209-3SURSYGW/S530-A3 Bi-Color LED Lamp Datasheet - 3mm Round - Voltage 2.0V - Brilliant Red & Yellow Green - English Technical Document

1. Product Overview

The 209-3SURSYGW/S530-A3 is a bi-color LED lamp featuring two integral semiconductor chips within a single 3mm round package. This device is engineered to provide uniform light output and a wide viewing angle, making it suitable for various indicator and backlighting applications. The lamp is available in a configuration that emits two distinct colors: Brilliant Red and Brilliant Yellow Green, achieved through the use of AlGaInP (Aluminum Gallium Indium Phosphide) material technology for both chips. The package is offered in a White Diffused resin type for the bi-color version, which helps in diffusing the light for a more even appearance.

The core advantages of this product include solid-state reliability leading to a long operational life, low power consumption making it compatible with integrated circuits, and compliance with major environmental and safety standards such as RoHS, EU REACH, and Halogen-Free requirements. Its design targets applications in consumer electronics and computing peripherals.

2. Technical Parameters Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

• Continuous Forward Current (IF): 25 mA for both the SUR (Brilliant Red) and SYG (Brilliant Yellow Green) chips.
• Peak Forward Current (IFP): 60 mA for both chips, permissible under a duty cycle of 1/10 at 1 kHz.
• Reverse Voltage (VR): 5 V. Exceeding this can cause junction breakdown.
• Power Dissipation (Pd): 60 mW per chip. This is the maximum power the device can dissipate at Ta=25°C.
• Operating Temperature (Topr): -40°C to +85°C. The device is designed to function within this ambient temperature range.
• Storage Temperature (Tstg): -40°C to +100°C.
• Soldering Temperature (Tsol): 260°C for a maximum of 5 seconds, defining the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at an ambient temperature (Ta) of 25°C and a forward current (IF) of 20 mA, unless otherwise specified.

• Forward Voltage (VF): Typical value is 2.0V for both colors, with a range from 1.7V (Min) to 2.4V (Max). This low voltage is key for low-power operation.
• Reverse Current (IR): Maximum of 10 µA at VR=5V, indicating good junction isolation.
• Luminous Intensity (IV): The SUR (Red) chip has a typical intensity of 50 mcd, while the SYG (Yellow Green) chip has a typical intensity of 20 mcd. This difference is inherent to the human eye's photopic response and the chip materials.
• Viewing Angle (2θ1/2): A wide 80-degree half-angle is typical for both colors, providing a broad emission pattern.
• Peak Wavelength (λp): SUR: 632 nm (Red), SYG: 575 nm (Yellow Green).
• Dominant Wavelength (λd): SUR: 624 nm, SYG: 573 nm. This is the single-wavelength perception of the color by the human eye.
• Spectrum Radiation Bandwidth (Δλ): Approximately 20 nm for both, defining the spectral purity.

Note: Measurement uncertainties are specified for Forward Voltage (±0.1V), Luminous Intensity (±10%), and Dominant Wavelength (±1.0nm).

3. Performance Curve Analysis

3.1 SUR (Brilliant Red) Chip Characteristics

The provided curves offer insight into the device's behavior under varying conditions.

• Relative Intensity vs. Wavelength: Shows a sharp peak around 632 nm, confirming the red emission.
• Directivity Pattern: Illustrates the Lambertian-like emission profile corresponding to the 80-degree viewing angle.
• Forward Current vs. Forward Voltage (IV Curve): Demonstrates the exponential relationship, crucial for designing current-limiting circuits. The curve shows the typical turn-on voltage and dynamic resistance.
• Relative Intensity vs. Forward Current: Shows that light output increases with current but may exhibit non-linearity or saturation at higher currents, emphasizing the need for proper drive conditions.
• Relative Intensity vs. Ambient Temperature: Indicates a decrease in luminous intensity as ambient temperature rises, a common characteristic of LEDs due to increased non-radiative recombination.
• Forward Current vs. Ambient Temperature: Likely shows the relationship under constant voltage bias, highlighting thermal effects on current.

3.2 SYG (Brilliant Yellow Green) Chip Characteristics

Similar curves are provided for the SYG chip, with key differences in the wavelength-specific graphs.

