Select Language

LTP-4323JD LED Display Datasheet - 0.4-inch Digit Height - Hyper Red Color - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

Technical datasheet for the LTP-4323JD, a 0.4-inch (10.0mm) digit height, 16-segment dual alphanumeric LED display utilizing AlInGaP Hyper Red chips. Includes specifications, dimensions, ratings, reliability tests, and application guidelines.
smdled.org | PDF Size: 0.3 MB
Rating: 4.5/5
Your Rating
You have already rated this document
PDF Document Cover - LTP-4323JD LED Display Datasheet - 0.4-inch Digit Height - Hyper Red Color - 2.6V Forward Voltage - 70mW Power Dissipation - English Technical Document

1. Product Overview

The LTP-4323JD is a high-performance, dual-character alphanumeric display module designed for applications requiring clear, bright, and reliable numeric and limited alphabetic readouts. Its core technology is based on Aluminium Indium Gallium Phosphide (AlInGaP) semiconductor material, specifically engineered to emit light in the Hyper Red spectrum. This material choice, grown on a non-transparent Gallium Arsenide (GaAs) substrate, provides superior efficiency and brightness for red emissions compared to older technologies. The device features a gray face with white segments, offering high contrast for excellent readability under various lighting conditions. It is categorized for luminous intensity, ensuring consistent performance across production batches, and is available in a lead-free package compliant with RoHS directives.

1.1 Key Features and Advantages

1.2 Target Applications and Market

This display is intended for use in ordinary electronic equipment across various sectors. Typical applications include instrumentation panels, test and measurement equipment, point-of-sale systems, industrial control interfaces, consumer appliances, and communication devices. It is designed for applications where reliable, clear, and bright alphanumeric indication is required. The datasheet explicitly cautions against using this standard commercial-grade component in safety-critical systems (e.g., aviation, medical life-support, transportation control) without prior consultation, highlighting its primary market in general-purpose industrial and consumer electronics.

2. Technical Specifications and Objective Interpretation

The following section provides a detailed, objective analysis of the device's electrical, optical, and thermal characteristics as defined in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

2.2 Electrical and Optical Characteristics

These are the typical and maximum/minimum performance parameters measured under specified test conditions (Ta=25°C).

3. Binning and Categorization System

The LTP-4323JD employs a categorization system for luminous intensity. This means units are tested and sorted into different performance bins based on their measured light output. The module marking includes a \"Z: BIN CODE\" identifier. This allows designers to select displays with consistent brightness levels for a uniform appearance in multi-unit applications. The datasheet does not detail the specific bin code values or intensity ranges associated with each code, which would typically be defined in a separate binning document or agreed upon during purchase.

4. Performance Curve Analysis

The datasheet references \"Typical Electrical/Optical Characteristics Curves.\" While the specific graphs are not detailed in the provided text, such curves typically include:

These curves are essential for understanding the device's behavior under non-standard conditions (different currents, temperatures) and for optimizing the design for efficiency and longevity.

5. Mechanical and Package Information

5.1 Package Dimensions

The display has a standard dual in-line package (DIP) footprint. Key dimensional notes include:

5.2 Pinout and Polarity Identification

The device has 20 pins. The internal circuit diagram and pin connection table show it is a common cathode type for this specific part number (LTP-4323JD). Each segment (A, B, C, D, E, F, G, H, K, M, N, P, R, S, T, U, DP) has its own anode pin. The two characters share common cathode pins (Pin 4 for Character 1, Pin 10 for Character 2). Pin 14 is listed as \"No Connection.\" Correct identification of the common cathode pins is crucial for proper circuit design to sink current correctly.

6. Soldering and Assembly Guidelines

6.1 Automated Soldering Profile

For wave or reflow soldering, the condition is specified as 260°C for 5 seconds, measured 1.59mm (1/16 inch) below the seating plane of the component. The temperature of the component body itself during assembly must not exceed the maximum temperature rating.

6.2 Manual Soldering Instructions

For hand soldering, the iron tip should be applied 1.59mm below the seating plane. The soldering time must be within 5 seconds at a temperature of 350°C ±30°C. Exceeding these time or temperature limits can damage the internal wire bonds or the LED chips.

