209SDRSYGW/S530-A3 Bicolor LED Lamp Datasheet - Deep Red & Yellow Green - 20mA - English Technical Document

1. Product Overview

The 209SDRSYGW/S530-A3 is a bicolor LED lamp designed for indicator and backlighting applications. It integrates two distinct AlGaInP semiconductor chips within a single package, emitting Deep Red and Brilliant Yellow Green light. This dual-chip configuration allows for versatile signaling and status indication in a compact form factor. The lamp is offered in a white diffused resin type for the bicolor version, providing a wide viewing angle and uniform light output.

1.1 Core Advantages

• Matched Chips: The two chips are carefully matched to ensure consistent luminous intensity and color output, enhancing visual uniformity in applications.
• Wide Viewing Angle: Features a typical viewing angle (2θ1/2) of 80 degrees, making it suitable for applications where visibility from various angles is required.
• Solid-State Reliability: As an LED, it offers long operational life, shock resistance, and high reliability compared to traditional incandescent lamps.
• Low Power Consumption & IC Compatibility: Operates at low forward currents (typical 20mA), making it compatible with integrated circuit drivers and suitable for power-sensitive designs.
• Environmental Compliance: The product is compliant with RoHS, EU REACH regulations, and is Halogen Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

This LED is primarily intended for use in consumer electronics and information display equipment, including:

• Television sets (status indicators, backlighting)
• Computer monitors
• Telephones
• General computer peripherals and instrumentation

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA for both Deep Red (SDR) and Brilliant Yellow Green (SYG) chips. Exceeding this current can lead to excessive heat and accelerated degradation of light output.
• Reverse Voltage (V_R): 5 V. Applying a reverse voltage higher than this rating can cause junction breakdown.
• Power Dissipation (P_d): 60 mW per chip. This is the maximum allowable power loss as heat at the junction.
• Operating & Storage Temperature: The device can operate from -40°C to +85°C and be stored from -40°C to +100°C. This wide range makes it suitable for various environmental conditions.
• Soldering Temperature: Withstands reflow soldering at 260°C for 5 seconds, which is compatible with standard lead-free soldering processes.

2.2 Electro-Optical Characteristics (Ta=25°C)

These are the typical performance parameters under standard test conditions.

• Forward Voltage (V_F): Typically 2.0V (range 1.7V to 2.4V) at I_F=20mA for both colors. This low voltage is advantageous for low-voltage circuit designs.
• Luminous Intensity (I_V): The Deep Red chip offers a typical intensity of 50 mcd, while the Brilliant Yellow Green chip offers 32 mcd at 20mA. The minimum values are 25 mcd and 16 mcd, respectively.
• Peak Wavelength (λ_p): Deep Red: 650 nm. Brilliant Yellow Green: 575 nm. These values define the color points on the spectrum.
• Dominant Wavelength (λ_d): Deep Red: 639 nm. Brilliant Yellow Green: 573 nm. This is the wavelength perceived by the human eye.
• Spectrum Radiation Bandwidth (Δλ): Approximately 20 nm for both colors, indicating the spectral purity of the emitted light.

Note on Measurement Uncertainty: Forward Voltage ±0.1V, Luminous Intensity ±10%, Dominant Wavelength ±1.0nm.

3. Performance Curve Analysis

The datasheet provides characteristic curves for each chip color, which are crucial for understanding performance under non-standard conditions.

3.1 Deep Red (SDR) Chip Characteristics

• Relative Intensity vs. Wavelength: Shows a sharp peak around 650 nm, confirming the deep red color emission.
• Directivity Pattern: Illustrates the Lambertian-like emission pattern with the 80-degree viewing angle.
• Forward Current vs. Forward Voltage (I-V Curve): Demonstrates the exponential relationship typical of a diode. The curve helps in designing current-limiting circuitry.
• Relative Intensity vs. Forward Current: Shows that light output increases with current but may become sub-linear at higher currents due to heating effects.
• Relative Intensity vs. Ambient Temperature: Indicates that luminous intensity decreases as ambient temperature rises, a common characteristic of LEDs. Proper thermal management is essential for maintaining brightness.
• Forward Current vs. Ambient Temperature: For a constant voltage drive, the forward current would change with temperature due to the shift in the diode's V_F. Constant current drive is recommended for stable operation.

3.2 Brilliant Yellow Green (SYG) Chip Characteristics

Similar curves are provided for the SYG chip, with the addition of a Chromaticity Coordinate vs. Forward Current graph. This curve is particularly important as it shows how the perceived color (chromaticity coordinates on the CIE diagram) may shift slightly with changes in drive current. For applications requiring consistent color, driving the LED at its nominal current (20mA) is critical.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED uses a standard 209 package (radial leaded). Key dimensions include:

• Lead spacing: Approximately 2.54 mm (standard).
• Epoxy lens diameter and body dimensions as per the detailed drawing.
• Flange height is specified to be less than 1.5mm.
• General tolerance for dimensions is ±0.25mm unless otherwise specified.

4.2 Polarity Identification and Lead Forming

The device has a flat side on the lens or a longer lead (typically the anode) for polarity identification. Critical guidelines for lead forming include:

• Bending must be done at least 3mm from the base of the epoxy bulb to avoid stress on the seal.
• Lead forming must be performed before soldering.
• Mechanical stress on the package during forming must be minimized to prevent internal damage or breakage.
• PCB holes must align perfectly with the LED leads to avoid mounting stress.

