1. Product Overview
The 1259-7 series is a compact LED lamp designed for indicator and backlighting applications. It integrates two matched AlGaInP semiconductor chips within a single package, enabling uniform light output and a wide 40-degree viewing angle. The product is available in two primary configurations: bicolor types and bipolar types. Bicolor lamps typically combine two different colors (e.g., Brilliant Yellow and Brilliant Yellow Green) in a diffused package, while bipolar lamps feature a single color (White Clear or Color Clear) in a clear package. This design offers solid-state reliability, long operational life, and low power consumption, making it suitable for integration into modern electronic devices.
1.1 Core Advantages and Target Market
The key advantages of this LED lamp include its dual-chip architecture for consistent brightness, compatibility with low-voltage integrated circuits, and compliance with major environmental regulations such as RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). Its primary target markets are consumer electronics and computer peripherals, where reliable, compact indicators are essential.
2. Technical Parameter Deep-Dive
This section provides a detailed, objective analysis of the LED's key specifications as defined in the datasheet.
2.1 Absolute Maximum Ratings
The device must not be operated beyond these limits to prevent permanent damage. For both the UY (Brilliant Yellow) and SYG (Brilliant Yellow Green) chips, the maximum continuous forward current (IF) is 25 mA. The maximum reverse voltage (VR) is 5 V. The power dissipation (Pd) for each chip is limited to 60 mW. The operating temperature range (Topr) is from -40°C to +85°C, and storage temperature (Tstg) extends from -40°C to +100°C. The soldering temperature (Tsol) is specified for reflow processes at 260°C for a maximum of 5 seconds.
2.2 Electro-Optical Characteristics (Ta=25°C)
These parameters define the LED's performance under typical conditions. The forward voltage (VF) for both chips is typically 2.0V, with a range from 1.7V to 2.4V at a test current of 20mA. The maximum reverse current (IR) is 10 µA at 5V. Luminous intensity (IV) is a key metric: the UY chip has a typical value of 125 mcd (min. 63 mcd), while the SYG chip has a typical value of 80 mcd (min. 40 mcd). The viewing angle (2θ1/2) is typically 40 degrees for both. The UY chip's dominant wavelength (λd) is typically 589 nm (peak λp at 591 nm), and the SYG chip's is typically 573 nm (peak λp at 575 nm). The spectral bandwidth (Δλ) is 15 nm for UY and 20 nm for SYG. Measurement uncertainties are noted for forward voltage (±0.1V), luminous intensity (±10%), and dominant wavelength (±1.0nm).
3. Binning System Explanation
The datasheet references a binning system for key parameters, indicated by labels such as CAT (Luminous Intensity rank), HUE (Dominant Wavelength rank), and REF (Forward Voltage rank). This system ensures color and brightness consistency within a production batch. Designers must consult the manufacturer's detailed binning charts (not provided in this excerpt) to select the appropriate codes for their application's color and brightness tolerance requirements.
4. Performance Curve Analysis
Graphical data provides deeper insight into the LED's behavior under varying conditions.
4.1 UY (Brilliant Yellow) Chip Curves
The Relative Intensity vs. Wavelength curve shows a narrow emission peak centered around 591 nm. The Directivity pattern confirms the 40-degree viewing angle. The Forward Current vs. Forward Voltage (I-V) curve exhibits the typical exponential relationship of a diode. The Relative Intensity vs. Forward Current curve shows that light output increases linearly with current up to the rated maximum. The Relative Intensity vs. Ambient Temperature curve indicates a decrease in output as temperature rises, a common characteristic of LEDs. The Forward Current vs. Ambient Temperature curve under constant voltage conditions would show current increase with temperature due to the diode's negative temperature coefficient.
4.2 SYG (Brilliant Yellow Green) Chip Curves
Similar curves are provided for the SYG chip, with its emission peak around 575 nm. An additional Chromaticity Coordinate vs. Forward Current curve is included, which is crucial for understanding any potential color shift that may occur when driving the LED at currents different from the test condition (20mA).
5. Mechanical and Package Information
5.1 Package Dimensions
The LED features a standard 5mm round radial leaded package. Key dimensions include a body diameter, lead spacing, and overall height. The flange height is specified to be less than 1.5mm. Standard dimensional tolerances are ±0.25mm unless otherwise stated. A detailed dimensioned drawing is essential for PCB footprint design.
5.2 Polarity Identification
For bipolar LEDs, the longer lead typically denotes the anode (+). For bicolor LEDs, the common cathode configuration is standard, where the middle lead is common cathode and the two outer leads are the anodes for the two different color chips. The datasheet diagram must be consulted to confirm the exact pinout.
