336UYSYGW/S530-A3 LED Lamp Datasheet - Dimensions 3.0x?x?mm - Voltage 2.0-2.4V - Power 60mW - Super Yellow/Yellow Green - English Technical Document

1. Product Overview

The 336UYSYGW/S530-A3 is a compact LED lamp designed for indicator and backlighting applications. It integrates two semiconductor chips within a single package, offering design flexibility and uniform illumination.

1.1 Core Features and Advantages

The primary advantages of this LED lamp stem from its dual-chip architecture and material composition.

• Matched Chip Performance: The two integral chips are carefully matched to ensure highly uniform light output and a consistent, wide viewing angle of approximately 80 degrees, providing even illumination from various perspectives.
• Solid-State Reliability and Long Life: As a solid-state lighting device, it offers exceptional reliability and a long operational lifespan, significantly outperforming traditional incandescent bulbs.
• Efficient Operation: The device is designed for low power consumption and is directly compatible with integrated circuit (I.C.) drive levels, simplifying interface design.
• Environmental Compliance: The product is manufactured using Pb-free materials and complies with RoHS (Restriction of Hazardous Substances) directives.

1.2 Product Description and Variants

The \"336\" refers to the package type. This lamp is offered in two primary electrical configurations: bicolor and bipolar.

• Bicolor Types: These lamps contain two diodes that emit different colors. For this specific model, the emitted colors are Super Yellow and Yellow Green. The resin color for bicolor variants is White Diffused, which helps blend the two colors and provides a wider viewing angle.
• Bipolar Types: These lamps have a single color per device. They are available with either White Clear or Color Clear resin. The clear resin offers higher light output but a more directed beam.
• Material Science: The light emission is achieved using Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor material, which is highly efficient for producing yellow and green wavelengths.

1.3 Target Applications

This LED is suited for a variety of electronic equipment requiring status indication or panel backlighting.

• Television sets (power status, function indicators)
• Computer monitors
• Telephones and communication devices
• General computer peripherals and instrumentation

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed analysis of the electrical, optical, and thermal specifications.

2.1 Absolute Maximum Ratings

These are the stress limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA for both UY (Super Yellow) and SYG (Yellow Green) chips. Exceeding this current can cause catastrophic failure due to overheating.
• Reverse Voltage (V_R): 5 V. Applying a higher reverse voltage can break down the semiconductor junction.
• Power Dissipation (P_d): 60 mW. This is the maximum allowable power (V_F * I_F) the package can dissipate without exceeding its thermal limits.
• Temperature Ranges: Operating: -40°C to +85°C; Storage: -40°C to +100°C. These define the environmental limits for reliable function and non-operational storage.
• Soldering Temperature: 260°C for 5 seconds. This defines the peak temperature and time profile for wave or reflow soldering processes.

2.2 Electro-Optical Characteristics

These are the typical performance parameters measured at 25°C. Designers should use the \"Typ.\" value for initial calculations but design circuits to accommodate the \"Min.\" and \"Max.\" ranges.

• Forward Voltage (V_F): 2.0V to 2.4V at I_F=20mA. A current-limiting resistor is essential, as LEDs are current-driven devices. The voltage is relatively low, compatible with 3.3V and 5V logic systems.
• Luminous Intensity (I_V): Super Yellow: 40-80 mcd (millicandela); Yellow Green: 16-32 mcd. The Super Yellow variant is significantly brighter. Intensity is measured at the typical forward current.
• Viewing Angle (2θ_1/2): Approximately 80 degrees for both colors. This is the full angle where intensity drops to half of its peak value.
• Wavelength Specifications:
  • Peak Wavelength (λ_p): The point of maximum spectral power. UY: ~591 nm; SYG: ~575 nm.
  • Dominant Wavelength (λ_d): The single wavelength perceived by the human eye. UY: ~589 nm; SYG: ~573 nm.
  • Spectral Bandwidth (Δλ): The width of the emitted spectrum at half maximum. UY: ~15 nm; SYG: ~20 nm. A narrower bandwidth indicates a more saturated, pure color.

3. Performance Curve Analysis

The datasheet provides graphical data essential for understanding device behavior under varying conditions.

3.1 Relative Intensity vs. Wavelength

These curves show the spectral power distribution. The Super Yellow curve is centered around 591nm, while the Yellow Green is centered around 575nm. The shapes are typical of AlGaInP materials, with the SYG having a slightly broader spectrum.