5. Soldering and Assembly Guidelines

5.1 Recommended Soldering Conditions

• Hand Soldering: Iron tip temperature max 300°C (for 30W iron max), soldering time max 3 seconds. Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
• Wave/DIP Soldering: Preheat temperature max 100°C (60 sec max), solder bath temperature max 260°C for 5 seconds. Maintain the same 3mm distance rule.
• Avoid applying stress to the leads while the LED is hot.
• Do not solder the device more than once using dip or hand methods.
• Protect the LED from mechanical shock after soldering until it cools to room temperature.

5.2 Storage Conditions

To preserve solderability and device integrity:

• Store at ≤30°C and ≤70% Relative Humidity after receipt.
• Shelf life under these conditions is 3 months.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packed with ESD and moisture protection:

• Primary Packing: Anti-electrostatic bags.
• Secondary Packing: Inner cartons containing 5 bags.
• Tertiary Packing: Outside cartons containing 10 inner cartons.
• Packing Quantity: 200 to 500 pieces per bag. Total per outside carton: 10,000 to 25,000 pieces (based on 5 bags/inner carton * 10 inner cartons * 200-500 pcs/bag).

6.2 Label Explanation

Labels on the packaging include key information for traceability and bin selection:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 209SDRSYGW/S530-A3).
• QTY: Quantity in the package.
• CAT: Luminous Intensity rank (bin).
• HUE: Dominant Wavelength rank (bin).
• REF: Forward Voltage rank (bin).
• LOT No: Manufacturing lot number for traceability.

7. Application Design Considerations

7.1 Circuit Design

Always drive LEDs with a constant current source or a voltage source with a series current-limiting resistor. The resistor value can be calculated using R = (V_supply - V_F) / I_F. Using the typical V_F of 2.0V and a desired I_F of 20mA with a 5V supply: R = (5V - 2.0V) / 0.020A = 150 Ω. A resistor with adequate power rating (P = I²R) should be selected.

7.2 Thermal Management

Although power dissipation is low (60mW per chip), the decrease in luminous intensity with rising ambient temperature (as shown in the performance curves) must be accounted for in the design. Ensure adequate ventilation if the LED is used in enclosed spaces or near other heat-generating components.

7.3 Optical Considerations

The white diffused lens provides a wide, uniform viewing angle but reduces the axial luminous intensity compared to a clear lens. For applications requiring a narrow beam, external optics may be necessary. The bicolor nature allows for multiplexing or individual control of the two colors for multi-state indication.

8. Technical Comparison and Differentiation

The primary differentiation of this product lies in its integration of two distinct, high-efficiency AlGaInP chips in one standard package. Compared to using two separate single-color LEDs, this solution saves PCB space, simplifies assembly, and ensures consistent mechanical alignment of the two color points. The AlGaInP material technology offers high brightness and good efficiency for red and yellow-green wavelengths.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 Can I drive the two chips simultaneously at their maximum current?

Yes, but you must consider the total power dissipation. If both chips are driven at 25mA with a typical V_F of 2.0V, the total power would be approximately 100mW (2 chips * 2.0V * 0.025A). This is below the combined maximum rating (120mW) but close. For reliable long-term operation, derating is advised; operating at the typical 20mA is recommended.

9.2 How do I interpret the luminous intensity bins (CAT on label)?

The manufacturer sorts LEDs into bins based on measured luminous intensity. A specific CAT code corresponds to a range of mcd values (e.g., a bin for 40-60 mcd for the SDR chip). For consistent brightness in your application, specify or request LEDs from the same intensity bin.

9.3 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λ_p) is the wavelength at which the spectral power distribution is maximum. Dominant wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED. λ_d is more relevant for color specification in human-centric applications.

10. Practical Use Case Example

Scenario: Dual-State Power Indicator for a Device. The Deep Red chip can be used to indicate "Standby" or "Charging" mode, while the Brilliant Yellow Green chip indicates "Power On" or "Fully Charged" mode. A simple microcontroller or logic circuit can switch between driving the anode of one LED or the other (assuming a common cathode configuration, which is typical for such bicolor LEDs). The wide viewing angle ensures the status is visible from various positions. The low power consumption aligns with energy efficiency goals for the end product.

11. Operating Principle

Light is produced through electroluminescence in a semiconductor p-n junction. When a forward voltage is applied, electrons and holes recombine in the active region (made of AlGaInP material for these colors), releasing energy in the form of photons. The specific bandgap energy of the AlGaInP alloy determines the wavelength (color) of the emitted light. The diffused epoxy resin lens encapsulates the chip, provides mechanical protection, and shapes the light output pattern.

12. Technology Trends

AlGaInP-based LEDs are a mature and highly efficient technology for amber, red, and yellow-green colors. Current trends in indicator-type LEDs focus on increasing efficiency (more light output per mA), improving color consistency through tighter binning, and enhancing reliability under harsh environmental conditions. The integration of multiple chips or even RGB chips in a single package for full-color capability is also a common development path, extending the functionality of simple indicator lamps.