. This is a critical parameter for display uniformity, specifying that the brightness of the dimmest dot in an array will be no less than half the brightness of the brightest dot under the same driving conditions.
2.2 Electrical Parameters
Understanding the electrical limits and operating points is essential for reliable circuit design.
- Absolute Maximum Ratings: These are stress limits that must not be exceeded, even momentarily.
- Average Power Dissipation per Dot: 40 mW.
- Peak Forward Current per Dot: 90 mA.
- Average Forward Current per Dot: 15 mA at 25°C, derating linearly at 0.2 mA/°C.
- Reverse Voltage per Dot: 5 V. Exceeding this can damage the LED junction.
- Electrical/Optical Characteristics (at TA=25°C): These are typical operating parameters.
- Forward Voltage (VF): Ranges from 2.1V (min) to 2.8V (max) depending on current. Typical is 2.6V at 20mA and 2.8V at 80mA.
- Reverse Current (IR): 100 µA maximum at VR=5V.
2.3 Thermal Characteristics
Thermal management is implied through the derating specifications and temperature ranges.
- Operating Temperature Range: -35°C to +85°C. The device is designed to function within this ambient temperature span.
- Storage Temperature Range: -35°C to +85°C.
- Current Derating: The average forward current rating decreases linearly by 0.2 mA for every degree Celsius above 25°C. This is a direct thermal limitation to prevent overheating.
- Solder Temperature: Withstands 260°C for 3 seconds at 1/16 inch (approx. 1.6mm) below the seating plane during assembly.
3. Binning System Explanation
The datasheet indicates the device is \"categorized for luminous intensity.\" This refers to a binning process where manufactured units are sorted (binned) based on measured luminous intensity. This ensures designers can select parts with consistent brightness levels for their application, which is crucial for multi-digit displays where uniform appearance is desired. While specific bin codes are not listed in this document, typical bins would group LEDs with similar IV values.
4. Performance Curve Analysis
The datasheet references \"Typical Electrical/Optical Characteristic Curves.\" Although the specific graphs are not provided in the text, such curves typically include:
- I-V (Current-Voltage) Curve: Shows the relationship between forward voltage (VF) and forward current (IF). It is non-linear, with a threshold voltage (around 1.8-2.0V for AlInGaP red) below which very little current flows.
- Luminous Intensity vs. Forward Current: Demonstrates how light output increases with current, typically in a near-linear relationship within the recommended operating range before efficiency drops at very high currents.
- Temperature Dependence: Curves showing how forward voltage decreases and wavelength may shift slightly with increasing junction temperature.
These curves are vital for designing efficient constant-current drivers and understanding performance under varying thermal conditions.
5. Mechanical & Package Information
The physical construction defines the form factor and assembly interface.
- Package Type: A through-hole package with 14 pins.
- Matrix Description: 5 columns by 8 rows of LED dots, creating a grid capable of forming all alphanumeric characters and some symbols.
- Visual Design: Features a gray face (likely the package epoxy) with white segments (the illuminated dot areas), providing good contrast when off and a clean appearance when lit.
- Stackability: The device is designed to be stacked horizontally, allowing for the creation of multi-character displays by placing units side-by-side.
- Dimensions: All dimensions are in millimeters with a general tolerance of ±0.25 mm unless otherwise specified. The exact dimensional drawing is referenced in the datasheet.
5.1 Pin Connection & Polarity
The 14-pin interface uses a multiplexed anode-column and cathode-row scheme for matrix addressing, which reduces the required driver pins from 40 (5x8) to 13 (5+8).
Pinout: Pin 1: Cathode Row 6 Pin 2: Cathode Row 8 Pin 3: Anode Column 2 Pin 4: Anode Column 3 Pin 5: Cathode Row 5 Pin 6: Anode Column 5 Pin 7: Cathode Row 7 Pin 8: Cathode Row 3 Pin 9: Cathode Row 1 Pin 10: Anode Column 4 Pin 11: Anode Column 3 (Note: Duplicate function as Pin 4, likely a typo or specific internal connection) Pin 12: Cathode Row 4 Pin 13: Anode Column 1 Pin 14: Cathode Row 2
Internal Circuit: The internal diagram shows a common matrix configuration where each LED dot is formed at the intersection of an anode column line and a cathode row line. To illuminate a specific dot, its corresponding anode pin must be driven high (with current limiting) while its corresponding cathode pin is driven low.
6. Soldering & Assembly Guidelines
The key assembly specification provided is the soldering temperature profile: the device can withstand a peak temperature of 260°C for 3 seconds, measured 1/16 inch (1.6mm) below the seating plane. This is a standard wave or reflow soldering condition. Designers should ensure their PCB assembly process adheres to this limit to prevent package damage or LED degradation.
Storage Conditions: Components should be stored within the specified storage temperature range of -35°C to +85°C in a dry environment, typically in moisture-sensitive device (MSD) bags if required.
