209UYOSUGC/S530-A3 LED Lamp Datasheet - Orange/Green Bicolor - 20mA - 3.3V Typ. - English Technical Document

1. Product Overview

The 209UYOSUGC/S530-A3 is a compact, surface-mount LED lamp designed for indicator and backlighting applications. It integrates two semiconductor chips within a single package, enabling the emission of two distinct colors: Brilliant Orange and Brilliant Green. This bicolor configuration provides design flexibility for status indication, multi-state signaling, and aesthetic lighting in space-constrained electronic devices.

The core advantage of this product lies in its matched chip technology, which ensures uniform light output and a consistent wide viewing angle across both colors. Constructed with solid-state reliability, it offers a significantly longer operational life compared to traditional incandescent bulbs. The device is designed for low-power operation, making it compatible with integrated circuit (IC) drive logic, and it adheres to major environmental and safety standards including RoHS, EU REACH, and Halogen-Free requirements.

The target market encompasses consumer electronics and computing peripherals where reliable, low-cost, and multi-functional status indication is required. Its primary applications include television sets, computer monitors, telephones, and various computer components.

2. Technical Parameter Deep-Dive

2.1 Electro-Optical Characteristics

The performance of the LED is defined under standard conditions (Ta=25°C). The device contains two distinct chip types, designated UYO (Brilliant Orange) and SUG (Brilliant Green), each with unique parameters.

Forward Voltage (VF): The UYO (Orange) chip has a typical forward voltage of 2.0V (min 1.7V, max 2.4V) at a test current of 20mA. The SUG (Green) chip operates at a higher typical forward voltage of 3.3V (min 2.7V, max 3.7V) under the same 20mA condition. This difference is critical for circuit design, especially when driving both colors from a common voltage rail, as it may necessitate current-limiting resistors of different values or a constant-current driver.

Luminous Intensity (IV): The typical luminous intensity for the UYO chip is 200 millicandelas (mcd), with a minimum of 100 mcd. The SUG chip offers a higher typical output of 320 mcd, with a minimum of 160 mcd. This parameter defines the perceived brightness of the LED.

Viewing Angle (2θ1/2): Both chips offer a wide, typical viewing angle of 50 degrees. This defines the angular spread within which the luminous intensity is at least half of its peak value, ensuring good visibility from various perspectives.

Spectral Characteristics: The UYO chip emits at a peak wavelength (λp) of 611 nm and a dominant wavelength (λd) of 605 nm, characteristic of the orange-red region. Its spectral bandwidth (Δλ) is 17 nm. The SUG chip emits at a peak wavelength of 518 nm and a dominant wavelength of 525 nm (green), with a broader spectral bandwidth of 35 nm.

2.2 Absolute Maximum Ratings and Electrical Parameters

These ratings define the limits beyond which permanent damage to the device may occur. They should not be exceeded under any operating conditions.

Continuous Forward Current (IF): The maximum allowable continuous forward current for both the UYO and SUG chips is 25 mA. Operating beyond this limit risks catastrophic failure due to overheating.

Reverse Voltage (VR): The maximum reverse voltage that can be applied is 5V. Exceeding this can cause junction breakdown.

Power Dissipation (Pd): The maximum power dissipation for the UYO chip is 60 mW, while for the SUG chip it is 90 mW. This rating considers the total heat generated within the package.

Reverse Current (IR): At the maximum reverse voltage of 5V, the maximum reverse current is 10 μA for UYO and 50 μA for SUG, indicating the leakage characteristics of the diode junction.

3. Thermal and Environmental Specifications

Operating Temperature (Topr): The device is rated for continuous operation within an ambient temperature range of -40°C to +85°C.

Storage Temperature (Tstg): The device can be stored without applied power in a temperature range of -40°C to +100°C.

Soldering Temperature (Tsol): The package is compatible with reflow soldering processes. The recommended profile includes a peak temperature of 260°C for a maximum duration of 5 seconds. This is a critical parameter for PCB assembly to avoid damaging the epoxy resin or the internal wire bonds.

4. Performance Curve Analysis

4.1 UYO (Orange) Chip Characteristics

The provided curves offer a graphical representation of key behaviors. The Relative Intensity vs. Wavelength curve shows a sharp peak centered around 611 nm, confirming the orange color. The Directivity pattern illustrates the 50-degree viewing angle, showing how intensity drops off symmetrically from the center axis.

The Forward Current vs. Forward Voltage (I-V) curve is non-linear, typical of a diode. For the UYO chip, the voltage rises sharply once the turn-on threshold is passed, then increases more gradually with current. The Relative Intensity vs. Forward Current curve shows that light output increases linearly with current up to the rated maximum, which is essential for analog dimming control.

