Bi-Color Top View LED 67-22 Series Datasheet - P-LCC-4 Package - 2.0V Typ - Brilliant Yellow/Green - English Technical Document

1. Product Overview

The 67-22 series represents a family of bi-color (multi-color) top view LEDs housed in a compact P-LCC-4 package. These components are designed as optical indicators, featuring a white package body and a colorless clear window. A key design feature is the integrated inter reflector, which optimizes light coupling and enables a wide viewing angle, making these LEDs particularly well-suited for light pipe and backlighting applications. Their low current requirement further enhances their suitability for power-sensitive portable equipment.

1.1 Core Advantages and Target Market

The primary advantages of this LED series stem from its package design and material selection. The wide viewing angle, facilitated by the package geometry and inter reflector, ensures uniform light distribution, which is critical for indicator and backlight applications. The device is compatible with automatic placement equipment and is supplied on 8mm tape and reel, streamlining high-volume assembly processes. It is also Pb-free and designed to comply with RoHS directives. The target markets include telecommunications (for indicators and backlighting in phones and fax machines), general backlighting for LCDs, switches, and symbols, and any general-purpose indication where reliable, low-power visual feedback is required.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The device's operational limits are defined under specific conditions (Ta=25°C). The maximum reverse voltage (V_R) is 5V. The continuous forward current (I_F) for both chip types (UY and SYG) is rated at 25 mA, with a peak forward current (I_FP) of 60 mA permissible under a 1/10 duty cycle at 1 kHz. The maximum power dissipation (P_d) is 60 mW for each chip. The device can withstand an electrostatic discharge (ESD) of 2000V (HBM). The operating temperature range (T_opr) is from -40°C to +85°C, while the storage temperature (T_stg) extends from -40°C to +95°C. Soldering guidelines specify reflow soldering at 260°C for 10 seconds or hand soldering at 350°C for 3 seconds.

2.2 Electro-Optical Characteristics

Key performance metrics are measured at Ta=25°C and I_F=20mA. For the UY (Brilliant Yellow) chip, the typical luminous intensity (I_V) is 120 mcd (min. 80 mcd). For the SYG (Brilliant Yellow Green) chip, the typical I_V is 80 mcd (min. 50 mcd). Both share a typical viewing angle (2θ1/2) of 120 degrees. The UY chip has a typical peak wavelength (λp) of 591 nm and a dominant wavelength (λd) of 589 nm. The SYG chip has a typical λp of 575 nm and λd of 573 nm. Both have a typical spectral bandwidth (Δλ) of 20 nm. The forward voltage (V_F) for both types typically measures 2.0V, with a range from 1.7V to 2.4V. The maximum reverse current (I_R) is 10 μA at V_R=5V.

3. Binning System Explanation

The product utilizes a binning system to categorize key parameters, ensuring consistency in application design. This is indicated by codes on the product label. The CAT code refers to the Luminous Intensity Rank, classifying the LED based on its measured light output. The HUE code corresponds to the Dominant Wavelength Rank, grouping LEDs by their specific color point. The REF code indicates the Forward Voltage Rank, sorting devices by their electrical characteristics. This binning allows designers to select LEDs with tightly controlled parameters for their specific needs.

4. Performance Curve Analysis

4.1 Relative Luminous Intensity vs. Ambient Temperature

The provided curves for both UY and SYG chips show that relative luminous intensity is highly dependent on ambient temperature (T_a). The intensity is normalized to 100% at 25°C. As temperature decreases to -40°C, the relative intensity can drop significantly, potentially below 60% for the UY chip. Conversely, as temperature increases towards the upper operating limit (+85°C), the intensity also decreases from the 25°C reference point. This thermal derating is a critical consideration for applications exposed to wide temperature variations.

4.2 Forward Current vs. Forward Voltage

The IV characteristic curve demonstrates the relationship between forward current (I_F) and forward voltage (V_F) at 25°C. The curve is non-linear, typical for diodes. For both LED types, at the standard test current of 20 mA, the voltage typically sits around 2.0V. The curve shows that a small increase in voltage beyond the typical point results in a rapid increase in current, highlighting the importance of current-limiting circuitry in drive design to prevent thermal runaway and device failure.

4.3 Relative Luminous Intensity vs. Forward Current

This curve illustrates the light output as a function of drive current. Luminous intensity increases with forward current, but the relationship is not perfectly linear, especially at higher currents. The curve allows designers to estimate the light output for drive currents other than the standard 20mA test condition. It also implicitly shows the efficiency trend; driving the LED at very high currents may yield diminishing returns in light output while increasing power dissipation and junction temperature.

4.4 Spectrum Distribution

The spectral distribution graphs show the relative radiant power versus wavelength for both chips at 25°C. The UY chip emits in the yellow region with a peak around 591 nm. The SYG chip emits in the yellow-green region with a peak around 575 nm. Both spectra show a relatively narrow bandwidth (approximately 20 nm FWHM as stated in the table), which is characteristic of AlGaInP semiconductor material, resulting in saturated, pure colors.

4.5 Radiation Diagram

The polar radiation diagram depicts the spatial distribution of light intensity. The diagram confirms the wide viewing angle, with intensity measured at various angles from 0° (on-axis) to 90°. The shape of the curve shows how light is emitted, which is crucial for designing light guides and ensuring even illumination in backlight applications. The inter reflector within the package contributes to this specific radiation pattern.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a P-LCC-4 (Plastic Leaded Chip Carrier, 4-pin) package. The package body is white. Dimensional drawings are provided, detailing the length, width, height, lead spacing, and other critical mechanical features. Key dimensions include the overall size of the package and the positioning of the anode/cathode pads for the two internal LED chips (typically for bi-color operation). All unspecified tolerances are ±0.1 mm.

5.2 Polarity Identification and Pad Design

The package has four leads. The internal connection scheme is not explicitly detailed in the provided text but is standard for such bi-color top-view LEDs: two anodes and two cathodes, or a common anode/cathode configuration for the two different color chips. The physical pinout and recommended PCB pad layout are defined in the dimension drawings to ensure correct electrical connection and reliable soldering.

6. Soldering and Assembly Guidelines

The device is suitable for vapor-phase reflow and compatible with automatic placement equipment. The absolute maximum ratings specify the soldering temperature profile: reflow soldering should not exceed 260°C for 10 seconds, and hand soldering should not exceed 350°C for 3 seconds. Adherence to these limits is essential to prevent damage to the plastic package and the internal wire bonds. The components are supplied on 8mm tape and reel to facilitate automated assembly processes.

7. Packaging and Ordering Information

The product is available on tape and reel compatible with 8mm carrier tape. A diagram of the reel dimensions is typically included. The label on the reel or package contains critical information for traceability and verification: Part Number (PN), Customer Part Number (CPN), quantity (QTY), lot number (LOT NO), and the binning codes (CAT, HUE, REF) as previously described.

8. Application Suggestions

8.1 Typical Application Scenarios

Primary applications include: Telecommunication equipment (status indicators, keypad backlighting), Flat panel backlighting for LCDs, membrane switches, and symbols, Light pipe systems for channeling light from the LED to a remote indicator location, General-purpose status and power indicators in consumer electronics, industrial controls, and automotive interiors.

8.2 Design Considerations

Current Limiting: Always use a series resistor or constant current driver to limit the forward current to 25 mA or below for continuous operation. Thermal Management: Consider the derating of luminous intensity with temperature. In high-ambient-temperature environments, ensure adequate heat dissipation or reduce drive current. Optical Design: Leverage the wide viewing angle and inter reflector for applications requiring broad, even illumination. For light pipes, choose materials and geometry compatible with the LED's radiation pattern. ESD Protection: Implement standard ESD precautions during handling and assembly, as the device is rated for 2000V HBM.

9. Technical Comparison and Differentiation

The key differentiators of the 67-22 series lie in its package and optical design. The P-LCC-4 package with an inter reflector is specifically engineered for applications requiring efficient coupling into light pipes, a feature not always optimized in standard top-view LEDs. The wide 120-degree viewing angle provides more flexibility in placement and viewing compared to narrower-angle devices. The availability in specific brilliant yellow and yellow-green colors from AlGaInP technology offers high color purity and efficiency.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30 mA for brighter output?

A: The absolute maximum continuous forward current is 25 mA. Exceeding this rating may reduce reliability and lifetime due to increased junction temperature and stress. For higher brightness, select an LED from a bin with higher luminous intensity (CAT code) rather than overdriving it.

Q: Why does the light output drop in cold environments?

A: As shown in the performance curves, the luminous intensity of semiconductor LEDs generally decreases as the ambient temperature drops. This is a characteristic of the semiconductor material and photon emission efficiency at lower temperatures. The design must account for this if operation over a wide temperature range is required.

Q: What is the purpose of the HUE and REF binning codes?

A: These codes ensure color and voltage consistency. For applications where multiple LEDs are used side-by-side (e.g., in an array or bar graph), using LEDs from the same HUE bin guarantees a uniform color appearance. Using LEDs from the same REF bin ensures they have similar forward voltages, leading to more uniform current sharing if driven in parallel.

11. Practical Application Case Study

Consider designing a status indicator panel for a piece of industrial equipment. The panel uses light pipes to bring indicator light from PCBs mounted deep within the enclosure to the front panel. The 67-22 series LED is an ideal choice. Its inter reflector efficiently couples light into the entrance of the light pipe, minimizing losses. The wide viewing angle ensures that light is captured effectively even if the LED is not perfectly aligned. The brilliant yellow color (UY) provides high visibility. The designer would select LEDs from a single HUE bin for consistent color across all indicators and implement a simple resistor-based current limit circuit set for 20 mA to achieve the specified typical brightness.

12. Operating Principle Introduction

These LEDs are based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region. Their recombination releases energy in the form of photons (light). The specific color (wavelength) of the emitted light is determined by the bandgap energy of the AlGaInP material, which is engineered during the crystal growth process to produce yellow (UY) or yellow-green (SYG) light. The plastic package (P-LCC-4) provides environmental protection, mechanical support, and houses the inter reflector which shapes the light output.

13. Technology Trends

The general trend in indicator LEDs continues towards higher efficiency (more light output per unit of electrical power), smaller package sizes for higher density boards, and improved reliability. There is also a focus on expanding color gamuts and improving color consistency through advanced binning techniques. The integration of features like built-in current limiting resistors or IC drivers within the LED package is another growing trend, simplifying circuit design. The use of materials compliant with stringent environmental regulations (RoHS, REACH) is now a standard requirement.