7. Reliability Testing

The device undergoes a comprehensive suite of reliability tests based on military (MIL-STD), Japanese industrial (JIS), and internal standards. These tests validate its robustness and longevity:

8. Critical Application Notes and Design Considerations

8.1 Design and Implementation Warnings

8.2 Typical Application Circuit Concepts

For a common cathode display like the LTP-4323JD, a typical multiplexing scheme is often used to control the 16 segments across two characters. The common cathode pins (4 and 10) would be switched to ground sequentially (e.g., by a transistor), while the appropriate segment anode pins are driven high (with current limiting resistors or a constant current driver IC) to illuminate the desired segments for that character. This reduces the required number of microcontroller I/O pins. The design must ensure the peak current per segment during the multiplexed pulse does not exceed the absolute maximum rating, and the average current over time meets the desired brightness level.

9. Comparative Advantages and Technology Context

The use of AlInGaP technology for red LEDs represents a significant advancement over older technologies like Gallium Arsenide Phosphide (GaAsP). AlInGaP offers substantially higher external quantum efficiency, resulting in brighter output for the same input current. The \"Hyper Red\" emission (650nm peak) is also more visually distinct and can offer better performance in applications where the display might be viewed through filters or in ambient sunlight. The gray face/white segment design maximizes contrast. Compared to simple 7-segment displays, the 16-segment format allows for a more complete representation of the alphabet (albeit limited), increasing the device's utility in applications requiring short text messages alongside numbers.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this display with a 5V microcontroller pin directly?
A: No. The typical forward voltage is 2.6V, but a series current-limiting resistor is always required to set the correct current (e.g., 20mA). Using just a 5V pin would cause excessive current and destroy the LED segment. Calculate the resistor value using R = (Vcc - Vf) / If.

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (650nm) is the physical peak of the light spectrum emitted. Dominant wavelength (639nm) is the perceived color point by the human eye, which can differ due to the shape of the emission spectrum. Both are important for specification.

Q: Why is constant current drive recommended over constant voltage?
A: An LED's forward voltage (Vf) decreases as temperature increases. With a constant voltage supply, this would cause the current to increase, leading to further heating and thermal runaway. A constant current source maintains a stable current regardless of Vf variations, ensuring stable brightness and protecting the LED.

Q: How do I interpret the \"Luminous Intensity Matching Ratio\" of 2:1?
A: This means the brightest segment in a defined \"similar light area\" (likely within one character) will be no more than twice as bright as the dimmest segment in that same area. It is a measure of uniformity.

11. Practical Design and Usage Example

Scenario: Designing a simple two-digit voltmeter readout. The LTP-4323JD would be ideal. The microcontroller's ADC reads a voltage, converts it to a decimal number, and drives the display. The firmware would handle multiplexing: it sets the segment pattern for the tens digit on the anode lines, grounds common cathode Pin 4 for a short period (e.g., 5ms), then sets the segment pattern for the units digit and grounds common cathode Pin 10 for the same period, repeating rapidly. The persistence of vision creates the illusion of both digits being on continuously. Careful calculation of the current-limiting resistors is needed based on the supply voltage and the desired average segment current (considering the duty cycle of multiplexing). The design must include protection diodes if the driving circuit can subject the LEDs to reverse voltage.

12. Operating Principle

The device operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward voltage exceeding the diode's turn-on threshold is applied, electrons from the n-type AlInGaP layer recombine with holes from the p-type layer. This recombination event releases energy in the form of photons (light). The specific alloy composition of the AlInGaP crystal lattice determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, in the red region around 650 nm. The non-transparent GaAs substrate absorbs any downward-emitted light, improving overall efficiency by reflecting it upwards. Each segment in the display contains one or more of these microscopic LED chips.

13. Technology Trends and Context

AlInGaP-based LEDs represent a mature and highly optimized technology for amber, red, and hyper-red emissions. While newer materials like Gallium Nitride (GaN) dominate the blue, green, and white LED markets, AlInGaP remains the efficiency leader for longer wavelengths. Current trends in display technology focus on miniaturization (smaller than 0.4-inch digits), higher pixel density (moving towards dot matrix or OLED for full graphics), and improved efficiency (lower drive currents for the same brightness). However, for dedicated, high-reliability, high-brightness alphanumeric indicators in harsh environments (wide temperature range), segment LED displays like the LTP-4323JD continue to be a robust and cost-effective solution. Future developments may involve integrating driver electronics directly into the package or further refining the package for even better thermal management.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.