Amber LED 3.2x1.0x1.5mm - Forward Voltage 1.8-2.4V - Power 48mW - Dominant Wavelength 600-610nm - Technical Documentation

1. Product Overview

The RF-AUT112TS-ED is an amber-color surface-mount LED (SMD) designed for a wide range of optical indication applications. It utilizes a high-efficiency amber chip encapsulated in a compact package measuring 3.2mm x 1.0mm x 1.5mm. With an extremely wide viewing angle of 140 degrees, this LED provides excellent visibility and uniform light distribution. The component is suitable for all SMT assembly and soldering processes, with a moisture sensitivity level of 3 (MSL 3) and full RoHS compliance, ensuring environmental safety and ease of integration into modern electronics manufacturing.

1.1 Target Applications

• Optical indicators – status lights, panel indicators
• Switches and symbols – backlighting for buttons and legends
• Displays – segment displays, signboards
• General purpose – consumer electronics, automotive interior, industrial controls

2. Technical Parameter Analysis

2.1 Electro-Optical Characteristics (Ta=25°C, IF=20mA)

The forward voltage ranges from 1.8V to 2.4V at 20mA, typical for standard amber AlInGaP chips. The dominant wavelength is binned into two groups: A00 (600-605nm) and B00 (605-610nm), covering the amber spectrum. Luminous intensity is sorted into three brightness bins (1DW, 1AP, G20) providing flexibility for different brightness requirements. The narrow spectral width of 15nm ensures good color saturation.

2.2 Absolute Maximum Ratings

Designers must ensure that power dissipation does not exceed 48mW (equivalent to 20mA at 2.4V). The junction temperature must be kept below 95°C to avoid degradation. ESD withstand level of 2000V HBM requires proper handling during assembly.

3. Binning System

The device is binned according to wavelength, brightness, and forward voltage as shown on the reel label. Binning enables consistency in color and brightness for end products.

• Wavelength bins: A00 (600-605nm) and B00 (605-610nm)
• Luminous intensity bins: 1DW (70-90mcd), 1AP (90-120mcd), G20 (120-150mcd)
• Forward voltage: Grouped as VF value on label (typical range 1.8-2.4V)

The label also includes lot number, quantity, and date code for traceability.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (Fig 1-6)

The curve shows a typical diode forward characteristic: at 20mA the voltage is approximately 2.0V. The slope increases at higher currents due to series resistance.

4.2 Relative Intensity vs. Forward Current (Fig 1-7)

Relative intensity increases nearly linearly with current up to 30mA, with slight saturation above 25mA. Operating at 20mA gives good efficiency.

4.3 Temperature Dependence (Fig 1-8, 1-9)

Relative intensity decreases by about 15% when pin temperature rises from 25°C to 100°C. The maximum forward current must be derated at high temperatures: at 85°C ambient, the permissible current is reduced to about 10mA.

4.4 Wavelength Shift vs. Current (Fig 1-10)

The dominant wavelength shifts slightly towards longer wavelengths (red-shift) with increasing current, approximately 2-3nm from 5mA to 30mA.

4.5 Spectral Distribution (Fig 1-11)

The emission peak is around 605nm with a full width at half maximum (FWHM) of about 15nm, typical for amber AlInGaP LEDs.

4.6 Radiation Pattern (Fig 1-12)

The LED has a wide lambertian radiation pattern with half-angle of approximately 70° (140° total viewing angle), providing uniform illumination over a large area.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The package measures 3.2mm x 1.0mm x 1.5mm. The bottom view shows two anode pads and a cathode pad (polarity: pad 1 is anode, pad 2 is cathode). Recommended solder pads have dimensions 0.60mm x 0.70mm with 2.20mm pitch, providing adequate thermal and mechanical connection.

5.2 Carrier Tape and Reel

Supplied in 8mm wide carrier tape with 4mm pitch. Reel size: 178mm diameter, 60mm hub, 13mm arbor hole. Each reel contains 3000 pieces. The tape includes a top cover tape (1.25mm width) and cavities for the LEDs. Feeding direction is indicated on the tape.

5.3 Packaging and Labeling

The reel is sealed in a moisture barrier bag (MBB) with desiccant and humidity indicator card. The bag is then placed in a cardboard box. Each reel carries a label with part number, spec number, lot number, bin codes for luminous flux, chromaticity, voltage, wavelength, quantity, and date.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

Maximum two reflow cycles are allowed. The recommended profile: ramp-up rate ≤3°C/s, preheat 150-200°C for 60-120s, time above 217°C (TL) 60-150s, peak temperature 260°C for max 10s, cooling rate ≤6°C/s. Total time from 25°C to peak <8 minutes.

6.2 Hand Soldering

If hand soldering is necessary, use a soldering iron at <300°C for less than 3 seconds, one time only.

6.3 Repair and Rework

Rework is not recommended; if unavoidable, use a double-head soldering iron and pre-test the LED for damage.

6.4 Storage Conditions

Before opening the moisture barrier bag: store at ≤30°C and ≤75% RH for up to 1 year. After opening: ≤30°C, ≤60% RH, and must be used within 24 hours. If the bag is damaged or storage time exceeded, bake at 60±5°C for ≥24 hours before use.

7. Packaging and Ordering Information

The standard packaging is 3000 pcs per reel, 8mm tape, 178mm reel. The label format includes: PART NO., SPEC NO., LOT NO., BIN CODE, Φ (luminous flux bin), XY (chromaticity bin), VF (forward voltage bin), WLD (wavelength code), QTY, DATE.

8. Application Recommendations

• Current limiting resistor is mandatory for each LED; a small change in voltage can cause large current variation.
• Thermal management is critical: keep junction temperature below 95°C; consider derating at high ambient temperatures.
• Avoid exposing the LED to sulfur compounds (>100ppm), bromine/chlorine (>900ppm each, total <1500ppm).
• Do not use adhesives that outgas organic vapors; they can cause discoloration of the silicone lens.
• Handle by the sides, avoid touching the silicone lens surface.
• ESD precautions: use grounded workstations and wrist straps.
• Cleaning: use isopropyl alcohol; ultrasonic cleaning is not recommended.

9. Technical Comparison

Compared to standard 3528 or 2835 amber LEDs, this 3210 (3.2x1.0mm) package offers a much narrower footprint, ideal for compact designs like mobile devices and slim indicators. The 140° viewing angle is wider than many conventional SMD LEDs (typically 120°). The ESD rating of 2kV is standard for AlInGaP technology.

10. Frequently Asked Questions

Q: Can I drive the LED at 30mA continuously?
A: No, absolute maximum forward current is 20mA; 30mA would exceed power dissipation and may damage the LED.

Q: What is the typical lifespan of this amber LED?
A: With proper thermal management and within rated conditions, the LED can operate for more than 50,000 hours with acceptable lumen maintenance.

Q: How do I identify the cathode?
A: Refer to the polarity marking on the package bottom view (Fig 1-4); pad 1 is anode, pad 2 is cathode.

Q: Can I use this LED in outdoor applications?
A: The operating temperature range is -40 to +85°C, so it can be used outdoors if protected from moisture and direct sunlight. The package is not waterproof; conformal coating may be required.

11. Practical Design Case Study

Consider a status indicator for a smart home device requiring three amber LEDs to indicate different modes. The LEDs are placed on a PCB with a common anode configuration. Each LED is driven at 15mA with a series resistor calculated as (Vcc - VF)/IF. Assuming Vcc=3.3V and VF≈2.0V, each resistor should be (3.3-2.0)/0.015 ≈ 87Ω (use 91Ω standard). Thermal design: at 15mA, power per LED is 30mW, total 90mW for three LEDs, acceptable on a standard FR4 board without heatsink.

12. Underlying Principles

This amber LED is based on AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor technology. The direct bandgap emits light in the amber range (~600nm) when electrons recombine with holes. The device is a p-n junction diode; forward bias injects carriers that recombine radiatively. The wide viewing angle is achieved by the package lens design, typically a clear epoxy or silicone dome that spreads light.

13. Development Trends

Miniaturization continues: packages like 3.2x1.0mm are shrinking further to 2.0x1.0mm and even 1.6x0.8mm for ultra-slim products. Efficiency improvements in AlInGaP technology have pushed efficacy above 100 lm/W for amber, though the current part is a standard product. Integration of multiple chips in single packages enables RGB or tunable white. Additionally, better thermal management via advanced substrate materials (e.g., EMC, ceramic) allows higher drive currents while maintaining reliability.