The Relative Intensity vs. Ambient Temperature curve demonstrates thermal quenching: as temperature increases, the luminous efficiency and output intensity decrease. The Forward Current vs. Ambient Temperature curve (at constant voltage) shows that for a fixed applied voltage, the forward current will increase as temperature rises, which is a characteristic of the diode's negative temperature coefficient for forward voltage. This can lead to thermal runaway if not properly managed with a current-limiting circuit.

4.2 SUG (Green) Chip Characteristics

The SUG chip curves follow similar trends but with different numerical values. Its I-V curve starts at a higher voltage, consistent with its 3.3V typical Vf. The intensity vs. current relationship is also linear. An additional curve, Chromaticity Coordinate vs. Forward Current, is provided for the green chip. This curve is crucial as it shows how the perceived color (x,y coordinates on the CIE chart) may shift slightly with changes in drive current, which is a more pronounced effect in InGaN (green/blue) LEDs compared to AlGaInP (red/orange) LEDs.

5. Mechanical and Package Information

The device uses a standard surface-mount package. Key dimensional notes include: all dimensions are in millimeters; the height of the component's flange must be less than 1.5mm; and the general tolerance for unspecified dimensions is ±0.25mm. The dimensional drawing typically shows the body length, width, and height, lead spacing (pitch), and the location of the cathode identifier (often a notch, flat side, or green dot on the package). Proper interpretation of this drawing is essential for PCB footprint design to ensure correct placement and soldering.

6. Soldering and Assembly Guidelines

Proper handling is critical to reliability. Lead Forming: If leads need to be bent (for through-hole variants or unusual SMT placement), bending must occur at least 3mm from the epoxy bulb base, must be done before soldering, and must avoid stressing the package. Cutting leads should be done at room temperature.

Storage: LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The shelf life from shipment is 3 months. For longer storage (up to 1 year), a sealed nitrogen atmosphere with desiccant is recommended. Avoid rapid temperature changes in humid environments to prevent condensation.

Soldering Process: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb. Recommended conditions are:
- Hand Soldering: Iron tip temperature ≤300°C (30W max), time ≤3 seconds.
- Wave/DIP Soldering: Preheat ≤100°C for ≤60 seconds, solder bath ≤260°C for ≤5 seconds.
A soldering profile graph is recommended, showing a gradual ramp-up, a sustained peak, and a controlled cool-down phase to minimize thermal shock. Avoid stress on leads at high temperatures. Do not solder the device more than once using dip or hand methods. Protect the device from mechanical shock until it cools to room temperature after soldering. Rapid forced cooling is not recommended.

7. Packaging and Ordering Information

The product is shipped in moisture-resistant, anti-static packaging to protect it from electrostatic discharge (ESD) and environmental damage during transport and storage. The packing hierarchy is: LEDs are placed in an anti-static bag (200-500 pieces per bag). Six bags are packed into one inner carton. Ten inner cartons are packed into one master (outside) carton.

The label on the packaging contains several codes:
- CPN: Customer's Part Number.
- P/N: Manufacturer's Part Number (209UYOSUGC/S530-A3).
- QTY: Quantity in the package.
- CAT: Luminous Intensity rank (bin).
- HUE: Dominant Wavelength rank (bin).
- REF: Forward Voltage rank (bin).
- LOT No: Manufacturing lot number for traceability.
This binning information (CAT, HUE, REF) is crucial for applications requiring tight color or brightness consistency, as it allows selection of LEDs from specific performance groups.

8. Application Suggestions and Design Considerations

Typical Application Circuits: The most common drive method is a series current-limiting resistor. The resistor value (R) is calculated using Ohm's Law: R = (Vsupply - Vf_LED) / If, where Vf_LED is the forward voltage of the specific chip being driven (UYO or SUG) at the desired current (If, typically 20mA or less). Using a single resistor for both LEDs in parallel is not recommended due to their different Vf characteristics; they should be driven by separate resistors or switched independently.

PCB Layout: The PCB footprint must match the package dimensions exactly. Ensure the cathode/anode orientation is correct on the layout. Provide adequate copper area for heat dissipation if operating near maximum ratings, though for typical indicator use at 20mA, this is less critical.

Multiplexing: For applications requiring independent control of both colors, the bicolor LED can be connected in a common-cathode or common-anode configuration (the datasheet specifies this is a bicolor type, implying two terminals per color, likely a 4-pin device). This allows it to be driven by a microcontroller GPIO pin or a dedicated LED driver IC with multiplexing capability, saving I/O pins.

