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LTP-18088KD LED Dot Matrix Display Datasheet - 1.85 Inch Height - Hyper Red (650nm) - 2.6V Forward Voltage - 40mW Power Dissipation - English Technical Document

Technical datasheet for the LTP-18088KD, a 1.85-inch (47.0mm) 8x8 dot matrix LED display utilizing AlInGaP Hyper Red chips with black face and white segments.
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PDF Document Cover - LTP-18088KD LED Dot Matrix Display Datasheet - 1.85 Inch Height - Hyper Red (650nm) - 2.6V Forward Voltage - 40mW Power Dissipation - English Technical Document

1. Product Overview

The LTP-18088KD is a solid-state dot matrix display module designed for applications requiring clear, bright alphanumeric or symbolic information presentation. Its core function is to provide a reliable and efficient visual output interface.

1.1 Core Advantages and Target Market

This device is built around several key advantages that define its application space. It features a low power requirement, making it suitable for battery-powered or energy-conscious devices. The excellent character appearance and high brightness & contrast ensure readability in various ambient lighting conditions, from dim indoor settings to brighter environments. A wide viewing angle allows the displayed information to be seen clearly from off-axis positions, which is critical for public information displays or multi-user equipment. Finally, its solid-state reliability, inherent to LED technology, offers long operational life and resistance to shock and vibration compared to mechanical displays. These features make it ideal for industrial instrumentation, test equipment, point-of-sale terminals, transportation information boards, and other embedded systems requiring a robust, clear display.

2. Technical Specifications Deep Dive

The performance of the LTP-18088KD is characterized by a detailed set of electrical, optical, and mechanical parameters.

2.1 Device Description and Technology

The display has a matrix height of 1.85 inches (47.0 mm) and is organized as an 8 x 8 dot matrix. It utilizes Aluminium Indium Gallium Phosphide (AlInGaP) Hyper Red LED chips. These chips are fabricated on a non-transparent Gallium Arsenide (GaAs) substrate. The package features a black face with white segments, a combination that significantly enhances the contrast ratio by absorbing ambient light and making the illuminated red segments stand out more prominently.

2.2 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

2.3 Electrical & Optical Characteristics (at TA=25°C)

These are the typical and guaranteed performance parameters under specified test conditions.

Note: Luminous intensity measurement follows the CIE (Commission Internationale de l'\'Eclairage) eye-response curve using an appropriate sensor and filter combination.

3. Binning System Explanation

The datasheet indicates the device is categorized for luminous intensity. This means units are tested and sorted (binned) based on their measured light output. This allows designers to select displays with consistent brightness levels for a uniform appearance in their application, which is crucial when multiple displays are used side-by-side. The matching ratio of 2:1 further guarantees that within a single display, no dot is more than twice as bright as another, ensuring visual uniformity of the formed characters or graphics.

4. Performance Curve Analysis

While the PDF references typical characteristic curves, the provided electrical/optical data allows for analysis. The forward voltage shows a predictable increase with current (from 2.6V typ at 20mA to 2.8V typ at 80mA), which is standard LED behavior. The dominant wavelength of 639 nm and peak at 650 nm firmly place this in the hyper-red spectrum, offering high visual impact. The wide operating temperature range (-35°C to +85°C) suggests stable performance across harsh environments, though the forward current must be derated at high ambient temperatures as per the maximum ratings.

5. Mechanical & Package Information

5.1 Package Dimensions and Stackability

The mechanical drawing provides critical dimensions for PCB footprint design and enclosure integration. A key feature highlighted is that the module is stackable both vertically and horizontally. This implies the mechanical design includes features (like flush edges or specific mounting points) that allow multiple displays to be placed adjacent to each other to create larger multi-character or multi-line displays without unsightly gaps or alignment issues.

5.2 Pin Connection and Internal Circuit

The device has a 24-pin configuration. The pinout table clearly defines the function of each pin: Anode for columns and Cathode for rows. Several pins are marked \"NO CONNECTION\" (N/C). The internal circuit diagram, typical for a matrix display, shows the 64 LEDs (8x8) arranged with their anodes connected in columns and cathodes in rows. This common matrix architecture minimizes the number of required driver pins (16 for 64 LEDs) but requires multiplexed driving.

6. Soldering & Assembly Guidelines

The primary assembly instruction provided is for soldering: 260°C for 3 seconds, measured 1/16 inch below the seating plane. This is a standard reflow soldering profile parameter. Designers must ensure their PCB assembly process adheres to this to prevent thermal damage to the LED chips or the plastic package. The storage temperature range (-35°C to +85°C) should also be respected during handling and before assembly.

7. Application Suggestions

7.1 Typical Application Scenarios

The combination of high brightness, wide viewing angle, and solid-state construction makes the LTP-18088KD suitable for: Industrial Control Panels (status indicators, fault codes), Test and Measurement Equipment (readouts, bargraphs), Public Information Displays (in transportation, simple message boards), Consumer Electronics (audio equipment displays, appliance status), and Prototyping & Educational Kits.

7.2 Design Considerations

8. Technical Comparison & Differentiation

The key differentiator for the LTP-18088KD is its use of AlInGaP (Hyper Red) technology. Compared to older GaAsP or standard red GaP LEDs, AlInGaP offers significantly higher luminous efficiency, resulting in greater brightness for the same drive current, or similar brightness at lower power. The black face/white segment design enhances contrast more effectively than traditional gray or beige packages. Its stackable design is a practical mechanical advantage for building larger displays seamlessly.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between Peak Wavelength (650nm) and Dominant Wavelength (639nm)?
A: Peak wavelength is the point of maximum power in the emitted spectrum. Dominant wavelength is the perceived color point, calculated from the spectrum and the CIE color matching functions. For a monochromatic source like this red LED, they are close but not identical.

Q: How do I achieve the typical luminous intensity of 3500 μcd?
A: The test condition is a peak current (IP) of 32mA at a 1/16 duty cycle. In a multiplexed 8-row matrix, a 1/8 duty cycle is more common. To achieve a similar average brightness, the peak current during its active time slot may need adjustment based on the driver's duty cycle and required average current per LED.

Q: Can I drive it with a 5V microcontroller pin directly?
A: No. The forward voltage is ~2.6V, and a series current-limiting resistor is mandatory. Connecting 5V directly would destroy the LED due to excessive current. Furthermore, microcontroller pins typically cannot source/sink the cumulative current required for a whole column or row in a multiplexed setup; external drivers (transistors or dedicated LED driver ICs) are necessary.

10. Design and Usage Case Example

Scenario: Designing a simple 4-digit numeric display for a counter.
Four LTP-18088KD displays would be placed side-by-side (facilitated by the stackable design). A microcontroller would be used to manage the display. Since each 8x8 matrix can form recognizable numbers, the controller's firmware would contain a font map. The microcontroller, via external transistor arrays or a dedicated LED driver IC, would multiplex the displays. It would cycle through the four displays (a time-division multiplex) and within each display, cycle through the 8 rows (row scanning). The peak current per LED would be set by the driver circuitry to achieve the desired brightness, considering the total multiplexing duty cycle (e.g., 1/32 if scanning 4 displays * 8 rows). The power supply must be sized to deliver the total average current for all illuminated dots.

11. Operating Principle Introduction

The LTP-18088KD operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward voltage exceeding the diode's threshold is applied across an AlInGaP LED chip, electrons and holes recombine in the active region, releasing energy in the form of photons (light). The specific composition of the AlInGaP semiconductor alloy determines the bandgap energy, which defines the wavelength (color) of the emitted light—in this case, hyper red. The 64 individual LED chips are arranged in a matrix with common anode columns and common cathode rows. By selectively applying a positive voltage to a specific column (anode) and grounding a specific row (cathode), only the LED at the intersection of that row and column turns on. By rapidly sequencing through this process (multiplexing), all desired dots can be illuminated to form a stable image.

12. Technology Trends

Display technology is continuously evolving. While discrete LED dot matrices like the LTP-18088KD remain relevant for specific embedded applications due to their robustness, simplicity, and high brightness, several trends are notable. There is a move towards surface-mount device (SMD) LED arrays for higher density and automated assembly. Integrated LED driver matrices with built-in controllers (like I2C or SPI interfaces) are simplifying design complexity. For color applications, RGB LED matrices are becoming more common. Furthermore, in many consumer applications, small OLED or TFT LCD modules are displacing monochrome LED dot matrices where full graphics, color, and lower power in always-on scenarios are required. However, for applications demanding extreme brightness, long lifetime, wide temperature range, and simplicity, AlInGaP-based dot matrix displays continue to hold a strong position.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.