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EL3H4-G Series Photocoupler Datasheet - 4-Pin SSOP Package - AC Input - Isolation 3750Vrms - English Technical Document

Complete technical datasheet for the EL3H4-G series AC input phototransistor photocoupler. Features include halogen-free compliance, 3750Vrms isolation, and a compact 4-pin SSOP package.
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PDF Document Cover - EL3H4-G Series Photocoupler Datasheet - 4-Pin SSOP Package - AC Input - Isolation 3750Vrms - English Technical Document

1. Product Overview

The EL3H4-G series is a family of AC input phototransistor photocouplers designed for applications requiring electrical isolation and signal transmission from AC or unknown polarity DC sources. The device is housed in a compact, surface-mount 4-pin Small Outline Package (SSOP), making it suitable for space-constrained PCB designs.

The core component consists of two infrared light-emitting diodes (LEDs) connected in inverse parallel. This configuration allows the input to accept alternating current (AC) signals, as one diode conducts during each half-cycle of the input waveform. The emitted infrared light is optically coupled to a silicon phototransistor, which provides the isolated output signal. The entire assembly is encapsulated with a green, halogen-free compound.

1.1 Core Advantages

1.2 Target Applications

This photocoupler is designed for use in a variety of industrial and communication applications where reliable isolation and AC signal detection are required.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not intended for normal operating conditions.

2.2 Electro-Optical Characteristics

These parameters define the electrical and optical performance of the device under specified test conditions (typically at Ta = 25°C).

2.2.1 Input Characteristics

2.2.2 Output Characteristics

2.2.3 Transfer Characteristics

These parameters define the efficiency and quality of the signal transfer from input to output.

3. Grading System Explanation

The EL3H4-G series employs a grading system primarily based on the Current Transfer Ratio (CTR).

This binning allows manufacturers to optimize their designs for consistency or to select parts for specific sensitivity requirements.

4. Performance Curve Analysis

The datasheet references typical electro-optical characteristic curves. While the specific graphs are not detailed in the provided text, they typically include the following, which are crucial for design:

Designers should consult these curves to understand device behavior under non-standard conditions and to optimize parameters like input current and load resistance for desired speed and output swing.

5. Mechanical and Package Information

5.1 Pin Configuration

The 4-pin SSOP package has the following pinout:

  1. Pin 1: Anode of one LED / Cathode of the other (due to inverse-parallel connection).
  2. Pin 2: Cathode of the first LED / Anode of the second.
  3. Pin 3: Emitter of the phototransistor.
  4. Pin 4: Collector of the phototransistor.

This configuration means the AC input is applied between Pins 1 and 2, and the output is taken from Pins 3 and 4 (typically with Pin 3 as common/ground).

5.2 Package Dimensions and PCB Layout

The datasheet includes detailed mechanical drawings for the SSOP package. Key dimensions include the body size, lead pitch, and standoff height. A recommended pad layout for surface mounting is also provided, with the note that it is for reference and should be modified based on specific PCB manufacturing processes and thermal requirements. Proper pad design is essential for reliable soldering and mechanical strength.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The device is compatible with lead-free reflow soldering processes. The recommended maximum body temperature profile is based on IPC/JEDEC J-STD-020D:

Adhering to this profile prevents thermal damage to the plastic package and the internal wire bonds.

6.2 Precautions

7. Packaging and Ordering Information

7.1 Model Numbering Rule

The part number follows the format: EL3H4(Y)(Z)-VG

Example: EL3H4A-TA-VG is an 'A' grade part, supplied on a 5000-unit TA reel, with VDE approval, and is halogen-free.

7.2 Packaging Specifications

The device can be supplied in tubes (150 units) or on tape and reel. Detailed tape dimensions (pocket size, pitch, tape width) are provided for compatibility with automated pick-and-place equipment.

7.3 Device Marking

The top of the package is marked with a code: EL 3H4 RYWWV

8. Application Design Considerations

8.1 Input Circuit Design

For AC operation, a current-limiting resistor must be placed in series with the input pins (1 and 2). Its value should be calculated based on the peak input voltage and the desired forward current (IF), ensuring IF does not exceed the continuous rating of 50 mA. For example, to drive the input from a 120Vrms AC line, the resistor must limit the peak current (≈170V / R). Consider power rating and voltage withstand capability of this resistor.