9. Technical Comparison and Differentiation

The primary differentiation of the 209UYOSUGC/S530-A3 is its dual-chip, bicolor capability in a single SMT package. Compared to using two separate single-color LEDs, this saves PCB space, simplifies assembly (one placement vs. two), and ensures perfect alignment of the two light sources. The matching of chips for uniform output and viewing angle is a key quality feature not always present in lower-cost alternatives.

Its compliance with Halogen-Free (Br<900ppm, Cl<900ppm, Br+Cl<1500ppm), RoHS, and REACH standards makes it suitable for products sold in environmentally regulated markets like the European Union. The specified wide viewing angle (50°) provides better off-axis visibility than narrower-angle LEDs, which is advantageous for panel indicators.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive both the orange and green LEDs simultaneously at their full 20mA?
A: Electrically, yes, if they are on independent circuits. However, consider the total power dissipation within the package. Simultaneous operation at 20mA would result in Pd_UYO ~40mW and Pd_SUG ~66mW (using typical Vf). The combined heat generation must be managed within the package's thermal limits, especially at high ambient temperatures.

Q: Why are the forward voltages so different between the orange and green chips?
A: This is due to the fundamental semiconductor materials. The orange chip uses AlGaInP, which has a lower bandgap energy, resulting in a lower forward voltage (~2.0V). The green chip uses InGaN, which has a higher bandgap, requiring a higher forward voltage (~3.3V) to achieve carrier injection and recombination that emits higher-energy (shorter wavelength) photons.

Q: How do I interpret the 'CAT', 'HUE', and 'REF' codes on the label?
A: These are binning codes. Manufacturers test LEDs and sort them into groups (bins) based on measured performance. 'CAT' groups LEDs by luminous intensity (e.g., 160-200 mcd, 200-240 mcd for SUG). 'HUE' groups by dominant wavelength (e.g., 520-525 nm, 525-530 nm for SUG). 'REF' groups by forward voltage. Ordering a specific bin ensures tighter consistency in your final product's appearance and behavior.

Q: What is the purpose of the 3mm minimum distance from the solder joint to the epoxy bulb?
A> This is a critical thermal management rule. Solder joints get very hot. If the heat from soldering is conducted too close to the epoxy bulb, it can cause several issues: thermal stress cracking of the epoxy, degradation of the epoxy's optical properties (yellowing), or damage to the delicate wire bonds connecting the chip to the leads. The 3mm distance allows the lead frame to act as a heat sink, dissipating the soldering heat before it reaches the sensitive components.

11. Practical Application Example

Scenario: Dual-Status Indicator for a Network Router. A router needs to indicate power (steady) and network activity (blinking). Using the 209UYOSUGC/S530-A3, a designer can implement this with one component: the orange LED can be driven by the power supply rail (via a resistor) to indicate 'Power On'. The green LED can be connected to a microcontroller GPIO pin (via another resistor) and programmed to blink in response to network data packets. This provides a clear, two-color status indication in a single, compact footprint on the front panel. The wide 50-degree viewing angle ensures the status is visible from a wide range in front of the device. The design must calculate separate resistors: e.g., for a 5V supply, R_orange = (5V - 2.0V) / 0.020A = 150 Ohms; R_green = (5V - 3.3V) / 0.020A = 85 Ohms (use nearest standard value, 82 or 91 Ohms).

12. Operating Principle

An LED is a semiconductor diode. When a forward voltage exceeding its bandgap is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material. This recombination event releases energy in the form of a photon (light). The color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material. The 209 lamp uses two different material systems: AlGaInP (Aluminum Gallium Indium Phosphide) for the orange emission and InGaN (Indium Gallium Nitride) for the green emission. These materials are grown as epitaxial layers on a substrate. The specific composition of the alloys is carefully controlled during manufacturing to achieve the target peak and dominant wavelengths. The epoxy resin package serves to protect the delicate semiconductor chips and wire bonds, and its dome shape acts as a primary lens to shape the light output and achieve the specified viewing angle.

13. Technology Trends and Context

The 209UYOSUGC/S530-A3 represents a mature product category within LED technology. Key trends influencing this segment include:
- Increased Efficiency: Ongoing improvements in epitaxial growth and chip design lead to higher luminous efficacy (more light output per electrical watt), allowing for similar brightness at lower currents, reducing power consumption and heat generation.
- Miniaturization: The drive for smaller electronic devices continues to push for LEDs in even smaller package footprints while maintaining or improving optical performance.
- Color Consistency and Binning: Advances in manufacturing process control allow for tighter performance distributions, reducing the need for extensive binning and providing more consistent color and brightness from device to device.
- Integrated Solutions: A trend towards LED drivers with integrated current control and sequencing logic, simplifying the design of multi-color indicator systems. While the basic principle of the bicolor LED remains stable, these surrounding technological advancements continuously improve the performance, reliability, and ease of use of such components in end applications.