• Relative Intensity vs. Wavelength: Peak is centered around 575 nm.
• Chromaticity Coordinate vs. Forward Current: This unique curve for the SYG chip shows how the perceived color (chromaticity coordinates) may shift slightly with changes in drive current, which is important for color-critical applications.
• The IV curve, intensity vs. current, and thermal dependency curves follow trends similar to the SUR chip but with values specific to the SYG's material properties.

4. Mechanical and Packaging Information

4.1 Package Dimension

The LED is housed in a standard 3mm round package. Key dimensional notes include:

• All dimensions are in millimeters.
• The height of the flange must be less than 1.5mm (0.059\").
• A general tolerance of ±0.25mm applies unless otherwise specified.
• The diagram shows the lead spacing, body diameter, and overall height, which are critical for PCB footprint design and mechanical fitting.

4.2 Polarity Identification

The package features a flange or flat side on the cathode (negative) lead. Correct polarity must be observed during installation to prevent reverse bias damage.

5. Soldering and Assembly Guidelines

5.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb to avoid stress on the internal die and wire bonds.
• Forming must be done before soldering.
• Avoid applying stress to the package. PCB holes must align perfectly with LED leads to prevent mounted stress.
• Cut leads at room temperature.

5.2 Storage Conditions

• Recommended storage: ≤30°C and ≤70% Relative Humidity after shipment.
• Shelf life: 3 months under these conditions. For longer storage (up to 1 year), use a sealed container with nitrogen atmosphere and desiccant.
• Avoid rapid temperature transitions in humid environments to prevent condensation.

5.3 Soldering Process

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature max 300°C (for 30W iron max). Soldering time max 3 seconds.
• Wave/DIP Soldering: Preheat temperature max 100°C (for max 60 sec). Solder bath temperature max 260°C for max 5 seconds.
• A recommended soldering profile graph is provided, typically showing a ramp-up, preheat, reflow, and cooling phase to manage thermal stress.
• Avoid stress on leads at high temperatures. Do not solder more than once.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packed in moisture-resistant, anti-static materials to protect against electrostatic discharge (ESD) and environmental humidity.

• Packing Flow: LEDs are placed in an anti-electrostatic bag. Multiple bags are placed in an inner carton. Multiple inner cartons are packed into an outside carton.
• Packing Quantity: Minimum 200 to 1000 pieces per bag. 4 bags per inner carton. 10 inner cartons per outside carton.

6.2 Label Explanation

The packaging label includes several codes:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 209-3SURSYGW/S530-A3).
• QTY: Quantity in the package.
• CAT: Ranks for Luminous Intensity and Forward Voltage (binning information).
• HUE: Color Rank (wavelength binning).
• REF: Forward Voltage reference.
• LOT No: Traceable manufacturing lot number.

7. Application Suggestions

7.1 Typical Application Scenarios

As listed in the datasheet, primary applications include:

• TV sets (status indicators, backlighting)
• Monitors (power/activity lights)
• Telephones (line status, message waiting indicators)
• Computers (hard drive activity, power indicators)

The bi-color capability allows for dual-state indication (e.g., red for standby/error, green for power-on/ok) using a single component footprint.

7.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit the forward current to 20mA or below for continuous operation, respecting the Absolute Maximum Rating of 25mA.
• Thermal Management: While power dissipation is low, ensure the operating ambient temperature does not exceed 85°C. Avoid placing near other heat sources.
• ESD Protection Although packed in anti-static materials, standard ESD handling precautions should be observed during assembly.
• Optical Design: The wide viewing angle is suitable for direct viewing. For focused or guided light, external lenses or light pipes may be required.

8. Technical Comparison and Differentiation

While a direct comparison with other part numbers is not provided in this single datasheet, key differentiating features of this product can be inferred:

• Dual-Chip, Bi-Color in 3mm Package: Integrates two functions (two colors) in a very common and small package size, saving board space compared to using two separate LEDs.
• Matched Chips: The two chips are matched for uniform light output, which is important for aesthetic consistency in indicator applications.
• AlGaInP Material: For both red and yellow-green, this material typically offers higher efficiency and better temperature stability compared to older technologies like GaAsP for certain colors.
• Comprehensive Compliance: Meets RoHS, REACH, and Halogen-Free standards, which is essential for modern electronics manufacturing serving global markets.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Can I drive this LED at 25mA continuously?

While the Absolute Maximum Rating for continuous forward current is 25mA, the Electro-Optical Characteristics are specified at 20mA. For reliable long-term operation and to account for potential variations in supply voltage and temperature, it is a standard design practice to operate at or below the typical test condition of 20mA. Operating at 25mA may reduce lifetime and increase thermal stress.

