2020 Cube Light LED Datasheet - Size 2.0x2.0x0.7mm - Voltage 2.5V - Power 0.125W - Super Red - English Technical Document

1. Product Overview

The 2020 Cube Light is a high-performance, surface-mount LED designed primarily for demanding automotive lighting applications. Its compact 2.0mm x 2.0mm footprint makes it suitable for space-constrained designs where reliable, bright illumination is required. The core advantages of this component include its qualification to the stringent AEC-Q102 automotive standard, ensuring performance and longevity under harsh environmental conditions, and its compliance with RoHS, REACH, and halogen-free directives. The target market is squarely focused on automotive interior and exterior lighting modules, including but not limited to dashboard indicators, center console lighting, and various signal lights.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The LED's key performance is defined at a standard test current of 50mA. Under this condition, it delivers a typical luminous flux of 6 lumens, with a minimum of 4 lm and a maximum of 10 lm. The dominant wavelength is centered at 629 nm (Super Red), with a typical range from 627 nm to 639 nm, defining its precise color point. The forward voltage (Vf) at 50mA is typically 2.5V, ranging from 1.75V to 2.75V. This parameter is crucial for driver circuit design and thermal management calculations. The device offers a wide 120-degree viewing angle, providing a broad and even radiation pattern suitable for many lighting applications.

2.2 Absolute Maximum Ratings and Thermal Properties

To ensure reliable operation, the device must not be operated beyond its Absolute Maximum Ratings. The maximum continuous forward current is 75 mA, with a permissible surge current of 400 mA for very short pulses (≤10 μs). The maximum power dissipation is 206.25 mW. The junction temperature (Tj) must not exceed 150°C, with an operating temperature range of -40°C to +125°C, which is essential for automotive under-hood or exterior applications. Two thermal resistance values are provided: a real thermal resistance (Rth JS real) of 40 K/W (typ.) and an electrical thermal resistance (Rth JS el) of 28 K/W (typ.). The electrical value, derived from the Vf temperature coefficient, is often used for real-time junction temperature estimation in active thermal management systems.

3. Binning System Explanation

The product is classified into bins to ensure consistency in key parameters for high-volume manufacturing.

3.1 Luminous Flux Binning

Luminous flux is sorted into four bins (E1 to E4), with the typical E2 bin covering 5 to 6 lumens and the E3 bin covering 6 to 8 lumens at 50mA. This allows designers to select LEDs based on the required brightness level for their specific application.

3.2 Forward Voltage Binning

Forward voltage is categorized into four bins (1720, 2022, 2225, 2527), corresponding to voltage ranges from 1.75-2.0V up to 2.5-2.75V. Matching Vf bins in an array can help achieve more uniform current distribution and brightness.

3.3 Dominant Wavelength Binning

The dominant wavelength is also binned into four codes (2730, 3033, 3336, 3639), spanning from 627-630 nm to 636-639 nm. This tight control over color ensures visual consistency, which is critical in automotive lighting where color perception is important.

4. Performance Curve Analysis

4.1 IV Curve and Relative Luminous Flux

The Forward Current vs. Forward Voltage graph shows a characteristic exponential relationship. The Relative Luminous Flux vs. Forward Current curve is nearly linear up to the typical 50mA point, showing good efficiency within the standard operating range.

4.2 Temperature Dependence

The Relative Luminous Flux vs. Junction Temperature graph indicates that light output decreases as temperature increases, a typical behavior for LEDs. The Relative Forward Voltage vs. Junction Temperature curve has a negative slope, providing a method to estimate junction temperature by measuring Vf. The Dominant Wavelength Shift vs. Junction Temperature shows a positive shift (towards longer wavelengths) with increasing temperature.

4.3 Spectral Distribution and Derating

The Relative Spectral Distribution graph confirms the monochromatic red output centered around 629 nm. The Forward Current Derating Curve is critical for thermal design, showing how the maximum permissible continuous current must be reduced as the solder pad temperature increases beyond 25°C. For example, at a pad temperature of 125°C, the maximum current is 75 mA.

5. Mechanical and Package Information

The LED is housed in a compact 2020 package (2.0mm x 2.0mm) with a height of approximately 0.7mm. The mechanical drawing specifies all critical dimensions and tolerances (typically ±0.1mm). The component features a thermal pad for effective heat dissipation from the junction to the printed circuit board (PCB).

5.1 Recommended Soldering Pad Layout

A detailed land pattern (footprint) is provided for PCB design. This includes the dimensions for the anode and cathode solder pads as well as the central thermal pad. Following this recommendation is essential for achieving reliable solder joints, proper electrical connection, and optimal thermal performance.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The datasheet specifies that the device can withstand a peak reflow temperature of 260°C for up to 30 seconds. This is compatible with standard lead-free (SnAgCu) solder reflow processes. Designers should follow a controlled temperature profile with preheat, soak, reflow, and cooling stages to minimize thermal shock and ensure reliable assembly.

6.2 Precautions for Use

General handling precautions include avoiding mechanical stress on the LED lens, preventing electrostatic discharge (ESD) during handling (the device is rated for 2kV HBM), and ensuring the polarity is correct during assembly to prevent reverse bias damage, as the device is not designed for reverse operation.

7. Packaging and Ordering Information

The LEDs are supplied on tape and reel for automated pick-and-place assembly. The specific reel size and packing quantity per reel are defined in the packaging information section.

7.1 Part Numbering System

The part number 2020-SR050DL-AM is decoded as follows:

• 2020: Product family and package size (2.0mm x 2.0mm).
• SR: Color (Super Red).
• 050: Test current (50 mA).
• D: Lead frame type (Au + White glue).
• L: Brightness level (Low bin relative to the family; specific flux is defined by the binning tables).
• AM: Designates Automotive application grade.

8. Application Recommendations

8.1 Typical Application Scenarios

The primary application is automotive lighting. This includes interior applications like switch backlighting, instrument cluster indicators, and ambient lighting. Exterior applications can include side marker lights, center high-mount stop lights (CHMSL), or other signal functions where a red color is specified. Its AEC-Q102 qualification makes it suitable for these harsh environments.

8.2 Design Considerations

Driver Circuit: A constant current driver is recommended to maintain stable light output, as LED brightness is a function of current, not voltage. The driver must be sized to provide the required current (e.g., 50mA) while accounting for the forward voltage bin of the LED. Thermal Management: Proper PCB layout with an adequate thermal relief pattern connected to the thermal pad is mandatory. Use the derating curve to ensure the junction temperature remains within limits at the application's maximum ambient temperature. Optical Design: The 120° viewing angle should be considered when designing lenses or light guides to achieve the desired beam pattern and illumination uniformity.

9. Technical Comparison and Differentiation

Compared to standard commercial-grade SMD LEDs, the key differentiators of this component are its automotive-grade reliability certifications (AEC-Q102) and its extended operating temperature range (-40°C to +125°C). The inclusion of detailed sulfur resistance classification (Class A1) is another critical advantage for automotive applications, where exposure to sulfur-containing gases can corrode silver-based components. The provision of both real and electrical thermal resistance parameters offers more flexibility for advanced thermal modeling than many competing products.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the difference between Rth JS real and Rth JS el? A: Rth JS real is the actual thermal resistance from the junction to the solder point, measured using a physical temperature sensor. Rth JS el is calculated from the change in forward voltage with temperature and is used for in-situ junction temperature monitoring during operation.

Q: How do I select the right bin for my application? A: Choose the luminous flux bin (E1-E4) based on your minimum required brightness. Select the forward voltage bin to match other LEDs in an array for current sharing or to simplify driver design. Choose the dominant wavelength bin for strict color consistency requirements.

Q: Can I drive this LED with a voltage source? A: It is not recommended. LEDs are current-driven devices. A small change in forward voltage can cause a large change in current due to the exponential IV relationship, leading to inconsistent brightness and potential overcurrent damage. Always use a constant current driver or a current-limiting resistor with a stable voltage supply.

11. Practical Design and Usage Case

Case: Designing a Dashboard Warning Indicator. A designer needs a bright, reliable red indicator for a critical warning light. They select the 2020-SR050DL-AM in the E3 luminous flux bin (6-8 lm) for high visibility. The PCB layout strictly follows the recommended soldering pad, with a large copper pour connected to the thermal pad to dissipate heat. A simple circuit with a 12V automotive supply uses a series resistor to limit the current to 50mA, calculated based on the typical Vf of 2.5V. The design is validated over the full automotive temperature range, ensuring the warning light meets brightness specifications even at 85°C ambient temperature, using the derating curves to confirm performance.

12. Operating Principle Introduction

This is a semiconductor light-emitting diode. When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region of the semiconductor chip, releasing energy in the form of photons (light). The specific material composition of the chip determines the wavelength (color) of the emitted light. In this Super Red LED, the dominant wavelength of ~629 nm is produced. The light is then shaped and emitted through the encapsulating lens, which also provides environmental protection.

13. Technology Trends and Developments

The trend in automotive SMD LEDs continues towards higher efficiency (more lumens per watt), enabling brighter signals with lower power consumption and reduced thermal load. There is also a push for even smaller package sizes with maintained or improved thermal performance to support miniaturization of lighting modules. Enhanced reliability under extreme conditions, such as higher temperature cycling and resistance to harsher chemicals, remains a key development focus. Furthermore, integration of driver electronics or multiple color chips (RGB) into a single package is an ongoing trend for advanced lighting systems.