8.2 Output Circuit Design

The output phototransistor can be used in a common-emitter configuration (load resistor between VCC and Collector, Emitter to ground) or as a switch. The value of the load resistor (RL) affects:
Output Voltage Swing: Higher RL gives a larger voltage drop for a given IC.
Switching Speed: Higher RL increases the RC time constant, slowing down the rise and fall times (as indicated by the tr/tf specification with RL=100Ω).
A pull-up resistor is often needed if driving a logic input. Ensure the output voltage in the 'on' state (VCE(sat)) is low enough to be recognized as a logic '0'.

8.3 Ensuring Reliable Isolation

To maintain the specified 3750Vrms isolation, PCB layout is critical. Maintain adequate creepage and clearance distances on the board between the copper traces and pads associated with the input side (Pins 1,2) and the output side (Pins 3,4). This often means providing a physical slot or wide separation in the PCB under the device body. Avoid running input and output traces in parallel close to each other.

9. Technical Comparison and Differentiation

The primary differentiating features of the EL3H4-G series compared to standard DC-input photocouplers are:

Compared to other AC input photocouplers, its advantages lie in the combination of high isolation voltage, compact SSOP package, and availability of multiple CTR grades.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I use this to directly sense 230V AC mains?
A: Yes, but you must use an appropriate external current-limiting resistor in series with the input to keep the forward current within the 50mA limit. The resistor must also be rated for the high voltage and power dissipation.

Q2: What is the difference between the standard, A, and B grades?
A: The difference is the guaranteed minimum and maximum Current Transfer Ratio (CTR). The B grade has the highest minimum sensitivity (100%), making it suitable for detecting weaker signals. The A grade offers a more moderate, predictable range. The standard grade has the widest range, offering cost-effective general-purpose use.

Q3: How fast is this device? Can it be used for communication?
A: With typical rise/fall times of up to 18 µs, the bandwidth is limited to roughly tens of kHz. It is suitable for detecting AC power frequency (50/60 Hz), slow digital signals, or state detection in PLCs, but it is not designed for high-speed data communication like digital isolators.

Q4: Why is the isolation resistance so high (10^11 Ω)?
A: This extremely high resistance minimizes leakage current across the isolation barrier. This is crucial for safety, preventing dangerous currents from flowing between isolated circuits, and for signal integrity in precision measurement applications.

11. Practical Design Example

Scenario: Isolated 120V AC Line Presence Detector.
Goal: Provide a 3.3V logic-low signal to a microcontroller when 120V AC is present.
Design Steps:
1. Input Resistor Calculation: For 120Vrms, peak voltage is ~170V. To limit IF to a safe 10mA (well below 50mA), Rlimit = 170V / 0.01A = 17kΩ. Use a standard 18kΩ, 1/2W or higher rated resistor.
2. Output Circuit: Connect the phototransistor Collector (Pin 4) to the microcontroller's 3.3V supply via a pull-up resistor (e.g., 10kΩ). Connect the Emitter (Pin 3) to ground. The Collector node connects to a digital input pin on the microcontroller.
3. Operation: When AC is present, the photocoupler's output turns on during each half-cycle, pulling the Collector voltage down close to VCE(sat) (~0.2V), which is read as a logic '0'. When AC is absent, the phototransistor is off, and the pull-up resistor brings the Collector voltage to 3.3V (logic '1'). Software may need to debounce this signal due to the 50/60 Hz zero-crossings.

12. Operating Principle

The EL3H4-G operates on the principle of optoelectronic coupling. An electrical signal applied to the input side causes the infrared LEDs to emit light proportional to the current. This light traverses a transparent isolation barrier within the package. On the output side, the light strikes the base region of a silicon phototransistor, generating electron-hole pairs. This photocurrent acts as base current, causing the transistor to conduct a much larger collector current, thereby replicating the input signal on the isolated output side. The inverse-parallel LED configuration allows current to flow and light to be emitted during both polarities of an AC input signal.

13. Technology Trends

Photocouplers like the EL3H4-G represent a mature and reliable isolation technology. Current trends in the field of signal isolation include:
Integration: Combining multiple isolation channels or integrating additional functions (like drivers or protection) into a single package.
Higher Speed: Development of photocouplers with faster switching times for digital communication applications, though they are generally slower than technologies based on capacitive or magnetic coupling.
Enhanced Safety Standards: Continuous evolution of international safety standards (UL, VDE, IEC) driving requirements for higher working voltages, reinforced isolation, and improved reliability metrics.
Material Science: Development of new encapsulation compounds with better thermal stability, moisture resistance, and optical clarity to improve performance and longevity.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.