LED Lamp 313-2SUBC/C470/S400-A4 Datasheet - Blue Color - 3.4V Forward Voltage - 20mA Operating Current - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the 313-2SUBC/C470/S400-A4 LED lamp. This component is a high-brightness, blue light-emitting diode designed for applications requiring reliable and robust performance. It is compliant with key environmental regulations including RoHS, EU REACH, and halogen-free standards, ensuring its suitability for modern electronic designs with strict material requirements.

The LED is offered on tape and reel for automated assembly processes and is available with various viewing angles to suit different application needs. Its primary design goal is to deliver higher luminous intensity in a standard lamp package format.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the limits beyond which permanent damage to the device may occur. These values are specified at an ambient temperature (Ta) of 25\u00b0C.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (IFP): 100 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (Pd): 120 mW. This is the maximum power the device can dissipate.
• Operating Temperature (Topr): -40 to +85 \u00b0C. The range within which the device is designed to function.
• Storage Temperature (Tstg): -40 to +100 \u00b0C.
• Soldering Temperature (Tsol): 260\u00b0C for 5 seconds, defining the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

The electro-optical characteristics are measured under standard test conditions (Ta=25\u00b0C, IF=20mA) and represent the typical performance of the device.

• Luminous Intensity (Iv): 630 (Min), 1000 (Typ) mcd. This is a measure of the perceived brightness of the blue light. The measurement uncertainty is \u00b110%.
• Viewing Angle (2\u03b81/2): 20\u00b0 (Typ). This defines the angular width at which the luminous intensity drops to half its maximum value.
• Peak Wavelength (\u03bbp): 468 nm (Typ). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (\u03bbd): 470 nm (Typ). The single wavelength perceived by the human eye, with an uncertainty of \u00b11.0 nm.
• Spectrum Radiation Bandwidth (\u0394\u03bb): 35 nm (Typ). The spectral width of the emitted light.
• Forward Voltage (VF): 3.4 (Typ), 4.0 (Max) V. The voltage drop across the LED when operating at 20mA, with an uncertainty of \u00b10.1V.
• Reverse Current (IR): 50 \u00b5A (Max) at VR=5V. The small leakage current when the device is reverse-biased.

3. Binning System Explanation

The product uses a binning system to categorize units based on key optical and electrical parameters, ensuring consistency for the end-user. The labels on the packaging indicate these bins:

• CAT: Ranks of Luminous Intensity. Groups LEDs based on their measured Iv output.
• HUE: Ranks of Dominant Wavelength. Groups LEDs based on their \u03bbd to ensure color consistency.
• REF: Ranks of Forward Voltage. Groups LEDs based on their VF to aid in circuit design for consistent current drive.

This system allows designers to select LEDs that match the specific requirements of their application, particularly important for applications where color or brightness uniformity is critical.

4. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate device behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution of the emitted blue light, centered around 468-470 nm with a typical bandwidth of 35 nm. It confirms the monochromatic nature of the LED's output.

4.2 Directivity Pattern

The directivity plot visualizes the 20-degree viewing angle, showing how the luminous intensity decreases as the observation angle moves away from the central axis (0 degrees).

4.3 Forward Current vs. Forward Voltage (IV Curve)

This fundamental curve shows the exponential relationship between current (I) and voltage (V) for a semiconductor diode. The typical forward voltage of 3.4V at 20mA is clearly indicated. The curve is essential for designing the current-limiting circuitry.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output (relative intensity) increases with forward current. However, operation must remain within the absolute maximum ratings (25mA continuous) to prevent overheating and accelerated degradation.

4.5 Temperature Dependence Curves

Two key curves show the effect of ambient temperature (Ta):
Relative Intensity vs. Ambient Temp: Shows that luminous output typically decreases as the junction temperature increases. This is a critical consideration for thermal management in high-power or high-ambient-temperature applications.
Forward Current vs. Ambient Temp: Illustrates how the forward voltage characteristic shifts with temperature, which can affect the current drawn if driven by a constant voltage source.

