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LTP-4823JD 0.4-inch Dual Digit Alphanumeric LED Display Datasheet - 10mm Digit Height - Hyper Red (650nm) - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

Complete technical datasheet for the LTP-4823JD, a 0.4-inch (10mm) dual-digit, 16-segment alphanumeric LED display using AlInGaP hyper red chips. Includes specifications, pinout, ratings, and characteristics.
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PDF Document Cover - LTP-4823JD 0.4-inch Dual Digit Alphanumeric LED Display Datasheet - 10mm Digit Height - Hyper Red (650nm) - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

1. Product Overview

The LTP-4823JD is a compact, high-performance dual-digit alphanumeric display module designed for applications requiring clear character and symbol presentation. Its primary function is to provide a visual output interface for numeric data, letters, and specific symbols, making it suitable for a wide range of instrumentation, control panels, and consumer electronics.

The core advantage of this device lies in its utilization of AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology for the LED chips. This material system is renowned for producing high-efficiency red and amber LEDs. The chips are fabricated on a non-transparent GaAs substrate, which helps in improving contrast by minimizing internal light scattering and reflection. The display features a gray face with white segments, a combination that enhances readability and aesthetic appeal when the LEDs are off. The device is categorized for luminous intensity and is offered in a lead-free package compliant with RoHS (Restriction of Hazardous Substances) directives.

1.1 Key Features and Target Market

The display boasts several features that make it attractive for design engineers:

The target market includes industrial control systems, test and measurement equipment, medical devices, automotive dashboards (secondary displays), point-of-sale terminals, and household appliances where clear, reliable alphanumeric feedback is required.

2. Technical Specifications Deep Dive

2.1 Electrical and Optical Characteristics

The performance of the LTP-4823JD is defined under standard test conditions at an ambient temperature (Ta) of 25°C. Key parameters include:

Luminous intensity measurements are performed using a sensor and filter calibrated to approximate the CIE photopic eye-response curve, ensuring the values correlate with human visual perception.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage may occur. Operation outside these limits is not guaranteed.

3. Mechanical and Package Information

3.1 Physical Dimensions and Tolerances

The package dimensions are provided in millimeters. Key tolerances include ±0.25 mm for most dimensions and ±0.4 mm for pin tip shift. Detailed dimensional drawings are essential for PCB (Printed Circuit Board) footprint design to ensure proper fit and alignment. The display is a through-hole device with pins designed for soldering.

3.2 Pin Connection and Internal Circuit

The LTP-4823JD is a 20-pin device configured as a common anode, duplex display. This means it has two independent digits (Character 1 and Character 2), each with a shared anode connection. The individual segment cathodes are brought out to separate pins.

Pinout Summary: Pins 4 and 10 are the common anodes for digit 1 and digit 2, respectively. The remaining pins (1-3, 5-9, 11-13, 15-20) are cathodes for the various segments (A, B, C, D, E, F, G, H, K, M, N, P, R, S, T, U, D.P.). Pin 14 is noted as \"No Connection\" (N/C). The internal circuit diagram shows the arrangement of these LEDs with their common anode connections.

This common anode configuration requires the driving circuit to source current to the common anode pin and sink current through the individual cathode pins to illuminate a specific segment.

4. Soldering and Assembly Guidelines

The datasheet specifies soldering conditions to prevent thermal damage during assembly. The recommended condition is soldering at 260°C for a maximum of 3 seconds, measured at a point 1/16 inch (approximately 1.6 mm) below the seating plane of the package. It is critical not to exceed the maximum temperature ratings of the device during any part of the assembly process. Proper ESD (Electrostatic Discharge) handling procedures should always be followed for LED components.

5. Application Suggestions and Design Considerations

5.1 Typical Application Circuits

To drive the LTP-4823JD, a multiplexing scheme is typically employed due to its common anode configuration. A microcontroller or dedicated display driver IC is used. The common anodes (pins 4 and 10) are connected to current-source outputs or switched power via transistors. The segment cathode pins are connected to current-sink drivers (like a transistor array or driver IC with open-collector/drain outputs).

The display is multiplexed by rapidly switching (strobing) the power to each digit's common anode while presenting the corresponding segment data on the cathode lines. A refresh rate high enough to avoid visible flicker (typically >60 Hz per digit) must be maintained. Current-limiting resistors are mandatory for each segment cathode (or possibly for each common anode, depending on the driver design) to set the desired forward current, typically between 1 mA and 20 mA as per the application's brightness requirement.

5.2 Design Considerations

6. Performance Curve Analysis

The datasheet references typical electrical and optical characteristic curves. While the specific graphs are not detailed in the provided text, such curves generally include:

These curves are vital for understanding the device's behavior under non-standard conditions and for optimizing the drive circuitry for efficiency and longevity.

7. Technical Comparison and Differentiation

The LTP-4823JD differentiates itself through its AlInGaP technology. Compared to older technologies like standard GaAsP (Gallium Arsenide Phosphide) red LEDs, AlInGaP offers significantly higher luminous efficiency, resulting in greater brightness for the same drive current or lower power consumption for the same brightness. The \"hyper red\" color (650nm) is often more visually striking and can have better performance in some optical sensor systems. The 16-segment format provides alphanumeric capability beyond simple 7-segment numeric displays, while the dual-digit, single-module construction saves board space compared to two separate single-digit units.

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between peak wavelength (650nm) and dominant wavelength (639nm)?
A: Peak wavelength is the physical peak of the emission spectrum. Dominant wavelength is the perceived color point. The slight difference is due to the shape of the emission spectrum and the human eye's sensitivity curve (CIE). The dominant wavelength is more relevant for color specification.

Q: Can I drive this display with a 5V microcontroller without other components?
A: No. You must use external current-limiting resistors for each segment cathode. Connecting an LED directly to a microcontroller pin can damage both the LED (from overcurrent) and the microcontroller pin (from exceeding its current sink/source capability).

Q: What does \"categorized for luminous intensity\" mean?
A: It means the displays are tested and binned according to their measured brightness at a standard test current. This allows designers to select parts with consistent brightness levels for their application, ensuring uniform appearance across multiple units in a product.

Q: How do I achieve decimal point control?
A: The decimal point (D.P.) is a separate segment with its own cathode connection (Pin 5). It is controlled independently just like any other segment (A, B, C, etc.).

9. Operating Principle and Technology Trends

9.1 Basic Operating Principle

An LED is a semiconductor diode. When a forward voltage exceeding its bandgap voltage is applied, electrons and holes recombine in the active region of the semiconductor, releasing energy in the form of photons (light). The color of the light is determined by the energy bandgap of the semiconductor material. AlInGaP has a bandgap corresponding to red/orange/amber light. The non-transparent substrate helps direct more of the generated light out of the top of the device, improving efficiency.

9.2 Industry Trends

The trend in alphanumeric displays is towards higher integration, surface-mount technology (SMT) packages for automated assembly, and sometimes the inclusion of the driver IC within the display module itself. While through-hole displays like the LTP-4823JD remain popular for prototyping, repair-friendly designs, and certain industrial applications, SMT versions are becoming more prevalent in high-volume consumer electronics. Furthermore, there is a constant drive for higher efficiency (more light per watt) and improved reliability across wider temperature ranges.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.