Table of Contents
- 1. Product Overview
- 1.1 Key Features
- 1.2 Typical Applications
- 2. Technical Parameter Analysis
- 2.1 Electrical and Optical Characteristics (at TS=25°C, IF=20mA)
- 2.2 Absolute Maximum Ratings (at TS=25°C)
- 3. Binning System Explanation
- 3.1 Wavelength Bins
- 3.2 Luminous Intensity Bins
- 3.3 Voltage Bins
- 4. Performance Curves Analysis
- 4.1 Forward Voltage vs. Forward Current (Fig 1-6)
- 4.2 Relative Intensity vs. Forward Current (Fig 1-7)
- 4.3 Temperature Characteristics (Fig 1-8, 1-9)
- 4.4 Wavelength Shift vs. Current (Fig 1-10)
- 4.5 Spectral Distribution (Fig 1-11)
- 4.6 Radiation Pattern (Fig 1-12)
- 5. Mechanical and Packaging Information
- 5.1 Package Dimensions
- 5.2 Recommended Soldering Pad Pattern
- 5.3 Polarity
- 5.4 Carrier Tape and Reel Dimensions
- 5.5 Label Information
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering
- 6.3 Storage and Baking Conditions
- 7. Application Recommendations
- 7.1 Typical Use Cases
- 7.2 Design Considerations
- 8. Technical Comparison with Similar Products
- 9. Frequently Asked Questions
- 9.1 Can I use this LED for outdoor applications?
- 9.2 What is the recommended storage if I don't use all LEDs at once?
- 9.3 Can I clean the LED with ultrasonic cleaning?
- 9.4 What happens if I apply reverse voltage?
- 10. Practical Application Examples
- 10.1 Smart Home Indicator
- 10.2 Automotive Dashboard Backlight
- 11. Operating Principle of Amber LEDs
- 12. Industry Trends and Future Directions
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
This specification covers the amber SMD LED, a surface-mount device fabricated using an amber chip. The package dimensions are 1.6mm x 0.8mm x 0.98mm (length x width x height), making it suitable for compact designs. The LED emits light in the amber spectrum with a dominant wavelength range of 600nm to 610nm under typical test conditions (IF=20mA). It is designed for general-purpose optical indication and backlighting applications where a wide viewing angle and high reliability are required.
1.1 Key Features
- Extremely wide viewing angle of 140° (2θ1/2)
- Suitable for all SMT assembly and soldering processes
- Moisture sensitivity level: Level 3 (per JEDEC)
- RoHS compliant and free of hazardous substances
- Compact 1.6x0.8mm footprint with low profile (0.98mm)
1.2 Typical Applications
- Optical indicators in consumer electronics
- Switch and symbol backlighting
- General-purpose visual indication
- Automotive interior lighting (non-critical)
2. Technical Parameter Analysis
2.1 Electrical and Optical Characteristics (at TS=25°C, IF=20mA)
| Parameter | Symbol | Min | Typ | Max | Unit |
|---|---|---|---|---|---|
| Spectral Half Bandwidth | Δλ | -- | 15 | -- | nm |
| Forward Voltage (Bin B0) | VF | 1.8 | -- | 2.0 | V |
| Forward Voltage (Bin C0) | VF | 2.0 | -- | 2.2 | V |
| Forward Voltage (Bin D0) | VF | 2.2 | -- | 2.4 | V |
| Dominant Wavelength (Bin A00) | λD | 600 | -- | 605 | nm |
| Dominant Wavelength (Bin B00) | λD | 605 | -- | 610 | nm |
| Luminous Intensity (Bin F00) | IV | 65 | -- | 100 | mcd |
| Luminous Intensity (Bin G00) | IV | 100 | -- | 150 | mcd |
| Luminous Intensity (Bin H00) | IV | 150 | -- | 230 | mcd |
| Luminous Intensity (Bin I00) | IV | 230 | -- | 350 | mcd |
| Viewing Angle | 2θ1/2 | -- | 140 | -- | deg |
| Reverse Current (at VR=5V) | IR | -- | -- | 10 | μA |
| Thermal Resistance (Junction to Solder) | RTHJ-S | -- | -- | 450 | °C/W |
2.2 Absolute Maximum Ratings (at TS=25°C)
| Parameter | Symbol | Rating | Unit |
|---|---|---|---|
| Power Dissipation | Pd | 72 | mW |
| Forward Current | IF | 30 | mA |
| Peak Forward Current (Pulse, 1/10 Duty, 0.1ms) | IFP | 60 | mA |
| Electrostatic Discharge (HBM) | ESD | 2000 | V |
| Operating Temperature | Topr | -40 ~ +85 | °C |
| Storage Temperature | Tstg | -40 ~ +100 | °C |
| Junction Temperature | Tj | 105 | °C |
Note: The maximum ratings must not be exceeded even momentarily. Proper thermal management is required to keep junction temperature below the limit.