3.2 Directivity Pattern

The polar plots confirm the 80-degree viewing angle, showing a near-Lambertian (cosine) distribution common for diffused packages, providing wide, even light.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This is a crucial curve for circuit design. It shows the exponential relationship typical of a diode. The curve is relatively steep in the operating region (around 2V), meaning small changes in voltage cause large changes in current, reinforcing the need for current regulation.

3.4 Relative Intensity vs. Forward Current

This curve shows that light output is approximately linear with current up to the rated maximum. Driving the LED below 20mA will proportionally reduce brightness.

3.5 Temperature Dependence

Two key graphs illustrate thermal effects:

• Relative Intensity vs. Ambient Temperature: Light output decreases as temperature increases. This is a fundamental characteristic of LEDs; efficiency drops at higher junction temperatures.
• Forward Current vs. Ambient Temperature (at constant voltage): If driven by a constant voltage source, the current through the LED will increase as temperature rises because the forward voltage decreases. This can lead to thermal runaway if not properly managed with a current-limiting circuit.

3.6 Chromaticity Coordinate vs. Forward Current (SYG only)

This graph shows how the perceived color (chromaticity) of the Yellow Green LED may shift slightly with changes in drive current. Designers requiring strict color consistency should use constant current drivers.

4. Mechanical and Package Information

4.1 Package Dimensions

The mechanical drawing specifies the physical size of the LED lamp. Key dimensions include the lead spacing, body diameter, and overall height. The flange height is specified to be less than 1.5mm. Standard tolerance for dimensions is ±0.25mm unless otherwise stated. The exact length and width are defined by the drawing (implied as a standard \"336\" package footprint).

4.2 Polarity Identification

The package uses a flange or a flat side on the lens (common in these packages) to denote the cathode (negative) lead. Correct polarity must be observed during installation.

5. Soldering and Assembly Guidelines

Proper handling is critical to prevent damage.

5.1 Lead Forming

• Bends must be made at least 3mm from the epoxy bulb base.
• Forming must be done before soldering, at room temperature.
• Avoid applying stress to the package or leads.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

5.2 Storage Conditions

• Recommended: ≤30°C, ≤70% Relative Humidity.
• Shelf life after shipping: 3 months in original bag.
• For longer storage (up to 1 year): Use a sealed container with nitrogen and desiccant.
• After opening, use within 24 hours to prevent moisture absorption.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

• Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
• Hand Soldering: Iron tip ≤300°C, soldering time ≤3 seconds.
• Wave/Dip Soldering: Preheat ≤100°C (≤60 sec), solder bath ≤260°C for ≤5 seconds.
• Avoid stress on leads during high-temperature phases.
• Do not solder the device more than once.
• Allow the LED to cool to room temperature naturally after soldering before handling or applying mechanical stress.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture ingress.

• Primary Packing: Anti-electrostatic bags (ESD protection for 750V).
• Secondary Packing: Inner cartons containing 5 bags.
• Tertiary Packing: Outside cartons containing 10 inner cartons.
• Packing Quantity: Minimum 200 to 500 pieces per bag. Therefore, an outside carton contains between 10,000 and 25,000 pieces (10 inner cartons * 5 bags * 200-500 pcs).

6.2 Label Explanation

The package label includes several codes for traceability and binning:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 336UYSYGW/S530-A3).
• QTY: Quantity in the bag.
• CAT: Luminous Intensity rank (bin).
• HUE: Dominant Wavelength rank (bin).
• REF: Forward Voltage rank (bin).
• LOT No: Manufacturing lot number for traceability.

7. Application Suggestions and Design Considerations

7.1 Typical Application Circuits

The most common drive method is a series current-limiting resistor. The resistor value (R) can be calculated as: R = (V_supply - V_F) / I_F. For a 5V supply and a typical V_F of 2.0V at 20mA: R = (5 - 2.0) / 0.02 = 150 Ω. A slightly higher value (e.g., 180 Ω) is often used for margin, reducing current and increasing longevity.

7.2 Design Considerations

• Current Drive: Always use a constant current or current-limited circuit. Driving with a constant voltage is not recommended due to the negative temperature coefficient of V_F.
• Thermal Management: While the power is low, ensure the device is not placed near other heat sources. High ambient temperatures will reduce light output and lifespan.
• ESD Protection: Although the bag provides protection, standard ESD handling procedures should be followed during assembly.
• Visual Matching: For applications requiring uniform appearance, specify tight bins for HUE (wavelength) and CAT (intensity).

8. Technical Comparison and Differentiation

The 336UYSYGW/S530-A3 offers specific advantages in its class.

• Dual-Chip vs. Single-Chip: The two-chip design provides inherent redundancy and can offer brighter or multi-color functionality in a single package compared to standard single-die LEDs.
• AlGaInP Material: Compared to older technologies, AlGaInP offers higher efficiency and better color saturation for yellow and green wavelengths.
• Package Options: The availability of both bicolor (diffused) and bipolar (clear) versions in the same package footprint gives designers flexibility for different optical effects (mixed color vs. bright single color).

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED directly from a 3.3V microcontroller pin?
A: It is possible but not ideal. The typical V_F is 2.0V, and a GPIO pin can often source 20mA. However, you must calculate the required series resistor based on the pin's output voltage under load (which may be less than 3.3V). Furthermore, sourcing high current from multiple GPIO pins may exceed the microcontroller's total current budget. Using a transistor or dedicated LED driver is more robust.

Q2: Why is the luminous intensity of the Yellow Green LED lower than the Super Yellow?
A: This is primarily due to the spectral sensitivity of the human eye (photopic response). The eye is most sensitive to green light around 555nm. The Yellow Green (575nm) and Super Yellow (589nm) are on the shoulders of this peak. The conversion from radiant power (watts) to luminous intensity (candelas) results in a lower value for the SYG at the same electrical input, even if the chips have similar electrical-to-optical power conversion efficiency.

Q3: What do the \"UY\" and \"SYG\" codes in the part number mean?
A: They are internal codes for the chip type: \"UY\" likely stands for \"Ultra Yellow\" or \"Super Yellow\", and \"SYG\" for \"Super Yellow Green\". The \"GW\" in the part number may indicate the lens type (e.g., White Diffused).

Q4: How critical is the 3mm distance from the solder joint to the bulb?
A: Very critical. Soldering closer than 3mm transmits excessive heat directly to the epoxy resin and the internal wire bonds. This can cause the epoxy to crack, the bonds to break, or the semiconductor properties to degrade, leading to immediate or premature failure.

10. Practical Use Case Example

Scenario: Designing a status indicator panel for a network router.
The panel requires distinct indicators for \"Power On\" (steady green), \"Network Activity\" (blinking green), and \"System Error\" (steady yellow).

Design Choice: Use the bicolor 336UYSYGW/S530-A3 LED for the \"Network Activity/System Error\" indicator. One chip (SYG) can be driven to show green blinking for activity. The other chip (UY) can be driven to show a steady yellow for an error condition. This saves board space compared to using two separate LEDs. The White Diffused lens blends the light from the two chips when both are on (though not a typical use case), and provides a wide viewing angle suitable for a panel. Separate current-limiting resistors and GPIO pins from the router's main processor would control each chip independently.

11. Technology Introduction

The core technology is based on the AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material system. When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons (light). The specific ratio of Aluminum, Gallium, and Indium in the crystal lattice determines the bandgap energy, which directly defines the wavelength (color) of the emitted light. For this device, the composition is tuned to emit in the yellow and yellow-green regions of the visible spectrum. The use of two independent chips in one package is a packaging innovation that increases functionality without increasing the footprint on a circuit board.

12. Industry Trends

The LED industry continues to evolve towards higher efficiency, greater reliability, and more integrated functionality. Trends relevant to devices like the 336UYSYGW/S530-A3 include:

• Miniaturization: While the 336 package is established, newer designs often use even smaller surface-mount device (SMD) packages like 0603 or 0402 for high-density boards.
• Higher Efficiency: Ongoing material science research aims to improve the internal quantum efficiency (IQE) and light extraction efficiency of AlGaInP and other material systems, yielding more light per watt of electrical input.
• Smart Integration: The trend is moving towards LEDs with integrated drivers (ICs) or even microcontrollers, creating \"smart LED\" modules. However, discrete indicator LEDs like the 336 remain essential for simple, cost-effective applications.
• Color Consistency and Binning: Manufacturing processes are improving to reduce the variance in wavelength and intensity, providing tighter bins and reducing the need for selective sorting by customers.