5. Mechanical and Package Information

The LED uses a standard lamp-style package with two leads. The package drawing provides critical dimensions for PCB footprint design and mechanical integration.

• All dimensions are provided in millimeters.
• A key specification is that the height of the flange must be less than 1.5mm (0.059\").
• The standard tolerance for dimensions, unless otherwise specified, is \u00b10.25mm.
• The drawing clearly indicates the cathode (usually the shorter lead or a flat side on the lens) for correct polarity during installation.

Adherence to these dimensions is crucial for proper placement in automated assembly and for ensuring the LED sits correctly on the PCB.

6. Soldering and Assembly Guidelines

Proper handling is essential to maintain device reliability and performance.

6.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb to avoid stress on the internal die and wire bonds.
• Forming must be done before soldering.
• Leads should be cut at room temperature.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

6.2 Storage

• Recommended storage: \u2264 30\u00b0C and \u2264 70% Relative Humidity.
• Shelf life after shipping: 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Once opened, use within 24 hours to prevent moisture absorption.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:
Iron tip temperature: 300\u00b0C Max (30W iron max).
Soldering time per lead: 3 seconds Max.

Wave (DIP) Soldering:
Preheat temperature: 100\u00b0C Max (60 sec max).
Solder bath temperature & time: 260\u00b0C Max for 5 seconds Max.
A recommended soldering temperature profile is provided, emphasizing controlled ramp-up, a defined time above liquidus, and controlled cooling.

Important Notes:
Avoid stress on leads during high-temperature operations.
Do not solder (dip or hand) more than once.
Protect the LED from mechanical shock until it cools to room temperature after soldering.
Use the lowest possible temperature that achieves a reliable solder joint.

6.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for \u2264 1 minute.
• Dry at room temperature before use.
• Ultrasonic cleaning is generally not recommended. If absolutely required, extensive pre-qualification is necessary to ensure no damage occurs, as it depends on power, frequency, and assembly conditions.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to prevent electrostatic discharge (ESD) and moisture damage:
1. LEDs are placed in anti-static bags.
2. Bags are packed into inner cartons.
3. Inner cartons are packed into master outside cartons.

Packing Quantity:
200 to 500 pieces per bag.
5 bags per inner carton.
10 inner cartons per outside carton.

7.2 Label Explanation

Packaging labels include:
CPN: Customer's Part Number.
P/N: Manufacturer's Part Number (e.g., 313-2SUBC/C470/S400-A4).
QTY: Quantity in the package.
CAT/HUE/REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
LOT No: Traceable manufacturing lot number.

8. Application Suggestions

8.1 Typical Application Scenarios

Based on its high brightness and blue color, this LED is suitable for:
\u2022 Status Indicators: Power-on, standby, or function-active indicators in consumer and industrial electronics.
\u2022 Backlighting: For small LCD displays, keypads, or decorative lighting in devices like monitors, TVs, or telephones (as listed in the datasheet).
\u2022 Panel Lighting: Illumination for switches, control panels, or instrumentation.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit the forward current to the desired value (e.g., 20mA for typical brightness), never connect directly to a voltage source.
• Thermal Management: While power dissipation is low (120mW max), ensure adequate ventilation if multiple LEDs are used or if ambient temperatures are high, as efficiency drops with temperature.
• PCB Layout: Follow the package dimensions precisely. Ensure the polarity marking on the PCB matches the LED's cathode.
• ESD Protection: Although not explicitly stated as highly sensitive, standard ESD handling precautions for semiconductors are recommended during assembly.

9. Technical Comparison and Differentiation

This LED's key differentiating features based on the datasheet are:
1. High Brightness: A typical luminous intensity of 1000 mcd at 20mA is notable for a standard lamp package blue LED.
2. Environmental Compliance: Full compliance with RoHS, REACH, and halogen-free standards makes it suitable for global markets with strict environmental regulations.
3. Robust Construction: Designed for reliability, with clear guidelines for soldering and handling to ensure longevity.
4. Binning: The provision of intensity, wavelength, and voltage bins allows for tighter design control in applications requiring uniformity.

Compared to non-binned or lower-intensity LEDs, this part offers better consistency and performance for applications where these factors are critical.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25mA. Exceeding this rating risks permanent damage due to overheating and accelerated degradation. For higher brightness, select an LED rated for a higher current.

Q: What resistor value should I use with a 5V supply?
A: Using Ohm's Law: R = (Vsupply - Vf) / If. With a typical Vf of 3.4V and target If of 20mA: R = (5 - 3.4) / 0.02 = 80 ohms. Use the maximum Vf (4.0V) to calculate the minimum safe resistor value: R_min = (5 - 4.0) / 0.02 = 50 ohms. A standard value like 68 or 75 ohms would be appropriate, ensuring current stays below 20mA even with a low Vf LED.

Q: Why is the viewing angle only 20 degrees?
A> The 20-degree viewing angle is a design characteristic of this specific LED, achieved through the shape of the epoxy lens. It concentrates the light into a narrower beam, resulting in higher axial luminous intensity (mcd). For wider illumination, an LED with a wider viewing angle (e.g., 60\u00b0 or 120\u00b0) would be required.

Q: How does temperature affect performance?
A> As shown in the curves, increasing ambient temperature causes a decrease in light output and a shift in forward voltage. For stable operation, especially in high-temperature environments, proper thermal design (e.g., PCB copper area, ventilation) and possibly temperature compensation in the drive circuit should be considered.

11. Practical Use Case Example

Scenario: Designing a status indicator panel for a network router.
The panel requires a bright, distinct blue LED to indicate \"WAN Active\" status. Four identical LEDs are needed for symmetry.

Design Steps:
1. Selection: The 313-2SUBC/C470/S400-A4 is chosen for its high brightness (1000 mcd typ) and blue color.
2. Circuit Design: The router's internal logic supply is 3.3V. Using the typical Vf of 3.4V presents a challenge, as 3.3V is less than the required Vf. Therefore, the LED cannot be driven directly from 3.3V. A simple charge pump or boost circuit would be needed to generate a voltage >4.0V, or an alternative LED with a lower Vf must be selected. This highlights the importance of checking supply voltage against forward voltage early in the design.
3. PCB Layout: The package drawing is used to create the footprint. A polarity marker (e.g., a square pad for the cathode) is added to the PCB silkscreen.
4. Assembly: The LEDs are ordered on tape and reel. The pick-and-place machine is programmed with the correct centroid coordinates from the footprint. The reflow soldering profile follows the recommended 260\u00b0C peak for 5 seconds.
5. Binning: To ensure all four LEDs have identical color and brightness, an order is placed requesting units from the same HUE and CAT bins.

12. Operating Principle Introduction

This LED is a semiconductor light source. Its core is a chip made of InGaN (Indium Gallium Nitride) materials, as indicated in the Device Selection Guide. When a forward voltage exceeding the diode's threshold (approximately 3.4V) is applied, electrons and holes are injected into the active region of the semiconductor junction. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which in turn dictates the wavelength (color) of the emitted light\u2014in this case, blue (~470 nm). The epoxy resin package serves to protect the delicate semiconductor chip, acts as a lens to shape the light output beam (creating the 20\u00b0 viewing angle), and is formulated to be water-clear to maximize light transmission.

13. Technology Trends and Context

Blue LEDs based on InGaN technology represent a significant advancement in solid-state lighting. The development of efficient blue LEDs was a major scientific achievement, enabling the creation of white LEDs (by combining blue with yellow phosphors) and full-color RGB displays. This particular component exemplifies a mature, commercially optimized version of this technology. Current trends in LED development focus on increasing efficiency (lumens per watt), improving color rendering index (CRI) for white light, achieving higher power densities, and further miniaturization. While this is a standard lamp package, the industry is increasingly moving towards surface-mount device (SMD) packages like 2835 or 3030 for better thermal performance and automated assembly. The environmental compliance (RoHS, Halogen-Free) highlighted in this datasheet is now a standard requirement, reflecting the electronics industry's focus on sustainability and material safety.