7. Application Suggestions
7.1 Typical Application Scenarios
- Industrial HMIs: Status displays on machinery, PLC operator panels.
- Test & Measurement Equipment: Digital readouts for multimeters, frequency counters, power supplies.
- Retail & Hospitality: Price displays, queue management systems, simple information boards.
- Embedded Systems: Where a simple, robust, and low-power character output is needed.
7.2 Design Considerations
- Driver Circuit: Requires a matrix scan driver IC or microcontroller with sufficient GPIO pins and current sourcing/sinking capability. Constant current driving is recommended for consistent brightness.
- Current Limiting: External resistors or a constant-current driver are mandatory to limit the current through each LED segment to within the specified average and peak limits.
- Multiplexing: Since it's a matrix display, it operates on a multiplexing (scanning) principle. The refresh rate must be high enough (typically >60Hz) to avoid visible flicker. The duty cycle affects the perceived brightness and peak current requirements.
- Viewing Angle: The wide viewing angle is beneficial for applications where the operator may not be directly in front of the display.
- Power Supply: Ensure the supply voltage is sufficient to overcome the LED forward voltage (VF) plus the voltage drop across any current-limiting components and driver circuitry.
8. Technical Comparison & Differentiation
Compared to older technologies like incandescent or vacuum fluorescent displays (VFDs), this LED matrix offers:
- Superior Reliability & Lifetime: Solid-state construction with no filaments or glass envelopes, leading to much longer operational life and resistance to vibration.
- Lower Power Consumption: Especially at lower brightness levels.
- Faster Response Time: Instant on/off capability.
- Wider Operating Temperature Range: Suitable for harsh environments.
Compared to modern graphic OLED or TFT modules, it is:
- Simpler to Interface: Requires fewer control lines and simpler software.
- More Rugged and Cost-Effective for simple character-only applications.
- Highly Readable in high-ambient-light conditions due to its high contrast and emissive nature.
9. Frequently Asked Questions (Based on Technical Parameters)
Q1: How do I calculate the appropriate current-limiting resistor for a single dot? A: Use Ohm's Law: R = (Vsupply - VF) / IF. For example, with a 5V supply, a typical VF of 2.6V at 20mA: R = (5 - 2.6) / 0.02 = 120 Ω. Always use the maximum VF from the datasheet for a conservative design to ensure current doesn't exceed limits.
Q2: What does \"1/16 DUTY\" mean in the test condition for luminous intensity? A: It means the measurement was taken with the LED pulsed on for 1/16th of the total scan cycle time. In a multiplexed 5x8 matrix, a common scanning scheme activates one row at a time. If all 8 rows are scanned, each row is active for 1/8 duty cycle. The 1/16 duty suggests a different scanning pattern or a measurement condition where the peak pulse current is higher, and the average power is kept within limits. The actual operating duty cycle depends on the driver design.
Q3: Can I connect these displays in parallel to make a multi-digit unit? A: They are designed to be stacked horizontally, meaning you place multiple units next to each other on a PCB. You cannot simply connect the pins in parallel because each unit contains a full 5x8 matrix. Each display requires its own set of column drivers, while the row drivers can often be shared across all units in a multi-digit design to simplify the scanning circuitry.
Q4: Why is the dominant wavelength (639nm) different from the peak wavelength (650nm)? A: This is due to the spectral response of the human eye. The LED emits light across a range of wavelengths centered at 650nm (peak). However, the human eye is more sensitive to wavelengths around 555nm (green) and less sensitive to deep red. The dominant wavelength is calculated by finding the single wavelength of pure monochromatic light that would appear to have the same color as the LED's broad spectrum output to a standard human observer. It's the \"perceived\" color point.
10. Operating Principle Introduction
The LTP-2058AKD is an active matrix LED display. Its fundamental principle is electroluminescence from a semiconductor P-N junction. When a forward voltage exceeding the diode's threshold is applied across an anode (column) and cathode (row), electrons and holes recombine in the active AlInGaP layer, releasing energy in the form of photons (light) at a wavelength determined by the material's bandgap. The 5x8 matrix arrangement allows any of the 40 dots to be individually addressed by selecting the correct combination of one column (power source) and one row (ground path). Multiplexing scans through rows rapidly, turning on the necessary columns for each row, to create the illusion of a stable, fully lit character.
11. Technology Trends
While discrete LED dot matrix displays like the LTP-2058AKD remain relevant for specific rugged or cost-sensitive applications, the broader trend in display technology is towards higher integration and functionality. Surface-mount device (SMD) LED arrays and integrated LED driver modules are becoming more common. Furthermore, for applications requiring graphics or more complex characters, segmented LED displays, OLEDs, and small TFT LCDs offer greater flexibility. The principle of matrix addressing remains fundamental, but implementation moves towards chip-on-board (COB) designs and interfaces like I2C or SPI, reducing the component count and simplifying system design compared to direct GPIO matrix driving.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |