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0.56-inch AlInGaP Hyper Red LED Display Digit - 14.22mm Height - 2.6V Forward Voltage - English Technical Datasheet

Technical datasheet for a 0.56-inch (14.22mm) height, hyper red LED display digit. Features AlInGaP technology, common anode configuration, and detailed electrical/optical specifications.
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PDF Document Cover - 0.56-inch AlInGaP Hyper Red LED Display Digit - 14.22mm Height - 2.6V Forward Voltage - English Technical Datasheet

1. Product Overview

This document details the specifications for a high-performance, 0.56-inch (14.22 mm) digit height LED display component. The device is engineered for applications requiring clear, bright numeric or alphanumeric indication with excellent visibility and reliability. Its core design focuses on delivering superior optical performance through advanced semiconductor materials.

The display utilizes a solid-state design, ensuring long operational life and robustness against vibration and shock, making it suitable for industrial, instrumentation, and consumer electronic applications where dependable visual output is critical.

1.1 Core Advantages and Target Market

The primary advantages of this display digit stem from its material technology and optical design. The use of Aluminium Indium Gallium Phosphide (AlInGaP) semiconductor material on a non-transparent Gallium Arsenide (GaAs) substrate is a key differentiator. This material system is renowned for its high efficiency in the red to amber portion of the visible spectrum, contributing directly to the device's high brightness and excellent color purity.

The combination of a light gray face and white segment color is specifically chosen to maximize contrast ratio. This enhances readability under various ambient lighting conditions, from dimly lit environments to brightly lit rooms. The wide viewing angle ensures that the displayed information remains legible even when viewed from off-axis positions, which is crucial for panel meters, test equipment, and public information displays.

The low power requirement is another significant benefit, allowing for integration into battery-powered or energy-efficient systems without compromising on display brightness. The device is categorized for luminous intensity, providing consistency and predictability in brightness levels across production batches, which is essential for multi-digit displays where uniform appearance is mandatory.

The target market encompasses a broad range of sectors including industrial automation (for process control readouts), test and measurement equipment (multimeters, oscilloscopes), medical devices, automotive dashboards (for auxiliary displays), and consumer appliances. Its reliability and performance make it a preferred choice for designers needing a durable and clear numeric display solution.

2. Technical Parameter Deep-Dive

A thorough understanding of the electrical and optical parameters is essential for proper circuit design and achieving the desired performance in the final application.

2.1 Photometric and Optical Characteristics

The optical performance is defined under standard test conditions at an ambient temperature (Ta) of 25\u00b0C. The Average Luminous Intensity (Iv) is specified with a minimum of 320 \u00b5cd, a typical value of 700 \u00b5cd, and no stated maximum, when driven at a forward current (IF) of 1mA. This parameter, measured using a filter approximating the CIE photopic eye-response curve, indicates the perceived brightness. The wide range suggests careful binning is required for intensity-matched applications.

The Dominant Wavelength (\u03bbd) is 639 nm, classifying the output as a hyper red color. The Peak Emission Wavelength (\u03bbp) is typically 650 nm. The small difference between dominant and peak wavelength indicates a spectrally pure output. The Spectral Line Half-Width (\u0394\u03bb) is 20 nm, which describes the narrowness of the emitted light's spectrum; a smaller value indicates a more monochromatic light source.

The Luminous Intensity Matching Ratio (Iv-m) is specified as 2:1 maximum when segments are driven at 10mA. This ratio defines the allowable variation in brightness between different segments of the same digit or between digits, ensuring visual uniformity in the displayed number.

2.2 Electrical and Thermal Characteristics

The key electrical parameter is the Forward Voltage per Segment (VF), which has a typical value of 2.6V at a drive current (IF) of 20mA. The minimum is listed as 2.1V. This voltage is crucial for designing the current-limiting circuitry. The Reverse Current per Segment (IR) is a maximum of 100 \u00b5A when a reverse voltage (VR) of 5V is applied, indicating the diode's leakage characteristic in the off-state.

Thermal and reliability limits are defined under Absolute Maximum Ratings. The Continuous Forward Current per Segment is 25 mA at 25\u00b0C, with a derating factor of 0.28 mA/\u00b0C. This means the allowable continuous current decreases linearly as the ambient temperature rises above 25\u00b0C. Exceeding these ratings may cause permanent damage.

The Peak Forward Current per Segment is rated for 90 mA but only under specific pulsed conditions: a 1/10 duty cycle and a 0.1ms pulse width. This allows for brief periods of overdrive for multiplexing or achieving higher peak brightness. The Power Dissipation per Segment is limited to 70 mW. The device can operate and be stored within a wide temperature range of -35\u00b0C to +105\u00b0C. The solder temperature must not exceed 260\u00b0C for more than 3 seconds at a distance of 1.6mm below the seating plane during assembly.

3. Mechanical and Packaging Information

The physical construction of the device determines its footprint, mounting requirements, and overall integration into a product.

3.1 Package Dimensions and Pinout

The device conforms to a standard dual-digit LED display package. All dimensions are provided in millimeters with a standard tolerance of \u00b10.25 mm unless otherwise specified on the dimensional drawing. This drawing is essential for PCB layout designers to create the correct footprint, ensuring proper mechanical fit and solder joint formation.

The pin connection scheme is critical for correct interfacing. The device has a Common Anode configuration. There are two separate common anode pins: Pin 12 for Digit 1 and Pin 9 for Digit 2. This allows independent control or multiplexing of the two digits. The segment cathodes (A through G, and Decimal Point) are connected in parallel across both digits. For example, Pin 11 (Cathode A) controls the 'A' segment of both Digit 1 and Digit 2. Pins 6 and 8 are noted as \"No Connection\" (N/C). A detailed internal circuit diagram typically shows this common-anode, parallel-cathode structure for two digits.

4. Performance Curve Analysis

While the datasheet provides tabular data, the typical characteristic curves offer deeper insight into the device's behavior under non-standard conditions.

The forward voltage (VF) versus forward current (IF) curve is fundamental. It shows the non-linear relationship where VF increases with IF. Designers use this to select an appropriate current-limiting resistor value for a given supply voltage to achieve the target drive current (e.g., 10mA or 20mA).

The luminous intensity (Iv) versus forward current (IF) curve demonstrates how brightness scales with current. It is generally linear at lower currents but may saturate at higher currents due to thermal and efficiency effects. This curve helps designers balance brightness against power consumption and device longevity.

The luminous intensity versus ambient temperature curve is crucial for understanding thermal derating. As temperature increases, the efficiency of the LED chip decreases, leading to a drop in output intensity for the same drive current. This must be accounted for in applications subjected to high operating temperatures to ensure the display remains sufficiently bright.

5. Soldering and Assembly Guidelines

Proper handling during the assembly process is vital to prevent damage and ensure long-term reliability.

The absolute maximum rating for soldering is explicitly stated: the device can withstand a maximum temperature of 260\u00b0C for a maximum duration of 3 seconds, measured at a point 1.6mm (1/16 inch) below the seating plane of the package. This guideline is designed for wave soldering or reflow soldering processes. Exceeding these time-temperature limits can cause internal wire bond failure, package cracking, or degradation of the LED chip.

It is recommended to follow standard JEDEC or IPC guidelines for moisture sensitivity and baking procedures if the devices are stored in non-controlled environments before use, although a specific level is not stated in this datasheet. Using ESD (Electrostatic Discharge) precautions during handling is always advised for semiconductor components.

6. Application Suggestions and Design Considerations

Integrating this display requires careful electrical and optical design.

6.1 Driving Circuit Design

For a common anode display, the anodes are typically connected to a positive voltage supply through current-limiting resistors or switched via transistors. The segment cathodes are connected to the driver IC (like a dedicated display driver or microcontroller GPIO pins) which sinks current to ground to illuminate the segment. The value of the current-limiting resistor (R) is calculated using Ohm's Law: R = (Vcc - VF - Vdriver_sat) / IF, where Vcc is the supply voltage, VF is the forward voltage of the LED segment (use typical or max value for reliability), Vdriver_sat is the saturation voltage of the driver transistor or IC, and IF is the desired forward current.

For multiplexing two digits, the common anodes (Pins 9 and 12) are switched on alternately at a high frequency (typically >100Hz). When Digit 1's anode is active, the cathode drivers present the pattern for Digit 1. Then, Digit 2's anode is activated with its corresponding pattern. This reduces the number of required driver pins significantly but requires careful timing to avoid flicker and ghosting.

6.2 Optical Integration

The light gray face provides a neutral, non-reflective background that enhances contrast. When designing the product enclosure, consider the use of a window or filter. A neutral density filter can be used to reduce brightness in very dark environments, while a tinted filter (e.g., red) can enhance contrast further in bright conditions. The wide viewing angle should be considered when positioning the display relative to the expected user sightlines.

7. Technical Comparison and Differentiation

The key differentiator of this device is its use of AlInGaP (Aluminium Indium Gallium Phosphide) technology. Compared to older technologies like standard GaAsP (Gallium Arsenide Phosphide) red LEDs, AlInGaP offers significantly higher luminous efficiency. This means it produces more light (lumens) for the same amount of electrical power (watts), resulting in higher brightness and/or lower power consumption.

Furthermore, AlInGaP LEDs generally have superior temperature stability and longer lifetime due to better material properties. The \"hyper red\" output (639nm dominant wavelength) is also a distinct, saturated red color compared to the often orange-tinted red of older technologies. When compared to contemporary alternatives, the specific combination of 0.56-inch digit height, common anode configuration, and the guaranteed luminous intensity categorization are its defining features for designers selecting a display.

8. Frequently Asked Questions (Based on Technical Parameters)

Q: What does \"categorized for luminous intensity\" mean?
A: It means the LEDs are tested and sorted (binned) based on their measured light output at a standard test current. This ensures consistency when multiple digits are used side-by-side, preventing one digit from appearing noticeably brighter or dimmer than its neighbors.

Q: Can I drive this display directly from a 5V microcontroller pin?
A: No, not directly. The typical forward voltage is 2.6V, and a microcontroller GPIO pin cannot source or sink enough current safely (usually 20-40mA max per pin, with a total limit for the chip). You must use external current-limiting resistors and likely transistor drivers or a dedicated display driver IC to provide the correct current and voltage.

Q: Why are there two separate common anode pins for two digits?
A: This enables multiplexing. By turning on the anode for Digit 1 and setting its segments, then turning it off and turning on the anode for Digit 2 with its segments, and repeating this cycle rapidly, you can control two digits using only 7 segment pins + 2 digit pins = 9 pins, instead of 7 x 2 = 14 pins if each segment were independently wired.

Q: What is the purpose of the \"No Connection\" (N/C) pins?
A: They are physically present pins on the package that are not electrically connected to the internal LED circuit. They are often included for mechanical stability of the package during the molding process or to maintain a standard pin spacing and footprint. They must not be connected in the circuit.

9. Principle of Operation Introduction

An LED (Light Emitting Diode) is a semiconductor p-n junction diode. When a forward voltage exceeding the diode's threshold is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers (electrons and holes) recombine, they release energy. In a standard silicon diode, this energy is released primarily as heat. In a material like AlInGaP, the energy bandgap is such that a significant portion of this recombination energy is released as photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. AlInGaP's bandgap is engineered to produce light in the red to amber region of the spectrum with high efficiency. The non-transparent GaAs substrate helps reflect more of the generated light out through the top of the device, improving overall light extraction efficiency.

10. Development Trends

The field of display technology is continuously evolving. While discrete LED digits like this one remain vital for specific applications due to their simplicity, brightness, and reliability, several trends are notable. There is a general movement towards higher integration, such as multi-digit modules with built-in controllers (I2C or SPI interface) that simplify the host microcontroller's task. The pursuit of higher efficiency continues, potentially moving from AlInGaP to even more advanced material systems for red/orange emission. Furthermore, the demand for wider color gamuts and specific chromaticity coordinates in professional applications may drive more precise binning and tighter specifications on dominant wavelength and color purity. However, the fundamental advantages of the discrete LED digit\u2014ruggedness, high brightness, low cost for simple numeric display, and excellent viewing angle\u2014ensure its continued relevance in many industrial and commercial products.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.