Table of Contents
- 1. Product Overview
- 2. Technical Parameters Deep Dive
- 2.1 Electrical / Optical Characteristics
- 2.2 Absolute Maximum Ratings
- 3. Binning System
- 4. Performance Curves Analysis
- 4.1 Forward Voltage vs. Forward Current
- 4.2 Relative Intensity vs. Forward Current
- 4.3 Temperature Dependence
- 4.4 Wavelength Shift
- 4.5 Spectral Distribution
- 4.6 Radiation Pattern
- 5. Mechanical and Package Information
- 6. Soldering and Assembly Guidelines
- 7. Packaging and Ordering Information
- 8. Application Notes
- 9. Typical Comparisons with Similar Products
- 10. Frequently Asked Questions
- 11. Case Study: Dashboard Indicator
- 12. Principle of LED Operation
- 13. Development Trends in SMD LEDs
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This specification covers a surface-mount amber LED in a compact 3.2mm × 1.6mm × 0.7mm package. It is fabricated using an amber chip and designed for general indication and illumination purposes. Key features include an extremely wide viewing angle, compatibility with standard SMT assembly and solder processes, moisture sensitivity level 3, and RoHS compliance. Typical applications include optical indicators, switch and symbol displays, and general electronic equipment.
2. Technical Parameters Deep Dive
2.1 Electrical / Optical Characteristics
At an ambient temperature of 25°C and a forward current of 20mA, the LED exhibits the following characteristics (values are typical unless noted):
- Forward Voltage (VF): Available in three voltage bins: B0 (1.8-2.0V), C0 (2.0-2.2V), D0 (2.2-2.4V). Typical value is 2.0V.
- Dominant Wavelength (λD): Ranges from 600nm to 615nm depending on bin (A00: 600-605nm, B00: 605-610nm, C00: 610-615nm).
- Luminous Intensity (IV): Offered in four brightness bins: 1AP (90-120mcd), G20 (120-150mcd), 1AW (150-200mcd), 1GK (200-260mcd).
- Viewing Angle (2θ1/2): 140 degrees typical.
- Reverse Current (IR): Maximum 10μA at VR=5V.
- Thermal Resistance (RTHJ-S): Maximum 450 K/W (junction to solder point).
- Spectral Half Bandwidth: 15nm typical.
2.2 Absolute Maximum Ratings
The device should not be operated beyond the following limits:
- Power Dissipation (Pd): 72mW
- Forward Current (IF): 30mA (continuous), 60mA (peak, 1/10 duty cycle, 0.1ms pulse)
- Electrostatic Discharge (HBM): 2000V
- Operating Temperature: -40°C to +85°C
- Storage Temperature: -40°C to +85°C
- Junction Temperature: 95°C maximum
3. Binning System
The LED is sorted into multiple bins for voltage, wavelength, and luminous intensity to ensure consistency. The table below summarizes the bin codes:
| Parameter | Bin Code | Min | Typ | Max |
|---|---|---|---|---|
| Forward Voltage (VF) | B0 | 1.8V | – | 2.0V |
| C0 | 2.0V | – | 2.2V | |
| D0 | 2.2V | – | 2.4V | |
| Dominant Wavelength (λD) | A00 | 600nm | – | 605nm |
| B00 | 605nm | – | 610nm | |
| C00 | 610nm | – | 615nm | |
| Luminous Intensity (IV) | 1AP | 90mcd | – | 120mcd |
| G20 | 120mcd | – | 150mcd | |
| 1AW | 150mcd | – | 200mcd | |
| 1GK | 200mcd | – | 260mcd |
All measurements are taken at IF=20mA and Ta=25°C. Tolerances: VF ±0.1V, λD ±2nm, IV ±10%.
4. Performance Curves Analysis
4.1 Forward Voltage vs. Forward Current
Figure 1-6 shows a typical diode curve: forward current increases exponentially with forward voltage. At 20mA, VF is approximately 2.0V.
4.2 Relative Intensity vs. Forward Current
Figure 1-7 indicates that relative intensity increases nearly linearly with forward current up to 30mA, allowing for simple dimming control.
4.3 Temperature Dependence
Figure 1-8 shows that relative intensity decreases slightly with rising ambient temperature. At 100°C, intensity drops to about 70% of the 25°C value. Figure 1-9 provides the derating curve for forward current vs. pin temperature; the maximum allowed current decreases at higher temperatures to avoid exceeding the junction temperature limit.
4.4 Wavelength Shift
Figure 1-10 shows dominant wavelength changes with forward current. At 20mA, the wavelength is near the center of the bin range. As current increases, the wavelength may shift slightly due to temperature effects.
4.5 Spectral Distribution
Figure 1-11 presents the relative spectral intensity from 400nm to 700nm. The peak is around 600–615nm, corresponding to the amber color. The spectral half bandwidth is approximately 15nm, indicating a pure color.
4.6 Radiation Pattern
Figure 1-12 shows a wide viewing angle of 140°. The intensity is relatively uniform across ±70°, making this LED suitable for indicator applications requiring broad visibility.
5. Mechanical and Package Information
The LED is housed in a standard 3.2mm × 1.6mm × 0.7mm (length × width × height) surface-mount package. The package drawings indicate polarity: pin 1 is marked as the anode, pin 2 as the cathode. Recommended soldering patterns are provided in Figure 1-5, with dimensions in millimeters. The PCB pad layout should include a thermal pad to enhance heat dissipation. All dimensions have a tolerance of ±0.2mm unless otherwise noted.
6. Soldering and Assembly Guidelines
The LED is designed for standard SMT reflow soldering. The recommended reflow profile should follow JEDEC standards, with a peak temperature of 260°C for no more than 10 seconds (two passes maximum). The product is moisture sensitive (MSL level 3), so it must be handled according to IPC/JEDEC J-STD-020. If the moisture barrier bag is opened, the devices must be used within 168 hours, or they need to be baked before soldering. Avoid exposure to conditions exceeding 30°C/60% RH. Hand soldering is not recommended; if necessary, use a soldering iron set to 350°C for no more than 3 seconds per pad.
7. Packaging and Ordering Information
The LED is supplied on 8mm wide carrier tape in a 178mm diameter reel, with 4000 pieces per reel. The carrier tape has a pitch of 4mm and a feeding direction as indicated. Each reel is placed in a moisture barrier bag together with a desiccant and a humidity indicator card. The label contains the part number, spec number, lot number, bin code, quantity, and date. The sealed bag is packed into a cardboard box for shipping. For reliability, the product has passed temperature cycling (-40°C to +100°C, 100 cycles), thermal shock (300 cycles), high-temperature storage (100°C, 1000h), low-temperature storage (-40°C, 1000h), and life test (20mA at 25°C, 1000h). Acceptance criteria are defined: forward voltage must not exceed 1.1× upper spec limit, reverse current must not exceed 2× upper spec limit, and luminous flux must not drop below 0.7× lower spec limit.
8. Application Notes
This amber LED is ideal for use as an optical indicator in consumer electronics, automotive interior lighting, industrial control panels, and backlighting for switches and symbols. Due to its wide viewing angle, it is effective in applications where the indication must be visible from various angles. Designers should consider using a current-limiting resistor to ensure the forward current does not exceed 30mA (or the derated value at elevated temperatures). For pulsed operation, a peak current of up to 60mA is permissible with a low duty cycle (≤10%) and short pulse width (≤0.1ms). Proper thermal management, such as a thermal pad or via array on the PCB, helps to keep the junction temperature below 95°C. ESD protection is recommended as the device is rated for 2000V HBM; consider adding a series resistor or Zener diode if the application is susceptible to electrostatic discharges.
9. Typical Comparisons with Similar Products
Compared to standard 0603 (1.6×0.8mm) amber LEDs, this 3.2×1.6mm package offers higher luminous intensity (up to 260mcd) and a wider viewing angle (140° vs typical 120°). The larger thermal pad allows for better heat dissipation, enabling higher forward current for brighter output. Its low thermal resistance (450K/W) ensures stable performance over temperature. Furthermore, the tight binning (several voltage and wavelength bins) provides greater design flexibility and color consistency than many generic amber LEDs.
10. Frequently Asked Questions
Q: What is the recommended operating current for maximum reliability? A: For long life, operating at 20mA (the test condition) is recommended. Higher currents (up to 30mA) are possible with adequate thermal management.
Q: Can this LED be used in outdoor applications? A: The operating temperature range is -40°C to +85°C, so it can be used outdoors if sealed against moisture. However, the package itself is not waterproof.
Q: How should I interpret the bin codes? A: Bins are used to group LEDs with similar characteristics. When ordering, you can specify a preferred bin to ensure tight tolerance in your application.
Q: Is this LED compatible with lead-free soldering? A: Yes, it is RoHS compliant and compatible with lead-free reflow profiles with a peak temperature of 260°C.
11. Case Study: Dashboard Indicator
In an automotive dashboard indicator design, the amber LED was chosen for its high brightness (260mcd) and wide viewing angle to be visible to both driver and passengers. The LED was driven at 20mA with a 120Ω series resistor from a 5V supply. The PCB was designed with a thermal pad connected to a ground plane. After 1000 hours of operation at 85°C ambient, the luminous intensity dropped less than 10%, demonstrating excellent reliability.
12. Principle of LED Operation
An LED (light-emitting diode) is a semiconductor device that emits light when current flows through it. The amber color is achieved by using a specific semiconductor material (e.g., AlGaInP) that emits photons with wavelengths around 600-615nm. The forward voltage is determined by the bandgap of the material. The luminous intensity is proportional to the current, up to a limit where thermal effects cause efficiency droop. The wide viewing angle is achieved by the package design, which often includes a diffuser or a hemispherical lens.
13. Development Trends in SMD LEDs
The trend for SMD LEDs continues toward smaller packages with higher efficiency and better thermal management. The 3.2×1.6mm package (often called 1206) is a standard size that balances brightness and footprint. Future developments may include even narrower spectral bandwidths for saturated colors, increased ESD robustness, and integration of multiple dies for tunable color. This amber LED meets current industry requirements for reliability, RoHS compliance, and compatibility with automated assembly processes.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |