Amber LED 1.6x0.8x0.7mm - 20mA 2.0V 72mW - 140° Viewing Angle - Technical Data Sheet

1. Product Overview

1.1 General Description

This product is an amber colored SMD LED fabricated using an amber chip. The package dimensions are 1.6mm x 0.8mm x 0.7mm, making it suitable for compact electronic assemblies. The LED offers an extremely wide viewing angle of 140 degrees, ensuring uniform light distribution in indicator and display applications.

1.2 Features

• Extremely wide viewing angle of 140°.
• Compatible with all SMT assembly and solder processes.
• Moisture sensitivity level: Level 3 (per IPC/JEDEC J-STD-020).
• RoHS compliant.

1.3 Application

• Optical indicators.
• Switches, symbols, and displays.
• General purpose lighting and signaling.

2. Package Dimensions and Soldering Patterns

2.1 Mechanical Dimensions

The LED package has a rectangular body with dimensions 1.6mm (length) x 0.8mm (width) x 0.7mm (height). The top view shows the light emitting area arrangement, while the bottom view indicates the two solder pads with polarity marking. The dimensions are in millimeters with tolerances of ±0.2mm unless otherwise noted.

The side view illustrates the height of 0.7mm and a small chamfer on one corner for polarity identification. The polarity is further indicated by a mark on the bottom side.

2.2 Recommended Soldering Pattern

For optimal solder joint reliability, the recommended PCB land pattern is provided. The pattern consists of two rectangular pads spaced 0.8mm apart, each 0.8mm wide, with a total width of 2.4mm. The solder paste stencil should be designed accordingly to achieve proper solder volume.

3. Electrical and Optical Characteristics

3.1 Forward Voltage Binning

At a test current of 20mA and temperature Ts=25°C, the forward voltage (VF) is categorized into three bins:

• Bin B0: 1.8V to 2.0V (typical 1.9V)
• Bin C0: 2.0V to 2.2V (typical 2.1V)
• Bin D0: 2.2V to 2.4V (typical 2.3V)

The measurement tolerance for forward voltage is ±0.1V. These bins allow customers to select LEDs with consistent voltage for parallel or series configurations.

3.2 Dominant Wavelength Binning

The dominant wavelength (λD) is measured at 20mA and 25°C, with two bins covering the amber spectrum:

• Bin A00: 600nm to 605nm
• Bin B00: 605nm to 610nm

The measurement tolerance is ±2nm. The spectral half bandwidth is typically 15nm, indicating a relatively narrow color spectrum suitable for monochromatic indicators.

3.3 Luminous Intensity Binning

The luminous intensity (IV) is binned into four groups at 20mA:

• F20: 80 to 100 mcd
• G10: 100 to 120 mcd
• G20: 120 to 150 mcd
• H10: 150 to 180 mcd

Measurement tolerance is ±10%.

3.4 Viewing Angle and Reverse Current

The viewing angle (2θ1/2) is typically 140 degrees, ensuring a wide radiation pattern. The reverse current at VR=5V is a maximum of 10μA, indicating good junction quality.

3.5 Thermal Resistance

The thermal resistance from junction to solder point (RTHJ-S) is a maximum of 450°C/W. This parameter is important for thermal management in high-current applications.

4. Absolute Maximum Ratings

The LED must not be operated beyond the following absolute maximum ratings at Ts=25°C:

• Power Dissipation: 72 mW
• Forward Current: 30 mA (continuous)
• Peak Forward Current (pulse): 60 mA (1/10 duty cycle, 0.1ms pulse width)
• Electrostatic Discharge (HBM): 2000 V
• Operating Temperature: -40 to +85 °C
• Storage Temperature: -40 to +85 °C
• Junction Temperature: 95 °C

Care must be taken to ensure that the product does not exceed these limits, as doing so may cause permanent damage.

5. Typical Optical Characteristics Curves

The following curves illustrate the typical performance of the LED under various conditions (all measured at Ts=25°C unless stated otherwise):

5.1 Forward Voltage vs. Forward Current

As forward current increases from 0 to 30mA, the forward voltage increases approximately linearly from about 1.8V to 2.4V (depending on bin). This relationship is important for driver design.

5.2 Forward Current vs. Relative Intensity

Relative luminous intensity increases with forward current in a nearly linear fashion up to 30mA, with some saturation at higher currents.

5.3 Pin Temperature vs. Relative Intensity

At higher pin temperatures, the relative intensity decreases. The curve shows that at 85°C, the intensity may drop to about 70% of the 25°C value.

5.4 Forward Current vs. Dominant Wavelength

Dominant wavelength shifts slightly with forward current. At 20mA, the wavelength is within the specified bin, but at higher currents a small red shift may occur.

5.5 Relative Intensity vs. Wavelength

The spectral distribution shows a peak intensity around 605nm with a half bandwidth of approximately 15nm.

5.6 Radiation Pattern

The radiation pattern is Lambertian-like with a wide 140° viewing angle. The relative intensity drops to 50% at 70° off-axis.

6. Packaging Information

6.1 Carrier Tape Dimensions

The LEDs are packaged in carrier tape with a width of 8.0mm and pocket pitch of 4.0mm. Each pocket holds one LED with polarity orientation marked. The tape is sealed with a top cover tape. The dimensions are: width 8.00mm, pocket pitch 4.00mm, pocket depth 0.95mm, and distance to sprocket hole 2.00mm.

6.2 Reel Dimensions

Each reel has a diameter of 178mm ±1mm, width of 8.0mm ±0.1mm, hub diameter of 60mm ±1mm, and center hole diameter of 13.0mm ±0.5mm. The reel contains 4000 LEDs per reel.

6.3 Label Information

The label includes part number, spec number, lot number, bin code (including luminous flux, chromaticity, forward voltage, wavelength), quantity, and date. The bin code encodes the specific performance category for traceability.

6.4 Moisture Resistant Packing

The reels are placed in a moisture barrier bag with a desiccant and a humidity indicator card. The bag is sealed and labeled. The moisture sensitivity level is 3, meaning the LEDs have a floor life of 168 hours once the bag is opened, under conditions of ≤30°C and ≤60% RH.

6.5 Cardboard Box

The sealed bags are packed in cardboard boxes for shipment. The box provides mechanical protection and stacking capability.

7. Reliability Test Items and Criteria

7.1 Reliability Tests

The LED has been qualified through various reliability tests according to JEDEC standards. These include:

• Reflow Soldering: 260°C max for 10 seconds, 2 times
• Temperature Cycle: -40°C to 100°C, 100 cycles
• Thermal Shock: -40°C to 100°C, 300 cycles
• High Temperature Storage: 100°C for 1000 hours
• Low Temperature Storage: -40°C for 1000 hours
• Life Test: 25°C, 20mA for 1000 hours

All tests were performed on 22 samples with acceptance criteria of 0 failures and 1 reject.

7.2 Failure Criteria

After stress, the LED is considered failed if:

• Forward voltage exceeds 1.1 times the upper specification limit.
• Reverse current exceeds 2.0 times the upper specification limit.
• Luminous flux drops below 0.7 times the lower specification limit.

8. SMT Reflow Soldering Instructions

8.1 Reflow Profile

The recommended reflow soldering profile is as follows (per JEDEC J-STD-020):

• Average ramp-up rate (Tsmax to TP): max 3°C/s
• Preheat: 150°C to 200°C for 60 to 120 seconds
• Time above 217°C (TL): max 60 seconds
• Peak temperature (TP): 260°C
• Time within 5°C of peak: max 30 seconds
• Ramp-down rate: max 6°C/s
• Time from 25°C to peak: max 8 minutes

Reflow soldering should not be performed more than twice. If more than 24 hours elapse between two soldering processes, the LEDs may absorb moisture and require baking.

8.2 Hand Soldering

If hand soldering is necessary, the iron temperature must be below 300°C and contact time less than 3 seconds. Hand soldering is limited to one time only.

8.3 Repairing

Repair after reflow is not recommended. If unavoidable, a double-head soldering iron should be used, and the effect on LED characteristics should be verified.

8.4 Cautions

• Do not mount LEDs on warped PCB sections.
• Do not apply mechanical force or vibration during cooling after soldering.
• Do not rapidly cool the device.

9. Handling Precautions and Storage

9.1 Environmental Considerations

The operating environment and mating materials should contain less than 100PPM of sulfur and its compounds to prevent corrosion of the silver plated leadframe. Additionally, the single content of Bromine and Chlorine should each be less than 900PPM, and their total content less than 1500PPM.

9.2 Volatile Organic Compounds (VOCs)

VOCs emitted from fixture materials can penetrate the silicone encapsulant and cause discoloration under heat and light, leading to significant light loss. The manufacturer advises against using any chemicals that may adversely affect device performance. Compatibility testing is recommended for all materials in contact with the LED.

9.3 Circuit Design

The current through each LED must not exceed the absolute maximum rating. A current-limiting resistor should be used to prevent damage from slight voltage shifts. The circuit should only apply forward voltage during operation; reverse voltage can cause migration and damage.

9.4 Thermal Design

Thermal management is critical as heat generation reduces luminous efficiency and shifts color. Adequate heat sinking and PCB design are necessary to keep the junction temperature below the maximum rating of 95°C.

9.5 Storage Conditions

• Before opening the aluminum bag: store at ≤30°C and ≤75% RH for up to 1 year from date.
• After opening: store at ≤30°C and ≤60% RH for up to 168 hours.
• If storage conditions are exceeded or the bag is damaged, bake at 60±5°C for ≥24 hours before use.

9.6 ESD Protection

LEDs are sensitive to electrostatic discharge and electrical overstress. Proper ESD control measures (e.g., grounded workstations, antistatic bags) should be employed during handling and assembly.

For additional information, please refer to the manufacturer's relevant application notes.