3. Binning System Explanation
The amber LED is sorted into different bins based on forward voltage (VF), dominant wavelength (λD), and luminous intensity (IV). This allows customers to select the exact performance grade needed for their application.
3.1 Wavelength Bins
Two wavelength bins are defined: A00 (600~605nm) and B00 (605~610nm). The typical half-bandwidth is 15nm, ensuring a narrow spectral output for color consistency.
3.2 Luminous Intensity Bins
Four intensity bins are available: F00 (65~100mcd), G00 (100~150mcd), H00 (150~230mcd), and I00 (230~350mcd). These bins cover a wide range of brightness requirements from low-power indicators to brighter backlighting.
3.3 Voltage Bins
Three forward voltage bins are specified at 20mA: B0 (1.8-2.0V), C0 (2.0-2.2V), and D0 (2.2-2.4V). This enables precise current regulation in series resistor circuits.
4. Performance Curves Analysis
4.1 Forward Voltage vs. Forward Current (Fig 1-6)
The curve shows typical exponential diode behavior. At 20mA, forward voltage is approximately 2.0V. The curve is nearly linear above threshold, allowing current to be approximated by a series resistor.
4.2 Relative Intensity vs. Forward Current (Fig 1-7)
Relative luminous intensity increases almost linearly with forward current up to 30mA. At 20mA the intensity is normalized to 1.0; at 10mA it drops to about 0.5. This is typical for standard amber LEDs.
4.3 Temperature Characteristics (Fig 1-8, 1-9)
As ambient temperature rises from 25°C to 100°C, relative intensity decreases by about 10%. The maximum allowable forward current must be derated when the pin temperature exceeds 60°C to avoid exceeding the junction temperature limit.
4.4 Wavelength Shift vs. Current (Fig 1-10)
Dominant wavelength shifts slightly with current: from about 605nm at 5mA to 604nm at 30mA. This small blue-shift is negligible for most applications.
4.5 Spectral Distribution (Fig 1-11)
The spectral peak is near 610nm with a half-width of 15nm. The emission is concentrated in the amber region, suitable for human eye sensitivity.
4.6 Radiation Pattern (Fig 1-12)
The LED has a wide radiation pattern with a typical half-angle of 140° (2θ1/2). The intensity falls off gradually, providing uniform illumination over a large angle.
5. Mechanical and Packaging Information
5.1 Package Dimensions
The LED package measures 1.6mm (length) x 0.8mm (width) x 0.98mm (height). Tolerances are ±0.2mm unless otherwise noted. The bottom view shows polarity marking (cathode indicated by a small corner mark). The anode pad is larger than the cathode pad to assist identification.
5.2 Recommended Soldering Pad Pattern
Two solder pads are recommended: each pad is 0.8mm x 0.8mm with a spacing of 0.7mm (center to center). The total landing zone ensures good mechanical stability and thermal conductivity.
5.3 Polarity
The LED has two terminals: terminal 1 is the anode (longer pad) and terminal 2 is the cathode (shorter pad with a marking). Proper orientation is required to avoid reverse bias damage.
5.4 Carrier Tape and Reel Dimensions
The LED is supplied in 8mm wide carrier tape with a pitch of 4mm. Each reel contains 4000 pieces. The reel outer diameter is 178±1mm, hub diameter 60±1mm, and tape width 8.0±0.1mm. Polarity is indicated on the tape pocket.
5.5 Label Information
Each reel is labeled with part number, specification number, lot number, bin codes (wavelength, luminous flux, voltage, chromaticity), quantity, and date. The moisture barrier bag also includes an ESD caution label.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
Recommended reflow soldering follows the JEDEC J-STD-020 profile. Key parameters:
- Ramp-up rate (Tsmax to TP): max 3°C/s
- Preheat range: 150°C to 200°C for 60-120s
- Time above 217°C: 60-150s
- Peak temperature: 260°C max for max 10s
- Cool-down rate: max 6°C/s
- Allowed number of reflow cycles: max 2
If more than 24 hours elapse between two reflow cycles, the LEDs must be baked to remove absorbed moisture.
6.2 Hand Soldering
Hand soldering is allowed only once, with iron temperature below 300°C and duration less than 3 seconds. No stress should be applied to the lens during soldering.
6.3 Storage and Baking Conditions
Before opening the sealed bag, store at ≤30°C and ≤75% RH for up to one year. After opening, the LEDs must be used within 168 hours (7 days) at ≤30°C and ≤60% RH. If the exposure time is exceeded or the moisture indicator shows a change, the LEDs must be baked at 60±5°C for >24 hours before use.
7. Application Recommendations
7.1 Typical Use Cases
Due to its small footprint and wide viewing angle, this amber LED is ideal for status indicators in portable devices, push-button backlighting, and symbol illumination in dashboard panels.
7.2 Design Considerations
- Current Limiting: Always use a series resistor to limit the forward current to the desired value. A small change in voltage can cause a large current change without a resistor.
- Thermal Management: Ensure adequate heat sinking, especially when operating near the maximum current. The junction temperature must not exceed 105°C.
- Reverse Voltage Protection: The LED is not designed for reverse bias. Use a protective diode if reverse voltage is possible in the circuit.
- ESD Sensitivity: This device is sensitive to electrostatic discharge (HBM 2kV). Use proper grounding and handling procedures.
- Chemical Compatibility: Avoid exposure to sulfur, bromine, chlorine, and volatile organic compounds (VOCs) above specified limits, as they can cause discoloration or failure.
- Cleaning: If cleaning is required after soldering, use isopropyl alcohol. Do not use ultrasonic cleaning, as it may damage the LED.
8. Technical Comparison with Similar Products
Compared to conventional amber LEDs in 0805 or 0603 packages, this device offers a wider viewing angle (140° vs typical 120°) and a lower profile (0.98mm versus 1.2mm). The spectral purity is similar, but the multi-bin intensity options allow finer granularity for brightness matching. Additionally, the moisture sensitivity Level 3 ensures reliable soldering under standard factory conditions.
9. Frequently Asked Questions
9.1 Can I use this LED for outdoor applications?
The LED is rated for -40°C to +85°C operating temperature, but it is not specifically UV-stabilized. For outdoor use, additional protection against moisture and UV is recommended.
9.2 What is the recommended storage if I don't use all LEDs at once?
Reseal the unused tape/reel in the moisture barrier bag with the included desiccant and store at ≤30°C and ≤75% RH. If the bag has been opened, use within 168 hours or bake before use.
9.3 Can I clean the LED with ultrasonic cleaning?
No, ultrasonic cleaning is not recommended as it can cause mechanical damage to the LED chip or wire bonds.
9.4 What happens if I apply reverse voltage?
Applying reverse voltage greater than 5V may cause a high leakage current and permanent damage. Always ensure correct polarity.
10. Practical Application Examples
10.1 Smart Home Indicator
A smart thermostat uses four amber LEDs as mode indicators. Each LED is driven at 15mA with a 120Ω series resistor from a 3.3V supply. The wide viewing angle ensures visibility from any direction.
10.2 Automotive Dashboard Backlight
In an automotive climate control panel, several amber LEDs illuminate symbols for fan speed, temperature, and air direction. The compact package allows placement behind thin light guides.
11. Operating Principle of Amber LEDs
This amber LED is based on an AlInGaP (aluminum indium gallium phosphide) semiconductor structure. When a forward current is applied, electrons and holes recombine in the active region, releasing photons with energy corresponding to the amber wavelength (approximately 2.0 eV). The quantum efficiency is high, resulting in bright output even at low currents.
12. Industry Trends and Future Directions
The trend in SMD LEDs is toward smaller packages with higher luminous efficacy and wider beam angles. Future developments may include integrated ESD protection, further reduction in thermal resistance, and improved compatibility with lead-free soldering processes. Amber LEDs remain popular for specific color requirements where red or yellow-green are not suitable.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |