850nm Infrared LED 3.0x3.0x2.1mm 1.7V 1.7W EMC Package Datasheet

1. Product Overview

This infrared LED is designed in an EMC package with high reliability, suitable for security monitoring, camera infrared illumination, and machine vision systems. The package dimensions are 3.00mm x 3.00mm x 2.10mm. It features a peak wavelength of 850nm, low forward voltage, and RoHS compliance. The moisture sensitivity level is Level 3.

1.1 General Description

This product uses an EMC (Epoxy Molding Compound) package structure, which provides excellent reliability and mechanical strength. It is widely applied in various security monitoring and sensor electronic products. The compact 3.0mm square footprint allows for dense array designs.

1.2 Features

• Low forward voltage (typical 1.7V at 1000mA)
• Peak wavelength λp=850nm
• Pb-free reflow soldering application
• Moisture sensitive level: Level 3 (168 hours floor life)
• RoHS compliant

1.3 Applications

• Surveillance systems
• Infrared illumination for cameras
• Machine vision systems

2. Technical Parameter Analysis

2.1 Optical and Electrical Characteristics

The following table summarizes the key optical and electrical parameters measured at Ts=25°C with a forward current of 1000mA (unless otherwise noted):

The forward voltage ranges from 1.4V to 2.0V at 1000mA, with a typical value of 1.7V. This low forward voltage reduces power dissipation and improves system efficiency. The peak wavelength is centered at 850nm, ideal for silicon-based camera sensors which have peak sensitivity around this wavelength. The spectral half-width of 37nm provides a good balance between efficiency and filter compatibility. The total radiant flux ranges from 450mW to 1120mW, allowing high optical output for long-range illumination. The viewing angle of 90° offers a wide beam suitable for area illumination. Thermal resistance from junction to solder point is 16°C/W, indicating good thermal performance.

2.2 Absolute Maximum Ratings

To ensure safe operation, the LED must not exceed the following absolute maximum ratings:

Note that the forward current of 1000mA is for pulsed operation (1/10 duty cycle, 0.1ms pulse width). For continuous operation, heat dissipation must be carefully managed to keep junction temperature below 115°C. ESD protection during handling is essential.

3. Binning System

The LEDs are sorted and binned according to total radiant flux (Φe) and peak wavelength (WLP) during manufacturing. The bin code is printed on the label along with the specific Φe and WLP values. This allows for consistent optical performance in applications requiring matched LED arrays, such as camera illumination panels.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current

Figure 1-6 shows the typical forward voltage as a function of forward current. At 1000mA, VF is about 1.7V. The curve follows the typical diode exponential behavior. Designers should account for this variation when designing constant-current drivers.

4.2 Forward Current vs. Relative Intensity

Figure 1-7 shows that the relative radiant intensity increases almost linearly with forward current up to 1000mA, indicating good efficiency. At lower currents, the output is proportionally lower, but the linearity suggests consistent performance over a wide operating range.

4.3 Temperature vs. Relative Intensity

Figure 1-8 reveals that the relative intensity drops as the solder point temperature (Ts) increases. At 85°C, the intensity is reduced to about 80% of the value at 25°C. This thermal effect must be considered in high-temperature environments or when driving the LED near its maximum current.

4.4 Spectrum Distribution

Figure 1-9 shows the emission spectrum centered at 850nm with a half-width of 37nm. The spectrum is typical for infrared LEDs based on GaAs material. This narrow emission matches well with common silicon photodetectors.

4.5 Radiation Diagram

Figure 1-10 illustrates the radiation pattern with a half-angle of 45° (full width at half maximum 90°). The pattern is approximately Lambertian, providing uniform illumination over a wide area.

4.6 Temperature vs. Forward Current

Figure 1-11 shows the maximum allowable forward current as a function of solder point temperature. At Ts=25°C, the maximum current is 1000mA; at Ts=85°C, it drops to about 500mA. This derating curve is crucial for thermal management.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED package has dimensions of 3.00mm x 3.00mm x 2.10mm (LxWxH). The package body is black with an infrared transparent lens. The anode and cathode pads are identified on the bottom view. The cathode pad has a larger area for heat sinking. The recommended soldering pad pattern is provided in Figure 1-5 with specific dimensions (0.69mm, 1.45mm, 0.46mm, etc.) to ensure proper mechanical and thermal attachment.

5.2 Polarity Identification

The polarity is marked on the package: anode (positive) and cathode (negative) are indicated. The bottom view shows pad positions.

5.3 Carrier Tape and Reel Dimensions

The LEDs are packaged in carrier tape with dimensions as shown in Figure 2-1. Each reel contains 3000pcs. The reel dimensions are: A=12.7±0.3mm, B=330.2±2mm, C=79.5±1mm, D=14.3±0.2mm. The tape has a polarity mark to indicate orientation.

5.4 Label Information

The label includes part number, specification number, lot number, bin code (including total radiant flux and peak wavelength bin), forward voltage bin, quantity, and date. The label also contains a barcode for traceability.

6. Soldering and Assembly Guide

6.1 SMT Reflow Soldering Profile

The recommended reflow soldering profile is shown in Figure 3-1. Key parameters: preheating from 150°C to 200°C for 60-120s; time above 217°C: max 60s; peak temperature: 260°C for max 10s; cooling rate: max 6°C/s. The total time from 25°C to peak should be less than 8 minutes. Reflow soldering should not be performed more than two times. If more than 24 hours pass between the two reflows, LEDs may be damaged due to moisture absorption.

6.2 Hand Soldering

If hand soldering is necessary, the iron temperature must be below 300°C and the contact time less than 3 seconds. Only one hand soldering operation is allowed.

6.3 Repairing

Repair after soldering is not recommended. If unavoidable, use a double-head soldering iron and verify that the LED characteristics are not compromised.

6.4 Cautions

The encapsulant is silicone, which is soft. Do not apply excessive pressure on the top surface. Avoid mounting LEDs on warped PCB and do not bend the board after soldering. Do not apply mechanical force or vibration during cooling. Rapid cooling should be avoided.

7. Packaging and Ordering Information

7.1 Packaging Quantity

Standard packaging: 3000pcs per reel. The LEDs are placed in carrier tape and wound on a reel as per EIA-481.

7.2 Moisture Resistant Packing

Each reel is placed in a moisture barrier bag (MBB) with a desiccant and a humidity indicator card. The bag is then sealed to maintain a low moisture environment. The label includes moisture sensitivity level information.

7.3 Cardboard Box

Multiple reels are packed in a cardboard box with appropriate cushioning for transportation.

7.4 Storage Conditions

Before opening the aluminum foil bag, store at ≤30°C and ≤75% RH for up to one year from the date of packing. After opening, the LEDs must be used within 168 hours (7 days) when stored at ≤30°C and ≤60% RH. If the storage time is exceeded or the desiccant has faded, baking is required at 60±5°C for ≥24 hours before use.

8. Handling Precautions

8.1 Sulfur and Halogen Restrictions

The operating environment and mating materials must not contain sulfur elements or compounds exceeding 100PPM. Bromine and chlorine content must each be less than 900PPM, with their total below 1500PPM. This helps prevent corrosion and discoloration of the LED.

8.2 VOCs and Material Compatibility

Volatile organic compounds (VOCs) from fixture materials can penetrate the silicone encapsulant and cause discoloration when exposed to heat and light. It is recommended to test all materials for compatibility in the specific application environment. Do not use adhesives that outgas organic vapors.

8.3 Handling the Silicone Surface

The silicone lens surface is soft and easily attracts dust. Handle the component from the side using tweezers or appropriate tools. Avoid touching the lens surface directly. If cleaning is required, use isopropyl alcohol. Ultrasonic cleaning is not recommended as it may damage the LED.

8.4 Circuit Design Considerations

Design the driving circuit to limit the current below the absolute maximum rating. Use a current-limiting resistor or constant-current driver. Slight voltage shifts can cause large current changes due to the steep I-V curve. Do not apply reverse voltage to the LED as it may cause migration and damage.

8.5 Thermal Design

Thermal management is critical. The junction temperature must not exceed 115°C at any time. Provide adequate heat sinking through the PCB copper area and thermal vias. The thermal resistance from junction to solder point is 16°C/W, so for 1.7W power dissipation, the temperature rise from solder point to junction is about 27°C. Ensure the ambient temperature plus rise stays below 115°C.

8.6 ESD Protection

The LED has an ESD withstand voltage of 2000V (HBM). However, ESD protection during handling and assembly is necessary. Use grounded workstations, anti-static wrist straps, and conductive packaging.

9. Application Recommendations

The 850nm infrared LED is ideal for security cameras, night vision illumination, and machine vision lighting. For optimal performance, design a constant-current driver with pulse-width modulation (PWM) dimming capability. Use heat-sinking techniques such as thermal vias and copper pours on the PCB. The 90° viewing angle is suitable for wide-area illumination; for narrower beam, external optics can be used. Ensure that the LED spectral output matches the camera sensor sensitivity peak (typically around 850nm for silicon sensors).

10. Reliability Testing

10.1 Test Items and Conditions

The product has undergone reliability tests per JEDEC standards, including: Reflow (260°C, 10s, 3 times), Temperature Cycle (-40°C to 100°C, 100 cycles), Thermal Shock (-40°C to 100°C, 300 cycles), High Temperature Storage (100°C, 1000hrs), Low Temperature Storage (-40°C, 1000hrs), Life Test (25°C, 1000mA, 1000hrs), and High Temperature High Humidity Life Test (85°C/85%RH, 1000mA, 1000hrs). All tests passed with acceptance criteria of 0 failure per 10 samples.

10.2 Failure Criteria

Failure is defined as: Forward voltage exceeds upper spec limit (U.S.L) x 1.1; Reverse current exceeds U.S.L x 2.0; Total radiant flux falls below lower spec limit (L.S.L) x 0.7.

11. Working Principle

This infrared LED is based on a semiconductor p-n junction made from gallium arsenide (GaAs) or related III-V compounds. When forward biased, electrons recombine with holes in the active region, releasing energy in the form of photons. The bandgap energy determines the photon wavelength; for 850nm, the material is typically GaAs with some aluminum content. The EMC package encapsulates the chip and provides heat dissipation and protection.

12. Development Trends

The demand for infrared LEDs continues to grow with the expansion of surveillance systems, autonomous vehicles (LiDAR), and industrial automation. Future trends include higher power densities, smaller packages, and improved efficiency. The integration of IR LEDs with advanced drivers and smart control systems will enable adaptive illumination. Also, the move toward longer wavelengths (940nm) for covert illumination is increasing, but 850nm remains dominant for standard cameras due to better sensor sensitivity.

13. Frequently Asked Questions

Q: What is the maximum continuous forward current? A: The absolute maximum is 1000mA, but only for pulsed operation (1/10 duty). For continuous DC operation, the current must be derated based on the temperature. At 25°C ambient with good heat sinking, typical continuous current is around 500mA to keep junction temperature safe.

Q: How should I handle MSL Level 3 components? A: Store in sealed moisture barrier bag. After opening, use within 168 hours or bake at 60°C for 24 hours before reflow.

Q: Can I use this LED in outdoor cameras? A: Yes, but ensure the operating temperature range is within -40°C to +85°C and that the enclosure provides adequate thermal management.

Q: What is the recommended LED driver? A: A constant-current driver with a current rating based on your thermal design. For example, if you drive at 700mA, a 1.5W driver may suffice.

14. Practical Application Cases

Case 1: Bullet Camera Night Vision - A 3x3 array of these LEDs is used in a bullet camera, providing effective illumination up to 30 meters. The 90° beam angle covers the camera field of view. The thermal design uses an aluminum core PCB to dissipate heat.

Case 2: Machine Vision Inspection - In a factory, a line-scan camera uses a high-power IR LED array (12 LEDs) to illuminate moving parts. Pulsed operation at 500mA, 50% duty cycle ensures consistent illumination without overheating.