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336SURSYGWS530-A3 LED Lamp Datasheet - Package Dimension - Voltage 2.0V - Power 60mW - Brilliant Red & Yellow Green - English Technical Document

Technical datasheet for the 336SURSYGWS530-A3 bi-color/bipolar LED lamp. Contains detailed specifications, electro-optical characteristics, package dimensions, and application guidelines.
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PDF Document Cover - 336SURSYGWS530-A3 LED Lamp Datasheet - Package Dimension - Voltage 2.0V - Power 60mW - Brilliant Red & Yellow Green - English Technical Document

1. Product Overview

The 336SURSYGWS530-A3 is a compact LED lamp designed for indicator and backlighting applications. It integrates two matched chips within a single package, ensuring uniform light output and a wide viewing angle. The device is available in both bi-color and bipolar configurations, offering design flexibility. It is built using AlGaInP semiconductor technology, which provides high efficiency and reliable performance. The lamp is characterized by its solid-state reliability, long operational life, and low power consumption, making it suitable for energy-sensitive designs.

Core Advantages: The primary advantages include matched chips for consistent brightness, compatibility with low-voltage control circuits (I.C. compatible), and compliance with major environmental regulations such as RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). This ensures the product can be used in a wide range of markets with strict environmental requirements.

Target Market: This LED is primarily targeted at consumer electronics and information technology equipment. Its typical applications include status indicators and backlighting for television sets, computer monitors, telephones, and various computer peripherals.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device's absolute maximum ratings define the limits beyond which permanent damage may occur. The continuous forward current (IF) for both the SUR (Brilliant Red) and SYG (Brilliant Yellow Green) chips is rated at 25 mA. A peak forward current (IFP) of 60 mA is permissible under pulsed conditions (duty cycle 1/10 @ 1 kHz). The maximum reverse voltage (VR) is 5 V. The power dissipation (Pd) for each chip is limited to 60 mW. The operating temperature range (Topr) is from -40°C to +85°C, while the storage temperature (Tstg) extends from -40°C to +100°C. The soldering temperature (Tsol) is specified as 260°C for a maximum of 5 seconds.

2.2 Electro-Optical Characteristics

Under standard test conditions (Ta=25°C, IF=20mA), the key performance parameters are defined. The forward voltage (VF) for both chips typically measures 2.0V, with a range from 1.7V (Min) to 2.4V (Max). The luminous intensity (IV) has a typical value of 32 mcd, with a minimum of 16 mcd. The viewing angle (2θ1/2) is typically 90 degrees, providing a broad emission pattern.

Wavelength Specifications: For the SUR (Brilliant Red) chip, the peak wavelength (λp) is typically 632 nm, and the dominant wavelength (λd) is typically 624 nm. For the SYG (Brilliant Yellow Green) chip, the peak wavelength is typically 575 nm, and the dominant wavelength is typically 573 nm. The spectral radiation bandwidth (Δλ) for both is typically 20 nm. The reverse current (IR) is specified at a maximum of 10 μA when VR=5V.

Measurement Tolerances: It is important to note the specified measurement uncertainties: ±0.1V for forward voltage, ±10% for luminous intensity, and ±1.0nm for dominant wavelength. These should be considered during circuit design and tolerance analysis.

3. Binning System Explanation

The datasheet indicates the use of a binning system for key parameters, as referenced in the label explanation. Parameters are ranked into categories (CAT, HUE, REF).

Luminous Intensity Binning (CAT): The luminous output is categorized into different ranks. Designers should consult the manufacturer's detailed binning documentation to select the appropriate category for their application's brightness consistency requirements.

Dominant Wavelength Binning (HUE): The color (dominant wavelength) is also binned. This is crucial for applications requiring precise color matching, such as in multi-indicator panels or backlighting arrays where color uniformity is important.

Forward Voltage Binning (REF): The forward voltage is ranked. Selecting LEDs from the same voltage bin can help in designing simpler, more uniform current-driving circuits, especially when multiple LEDs are connected in parallel.

4. Performance Curve Analysis

4.1 SUR Chip Characteristics

The provided curves for the SUR chip offer deeper insight into its behavior. The Relative Intensity vs. Wavelength curve shows the spectral emission profile centered around 632 nm. The Directivity plot confirms the typical 90-degree viewing angle with a near-Lambertian distribution.

The Forward Current vs. Forward Voltage (IV Curve) demonstrates the exponential relationship characteristic of diodes. At the typical operating point of 20 mA, the voltage is approximately 2.0V. The Relative Intensity vs. Forward Current curve shows that light output increases linearly with current up to the maximum rated current, indicating good efficiency within the operating range.

The Relative Intensity vs. Ambient Temperature curve indicates a decrease in light output as temperature increases, which is typical for LEDs. The Forward Current vs. Ambient Temperature curve (under constant voltage) shows how the current, and thus the power, would change with temperature if driven by a voltage source, highlighting the importance of constant current drive for stable operation.

4.2 SYG Chip Characteristics

The SYG chip curves are similar in nature. Notably, it includes a Chromaticity Coordinate vs. Forward Current curve. This graph is critical as it shows how the perceived color (chromaticity coordinates on the CIE diagram) may shift with changes in drive current. For color-sensitive applications, driving the LED with a stable, well-regulated current is essential to maintain consistent color output.

5. Mechanical and Package Information

The package is a standard LED lamp format. The dimension drawing provides critical measurements for PCB footprint design and mechanical integration. Key dimensions include the lead spacing, body diameter, and overall height. The notes specify that all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated.

Polarity Identification: The device has a bipolar structure. The cathode is typically indicated by a flat side on the LED lens or a shorter lead. Correct polarity must be observed during installation to prevent damage.

6. Soldering and Assembly Guide

Proper handling is crucial for reliability. Lead Forming: Leads should be bent at least 3mm from the epoxy bulb base, done before soldering, and without stressing the package. Cutting should be done at room temperature.

Storage: LEDs should be stored at ≤30°C and ≤70% RH. The storage life is 3 months from shipment. For longer storage (up to 1 year), a sealed nitrogen atmosphere with desiccant is recommended. Avoid rapid temperature changes in humid environments to prevent condensation.

Soldering: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb. Recommended conditions are:

A soldering profile is recommended, emphasizing a controlled ramp-up, peak temperature soak, and controlled cooldown. Avoid stress on leads at high temperatures. Do not solder more than once using dip or hand methods. Protect the LED from shock until it cools to room temperature. Always use the lowest possible soldering temperature.

7. Packaging and Ordering Information

The LEDs are packed in anti-static, moisture-resistant materials to protect against electrostatic discharge (ESD) and humidity. The packing specification details a multi-level system: a minimum of 200 to 500 pieces per anti-static bag, 5 bags per inner carton, and 10 inner cartons per outside carton.

Label Explanation: The packaging label includes fields for Customer's Production Number (CPN), Production Number (P/N), Packing Quantity (QTY), and the binning ranks for Luminous Intensity (CAT), Dominant Wavelength (HUE), and Forward Voltage (REF), along with the Lot Number (LOT No).

8. Application Suggestions

Typical Application Scenarios: This LED is ideal for status indicators in consumer electronics (power on/off, standby mode, function active) and for backlighting small legends or symbols on control panels, keypads, or switches in devices like TVs, monitors, and telephones.

Design Considerations:

  1. Current Driving: Always use a series current-limiting resistor or a constant current driver circuit. Driving at the typical 20mA is recommended for balanced performance and longevity.
  2. Thermal Management: While power dissipation is low, ensure adequate ventilation if multiple LEDs are used in a confined space, as elevated ambient temperature reduces light output and lifespan.
  3. Visual Design: The wide 90-degree viewing angle makes it suitable for applications where the indicator needs to be visible from various angles. The choice between White Clear/Color Clear (bipolar) and White Diffused (bi-color) resin affects the beam pattern and color mixing.
  4. ESD Protection: Although packed in anti-static materials, standard ESD precautions should be observed during handling and assembly.

9. Technical Comparison

The 336SURSYGWS530-A3 offers specific differentiation within its category. Its use of two matched AlGaInP chips in one package provides a solution for applications requiring two distinct colors or a bipolar indicator from a single component, saving board space compared to using two separate LEDs. The compliance with halogen-free and REACH standards may provide an advantage in markets with stringent environmental regulations over older or non-compliant components. The typical 90-degree viewing angle is standard, but the matched chip feature ensures better uniformity in multi-LED arrays than unmatched discrete LEDs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED directly from a 5V logic supply? A: No. With a typical Vf of 2.0V, connecting it directly to 5V without a current-limiting resistor would cause excessive current, potentially destroying the LED. A series resistor must be calculated based on the supply voltage and desired forward current (e.g., 20mA).

Q2: What is the difference between the bi-color and bipolar types? A: The datasheet describes the product as containing two integral chips available as both bi-color and bipolar. Typically, a bi-color LED has two dies of different colors (e.g., red and green) with a common cathode or anode, allowing either color to be lit independently. A bipolar LED usually refers to a single-die LED that can be lit by applying voltage in either polarity, but the description here suggests it may refer to the lens type (White Clear/Color Clear for bipolar vs. White Diffused for bi-color). Clarification from the manufacturer is recommended for the specific electrical configuration.

Q3: How does temperature affect performance? A: As shown in the performance curves, luminous intensity decreases with increasing ambient temperature. The forward voltage also has a negative temperature coefficient. Therefore, for stable light output, using a constant current driver is strongly advised over a constant voltage driver with a resistor.

Q4: What is the meaning of the 'SUR' and 'SYG' codes? A: These are internal product codes for the chip types. 'SUR' denotes the Brilliant Red chip, and 'SYG' denotes the Brilliant Yellow Green chip. They correspond to the specific semiconductor material (AlGaInP) and the resulting wavelength/color.

11. Practical Use Case

Scenario: Dual-State Indicator for a Network Router. A designer needs two status indicators on a router: one for 'Power' (steady green) and one for 'Network Activity' (blinking red). Instead of using two separate LED packages, the designer can use one 336SURSYGWS530-A3 in a bi-color configuration (if electrically configured as common-cathode). The SYG (green) die can be connected to the power circuit for a steady state. The SUR (red) die can be connected to a microcontroller pin that toggles with network activity. This saves PCB space, reduces component count, and ensures the indicators are perfectly aligned. The wide viewing angle ensures visibility from across a room. The designer must implement appropriate current-limiting resistors for each die and ensure the driving circuits do not exceed the absolute maximum ratings.

12. Technology Principle Introduction

The LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology. When a forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light. For the SUR chip, the alloy is tuned to emit in the red spectrum (~624-632 nm). For the SYG chip, the composition is adjusted to emit in the yellow-green spectrum (~573-575 nm). The epoxy resin lens serves to protect the semiconductor die, shape the light output beam (90-degree angle), and, in the case of diffused types, scatter the light for a wider, softer appearance.

13. Development Trends

LED technology continues to evolve towards higher efficiency, greater reliability, and smaller form factors. For indicator-type LEDs like the 336 series, trends include:

While the 336SURSYGWS530-A3 represents a mature and reliable technology, newer generations may offer improvements in these areas.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.