1259-7SDRSYGW/S530-A3 LED Lamp Datasheet - Super Deep Red & Brilliant Yellow Green - 20mA - 50mcd - English Technical Document

1. Product Overview

The 1259-7SDRSYGW/S530-A3 is a bicolor LED lamp integrating two semiconductor chips within a single package. This device is engineered to emit two distinct colors: Super Deep Red (SDR) and Brilliant Yellow Green (SYG). The primary construction utilizes AlGaInP (Aluminum Gallium Indium Phosphide) material for both chips, which is known for its high efficiency in the red to yellow-green spectrum. The lamp is offered in a white diffused resin package, which helps in achieving a wider and more uniform viewing angle by scattering the light emitted from the chips.

This component is designed for solid-state reliability, offering a long operational life compared to traditional incandescent or fluorescent indicators. It is I.C. compatible, meaning it can be directly driven by standard logic-level outputs from microcontrollers or other digital circuits due to its low forward voltage and current requirements. The product adheres to several environmental and safety standards, including the European Union's RoHS (Restriction of Hazardous Substances) directive, REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulation, and is classified as Halogen-Free, with strict limits on Bromine (Br) and Chlorine (Cl) content.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. For reliable operation, these limits should never be exceeded, even momentarily.

• Continuous Forward Current (I_F): 25 mA for both the SDR and SYG chips. This is the maximum DC current that can continuously flow through the LED.
• Reverse Voltage (V_R): 5 V. Applying a reverse voltage higher than this can break down the LED's PN junction.
• Power Dissipation (P_d): 60 mW per chip. This is the maximum power the LED package can dissipate as heat at an ambient temperature of 25°C.
• Operating Temperature (T_opr): -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature (T_stg): -40°C to +100°C. The device can be stored without applied power within this range.
• Soldering Temperature (T_sol): For reflow soldering, a peak temperature of 260°C for a maximum of 5 seconds is specified.

2.2 Electro-Optical Characteristics

These parameters are measured under standard test conditions (Ta=25°C) and represent the typical performance of the device.

• Forward Voltage (V_F): Ranges from 1.7V to 2.4V, with a typical value of 2.0V at a test current of 20mA for both colors. This low voltage is key for low-power and battery-operated applications.
• Reverse Current (I_R): Maximum of 10 µA at a reverse voltage of 5V, indicating good junction integrity.
• Luminous Intensity (I_V): The SDR chip has a typical intensity of 32 mcd, while the SYG chip is brighter at 50 mcd (both at I_F=20mA). Minimum values are 16 mcd and 25 mcd, respectively.
• Viewing Angle (2θ_1/2): A typical 50-degree half-angle for both colors, providing a reasonably wide field of view.
• Wavelength Specifications:
  • SDR: Peak Wavelength (λ_p) is 650 nm, and Dominant Wavelength (λ_d) is 639 nm.
  • SYG: Peak Wavelength (λ_p) is 575 nm, and Dominant Wavelength (λ_d) is 573 nm.
• Spectrum Radiation Bandwidth (Δλ): Approximately 20 nm for both, defining the spectral purity of the emitted light.

Note the stated measurement uncertainties: ±0.1V for V_F, ±10% for I_V, and ±1.0nm for λ_d.

3. Performance Curve Analysis

3.1 Super Deep Red (SDR) Characteristics

The provided curves offer insight into the SDR chip's behavior under varying conditions.

• Relative Intensity vs. Wavelength: This graph shows the spectral power distribution, centered around 650 nm.
• Directivity Pattern: Illustrates the angular distribution of light intensity, correlating with the 50-degree viewing angle.
• Forward Current vs. Forward Voltage (I-V Curve): Demonstrates the exponential relationship typical of a diode. The curve helps in designing current-limiting circuitry.
• Relative Intensity vs. Forward Current: Shows that light output increases with current but may not be perfectly linear, especially at higher currents.
• Relative Intensity vs. Ambient Temperature: Indicates that luminous intensity decreases as ambient temperature rises, a common characteristic of LEDs due to increased non-radiative recombination.
• Forward Current vs. Ambient Temperature: Likely shows the derating of maximum allowable forward current as temperature increases to stay within the power dissipation limit.

3.2 Brilliant Yellow Green (SYG) Characteristics

The SYG chip shares similar curve types with the SDR, with key differences in the wavelength-specific graphs.

• Relative Intensity vs. Wavelength: Centered around 575 nm.
• Chromaticity Coordinate vs. Forward Current: This is an important graph for the SYG chip, showing how the perceived color (defined by its x,y coordinates on the CIE chromaticity diagram) may shift slightly with changes in drive current. This is critical for applications requiring stable color perception.
• The other curves (Directivity, I-V, Intensity vs. Current/Temperature) follow trends similar to the SDR chip but with values specific to the SYG's material properties.

4. Mechanical & Package Information

The datasheet includes a detailed package dimension drawing. Key mechanical specifications include:

• All dimensions are provided in millimeters.
• A critical note specifies that the height of the component's flange must be less than 1.5mm (0.059 inches). This is likely for compatibility with automated pick-and-place machinery and to ensure proper seating on the PCB.
• The general tolerance for unspecified dimensions is ±0.25mm.
• The drawing typically shows the lead spacing, body size, and polarity indicator (which may be a flat edge or a marked cathode). Proper orientation is crucial for the bicolor function, as reversing polarity will light the other chip.

5. Soldering & Assembly Guidelines

5.1 Lead Forming

If leads need to be bent for through-hole mounting, it must be done with care to avoid damaging the LED.

• Bending should occur at least 3mm from the base of the epoxy lens.
• Forming must be done before soldering.
• Excessive stress on the package during bending can crack the epoxy or damage the internal wire bonds.
• Leads should be cut at room temperature.
• PCB holes must align perfectly with the LED leads to avoid mounting stress.

5.2 Storage

Proper storage prevents moisture absorption and degradation.

• Recommended storage: ≤30°C and ≤70% Relative Humidity (RH).
• Shelf life after shipping is 3 months under these conditions.
• For longer storage (up to 1 year), devices should be kept in a sealed, nitrogen-filled container with desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

Detailed soldering instructions are provided to ensure reliability.

• Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
• Hand Soldering: Iron tip temperature max 300°C (for a 30W iron), soldering time max 3 seconds.
• Wave/DIP Soldering: Preheat max 100°C for 60 sec, solder bath max 260°C for 5 sec.
• A recommended reflow soldering profile is provided, which typically includes a preheat, soak, reflow (peak ~260°C), and cooling ramp with controlled rates to minimize thermal shock.
• Avoid mechanical stress on the leads while the LED is hot.
• Do not solder (dip or hand) more than once.
• Protect the LED from shock/vibration until it cools to room temperature after soldering.
• Rapid thermal processes are not recommended.

6. Packaging & Ordering Information

6.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage during transport and storage.

• Primary Packaging: Anti-electrostatic bags.
• Secondary Packaging: Inner cartons.
• Tertiary Packaging: Outside cartons for bulk shipping.
• Packing Quantity: 200-500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per outside carton.

6.2 Label Explanation

Labels on the packaging contain critical information for traceability and bin selection.

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 1259-7SDRSYGW/S530-A3).
• QTY: Quantity in the package.
• CAT: Rank or bin code for Luminous Intensity.
• HUE: Rank or bin code for Dominant Wavelength.
• REF: Rank or bin code for Forward Voltage.
• LOT No: Manufacturing Lot Number for traceability.

7. Application Suggestions

7.1 Typical Application Scenarios

The datasheet lists several classic applications for indicator lamps:

• TV Sets & Monitors: Used as power, standby, or function status indicators.
• Telephones: Line status, message waiting, or mode indicators.
• Computers: Power, hard drive activity, or network status lights on desktops, laptops, or peripherals.

The bicolor nature allows for dual-status indication from a single component (e.g., red for "off/error" and green for "on/ok"), saving board space.

7.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to set the forward current to the desired value (e.g., 20mA), never connect directly to a voltage source.
• Polarity: For bicolor operation, the anode of one chip is typically the cathode of the other. Circuit design must account for this common-cathode or common-anode configuration.
• Heat Management: While power dissipation is low, ensuring adequate ventilation and avoiding placement near other heat sources helps maintain light output and longevity, especially at high ambient temperatures.
• ESD Protection: Handle with appropriate ESD precautions during assembly.

8. Technical Comparison & Differentiation

While not explicitly compared to other products in this datasheet, key advantages of this component can be inferred:

• Dual-Chip Integration: Combines two indicator colors in one 3mm or 5mm lamp package, reducing part count and PCB footprint compared to using two separate LEDs.
• Material Choice (AlGaInP): Offers high efficiency and good color saturation in the red-orange-yellow-green spectrum range.
• Compliance: Meets modern environmental standards (RoHS, REACH, Halogen-Free), which is essential for products sold in global markets.
• Wide Operating Temperature: The -40°C to +85°C range makes it suitable for consumer, industrial, and some automotive interior applications.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Can I drive this LED at 25mA continuously?

Yes, 25mA is the Absolute Maximum Rating for continuous forward current. For optimal longevity and to account for potential variations in supply voltage or temperature, it is common practice to drive LEDs at a current lower than the maximum, such as the 20mA used for testing. Always refer to the derating guidelines if operating at high ambient temperatures.

9.2 Why are there two different wavelength specifications (Peak and Dominant)?

Peak Wavelength (λ_p) is the wavelength at which the spectral power distribution is highest. Dominant Wavelength (λ_d) is the wavelength of a monochromatic light that would appear to have the same color as the LED to the human eye. For LEDs with a broad spectrum or a spectrum that doesn't perfectly match human eye sensitivity, these two values can differ. Dominant wavelength is often more relevant for color-indication applications.

9.3 What does the "White Diffused" resin color mean for a bicolor LED?

The white diffused resin acts as a light-scattering medium. It mixes the light from the two closely spaced chips more effectively, helping to create a more uniform color appearance across the lens when either chip is lit. It also widens the effective viewing angle compared to a clear resin.

10. Operational Principle Introduction

An LED is a semiconductor diode. When a forward voltage exceeding its threshold is applied, electrons from the n-type semiconductor and holes from the p-type semiconductor are injected into the active region (the PN junction). When these electrons and holes recombine, energy is released in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material used in the active region. In this product, AlGaInP is used, which has a bandgap suitable for emitting light in the red to yellow-green portion of the visible spectrum. The two independent chips inside the package have slightly different material compositions or structures to produce the distinct Super Deep Red and Brilliant Yellow Green colors.

11. Industry Trends & Context

The component described represents a mature and widely used technology for through-hole indicator applications. Industry trends relevant to such devices include:

• Miniaturization: While this is a lamp-style LED, there is a general shift towards surface-mount device (SMD) packages (like 0603, 0402) for indicators to save space and enable automated assembly. However, through-hole LEDs remain popular for prototyping, repair, and applications requiring higher individual visibility or robustness.
• Increased Efficiency: Ongoing material science improvements continue to increase the luminous efficacy (lumens per watt) of all LEDs, including AlGaInP types, allowing for brighter output at the same current or the same brightness at lower power.
• Color Consistency & Binning: Demands for tighter color tolerances in applications like status indicators where brand identity is important drive manufacturers to offer more precise wavelength and intensity binning, as indicated by the CAT, HUE, and REF codes on the label.
• Integration: The integration of two colors into one package, as seen here, is part of a broader trend towards multi-chip LED packages (including RGB LEDs) that offer more functionality in a single component.