9.2 Why is the luminous intensity different for the red and yellow-green chips?

The difference (50 mcd vs. 20 mcd typical) is primarily due to two factors: the inherent efficiency of the AlGaInP material at producing light at those specific wavelengths, and the sensitivity of the human eye (photopic response). The eye is most sensitive to green light (~555 nm). The yellow-green chip (575 nm) is closer to this peak than the red chip (632 nm), but the material efficiency and internal package optics also play a significant role in the final measured intensity in millicandelas.

9.3 How do I interpret the 'CAT' and 'HUE' on the label for my circuit design?

'CAT' refers to combined bins for luminous intensity and forward voltage. 'HUE' refers to the wavelength (color) bin. For applications requiring tight consistency in brightness or color between multiple LEDs, you should specify or select LEDs from the same CAT and HUE bins. For non-critical indicator applications, this may be less important. The datasheet provides the ranges (Min/Typ/Max); bins represent subdivisions within these ranges.

10. Design and Usage Case Example

Scenario: Dual-State System Status Indicator for a Network Router.

A designer needs a single LED to show two states: Solid Red for 'System Error/Booting' and Solid Yellow-Green for 'Normal Operation/Online'.

• Component Selection: The 209-3SURSYGW/S530-A3 is ideal as it provides both required colors in one 3mm package.
• Schematic Design: The LED has three leads: common anode or common cathode? The datasheet describes it as a bi-color lamp with two chips. Typically, such 3-pin packages have a common cathode (or anode) for both dice, with the other lead for each die being separate. The designer must check the internal connection diagram (implied by the part number structure) and design the driving circuit accordingly, using two GPIO pins from a microcontroller with series resistors (e.g., 150-200 Ohms for a 5V supply to achieve ~20mA).
• PCB Layout: Use the package dimensions to create the footprint, ensuring the 3mm hole spacing and polarity marker (flange) are correctly represented. Maintain the 3mm clearance from the LED body to any solder pads as per the soldering guide.
• Software Control: To display red, drive the SUR chip pin high (if common cathode) while keeping the SYG pin low. To display yellow-green, drive the SYG chip pin high and keep the SUR pin low. Ensure only one color is driven at a time unless a specific mixed-color effect is desired (which would require current balancing).

11. Technology Principle Introduction

The LED operates on the principle of electroluminescence in semiconductor materials. The core chips are made of AlGaInP (Aluminum Gallium Indium Phosphide), which is a III-V compound semiconductor.

• Light Generation: When a forward voltage is applied across the p-n junction of the chip, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific wavelength (color) of the light is determined by the bandgap energy of the semiconductor material, which is carefully engineered by adjusting the ratios of Aluminum, Gallium, and Indium in the AlGaInP crystal lattice.
• Color Determination: For the SUR chip, the composition is tuned to produce photons with energy corresponding to red light (~624-632 nm). For the SYG chip, a slightly different composition yields photons for yellow-green light (~573-575 nm).
• Package Function: The epoxy resin package serves multiple purposes: it encapsulates and protects the fragile semiconductor die and wire bonds from mechanical and environmental damage, it acts as a lens to shape the light output beam (achieving the 80-degree viewing angle), and in the 'White Diffused' version, it contains diffusing particles to scatter the light and create a more uniform, less glaring appearance.

12. Industry Trends and Context

This product reflects several ongoing trends in the LED industry:

• Miniaturization with Increased Functionality: Integrating multiple chips (bi-color) into a standard, small package like the 3mm round allows designers to add features without increasing board space.
• Focus on Material Science: The use of AlGaInP for both red and yellow-green indicates a move towards higher-performance material systems that offer better efficiency, brightness, and thermal stability compared to traditional alternatives.
• Stringent Environmental Compliance: The explicit listing of RoHS, REACH, and Halogen-Free compliance is now a fundamental requirement for components used in electronics sold globally, driven by environmental regulations and consumer demand.
• Standardization and Reliability: Detailed specifications for absolute maximum ratings, soldering profiles, and storage conditions highlight the industry's focus on ensuring component reliability in high-volume, automated manufacturing processes. The provision of extensive performance curves allows engineers to make more accurate predictions of LED behavior in their specific applications.

While this is a mature product type, its design and documentation embody the current expectations for a reliable, compliant, and well-specified discrete optoelectronic component.