6. Soldering and Assembly Guidelines
Proper handling is critical for reliability.
6.1 Lead Forming
Bending must occur at least 3mm from the epoxy bulb base. Forming must be done before soldering and at room temperature to avoid stress-induced damage or cracking. PCB hole alignment must be precise to prevent mounting stress.
6.2 Soldering Parameters
For hand soldering: iron tip temperature ≤300°C (30W max), time ≤3 seconds, with a minimum 3mm distance from the joint to the bulb. For wave/dip soldering: preheat ≤100°C for ≤60 sec, solder bath ≤260°C for ≤5 sec, with the same 3mm distance rule. A single soldering pass is recommended. A soldering profile graph suggests a ramp-up, peak, and cool-down sequence to minimize thermal shock.
6.3 Storage Conditions
LEDs should be stored at ≤30°C and ≤70% RH. The shelf life from shipment is 3 months. For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant. Avoid rapid temperature changes in humid environments to prevent condensation.
7. Packaging and Ordering Information
7.1 Packing Specification
LEDs are packed in anti-static bags (200-500 pcs/bag). Five bags are placed in an inner carton, and ten inner cartons are packed into an outside master carton. The packaging materials are moisture-resistant.
7.2 Label Explanation
The package label includes: CPN (Customer's Part Number), P/N (Manufacturer's Part Number), QTY (Quantity), CAT (Luminous Intensity bin), HUE (Dominant Wavelength bin), REF (Forward Voltage bin), and LOT No. (Traceability code).
8. Application Suggestions
8.1 Typical Application Scenarios
Primary applications include status indicators for TVs, monitors, telephones, and computers. The bicolor version is suitable for dual-state signaling (e.g., power on/standby), while the high-brightness clear versions are ideal for panel illumination.
8.2 Design Considerations
Always use a current-limiting resistor in series with the LED. Calculate resistor value based on supply voltage, LED forward voltage (use typical or max depending on design margin), and desired forward current (≤20mA for normal operation). Consider the LED's temperature derating when designing for high ambient temperature environments. Ensure the PCB layout provides adequate clearance around the LED bulb as per soldering guidelines.
9. Technical Comparison and Differentiation
The key differentiator of the 1259-7 series is its dual-chip-in-one-package design for bicolor functionality or brightness uniformity in a standard 5mm format. Compared to single-chip 5mm LEDs, it offers design flexibility (two colors) or a more uniform luminous pattern. Its AlGaInP technology provides high efficiency in the yellow/green spectrum compared to older technologies. Compliance with modern environmental regulations (RoHS, REACH, Halogen-Free) is a standard requirement but remains a key selection criterion.
10. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED at 25mA continuously?
A: While the Absolute Maximum Rating is 25mA, the Electro-Optical Characteristics are specified at 20mA. For reliable long-term operation and to manage junction temperature, it is recommended to operate at or below 20mA.
Q: What is the difference between dominant wavelength and peak wavelength?
A: Peak wavelength (λp) is the single point of highest spectral power. Dominant wavelength (λd) is the single wavelength of a monochromatic light that matches the perceived color of the LED. λd is more relevant for color specification in applications.
Q: How do I interpret the luminous intensity bin (CAT)?
A: The CAT code corresponds to a specific range of mcd values. You must request the manufacturer's binning document to know the exact min/max values for each CAT code to ensure your brightness requirements are met.
11. Practical Design and Usage Case
Case: Dual-Color Status Indicator for a Network Router. A designer uses the bicolor 1259-7 (UY/SYG) to indicate network activity (flashing green) and error states (steady yellow). They use a microcontroller to switch current between the two anode pins (sharing a common cathode). A 100Ω resistor is used on each anode leg with a 5V supply, resulting in a current of approximately (5V - 2.0V)/100Ω = 30mA. To adhere to the 20mA recommendation, they increase the resistor to 150Ω, resulting in ~20mA. The wide viewing angle ensures visibility from various angles.
12. Operating Principle Introduction
This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—yellow (~589 nm) or yellow-green (~573 nm). The epoxy lens shapes the light output and provides mechanical and environmental protection.
13. Technology Trends
The trend in indicator LEDs is towards higher efficiency (more lumens per watt), smaller package sizes (e.g., 0402, 0201 SMD), and integrated solutions (e.g., LEDs with built-in ICs for sequencing or control). While radial leaded packages like the 5mm remain popular for certain through-hole applications, surface-mount device (SMD) packages dominate new designs due to their smaller footprint and suitability for automated assembly. Environmental compliance and broadening color gamuts continue to be key development drivers.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |