LED Lamp 7344-15SUBC/C470/S400-A6 Datasheet - Blue Color - 3.3V Typ. - 20mA - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness blue LED lamp, identified by the part number 7344-15SUBC/C470/S400-A6. This component is part of a series specifically engineered for applications demanding superior luminous output. The LED is available in various configurations to suit different design requirements.

1.1 Core Advantages and Product Positioning

The LED offers several key features that position it as a reliable choice for electronic designs. It provides a choice of various viewing angles, allowing designers to select the optimal beam pattern for their application. The component is designed to be reliable and robust, ensuring consistent performance. It is compliant with major environmental and safety standards, being Pb-free, RoHS compliant, EU REACH compliant, and Halogen Free (with Bromine <900 ppm, Chlorine <900 ppm, and Br+Cl < 1500 ppm). Availability on tape and reel facilitates efficient automated assembly processes in high-volume manufacturing.

1.2 Target Market and Applications

This LED is targeted at the consumer electronics and display industries. Its primary applications include backlighting for TV sets and computer monitors, indicator lights in telephones, and general-purpose illumination within computers. The high brightness makes it suitable for situations where clear, visible light output is critical.

2. In-Depth Technical Parameter Analysis

The performance of the LED is defined by a set of absolute maximum ratings and standard electro-optical characteristics measured at an ambient temperature (Ta) of 25°C.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They should not be exceeded under any operating conditions.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (IFP): 100 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz.
• Reverse Voltage (VR): 5 V. Applying a voltage higher than this in reverse bias can damage the LED junction.
• Power Dissipation (Pd): 90 mW. This is the maximum power the package can dissipate.
• Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range for reliable operation.
• Storage Temperature (Tstg): -40°C to +100°C. The temperature range for non-operational storage.
• Soldering Temperature (Tsol): 260°C for 5 seconds. The maximum thermal profile for soldering processes.

2.2 Electro-Optical Characteristics

These parameters define the typical performance of the LED under standard test conditions (IF=20mA, Ta=25°C unless noted).

• Luminous Intensity (Iv): 1000 (Min.) to 2000 (Typ.) mcd. This specifies the light output power as perceived by the human eye.
• Viewing Angle (2θ1/2): 20° (Typ.). This is the full angle at which the luminous intensity drops to half of its peak value, indicating a relatively narrow beam.
• Peak Wavelength (λp): 468 nm (Typ.). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): 470 nm (Typ.). The single wavelength perceived by the human eye, defining the blue color.
• Spectrum Radiation Bandwidth (Δλ): 35 nm (Typ.). The width of the emitted spectrum, measured at half the peak intensity (FWHM).
• Forward Voltage (VF): 2.7V (Min.), 3.3V (Typ.), 3.7V (Max.) at 20mA. The voltage drop across the LED when operating.
• Reverse Current (IR): 50 μA (Max.) at VR=5V. The small leakage current when the LED is reverse-biased.

2.3 Device Selection and Chip Technology

The LED utilizes an InGaN (Indium Gallium Nitride) semiconductor chip material to produce blue light. The resin encapsulant is water clear, which is optimal for blue LEDs as it does not alter the color and allows for maximum light extraction.

3. Performance Curve Analysis

Graphical data provides deeper insight into the LED's behavior under varying conditions.

3.1 Spectral and Angular Distribution

The Relative Intensity vs. Wavelength curve shows a characteristic blue emission spectrum centered around 468-470 nm with a typical FWHM of 35 nm. The Directivity curve visually represents the 20° viewing angle, showing how light intensity decreases from the center axis.

3.2 Electrical and Thermal Characteristics

The Forward Current vs. Forward Voltage (IV Curve) demonstrates the exponential relationship typical of diodes. At the typical operating point of 20mA, the voltage is approximately 3.3V. The Relative Intensity vs. Forward Current curve shows that light output increases with current but may become sub-linear at higher currents due to heating and efficiency droop. The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature curves are crucial for thermal management, showing how both light output and forward voltage characteristics shift with temperature. Light output generally decreases as temperature rises.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The datasheet includes a detailed mechanical drawing of the LED package. Key dimensional notes specify that all dimensions are in millimeters, the height of the flange must be less than 1.5mm (0.059\"), and the general tolerance is ±0.25mm unless otherwise stated. The drawing defines the lead spacing, body size, and overall shape critical for PCB footprint design.

4.2 Polarity Identification and Mounting

While not explicitly detailed in the provided text, standard LED lamps have a longer anode (+) lead and a shorter cathode (-) lead, often with a flat spot on the cathode side of the plastic lens or base. The note stresses that PCB holes must align exactly with the LED leads to avoid mounting stress.

5. Soldering and Assembly Guidelines

Proper handling is essential for reliability.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Stress can damage internal bonds or crack the epoxy.
• Cut leads at room temperature.
• Ensure precise PCB hole alignment to prevent stress during insertion.

5.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity post-shipment.
• Storage life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process Parameters

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:

• Iron Tip Temperature: Max. 300°C (for a 30W max iron)
• Soldering Time: Max. 3 seconds per lead

Dip (Wave) Soldering:

• Preheat Temperature: Max. 100°C (for max. 60 seconds)
• Solder Bath Temperature & Time: Max. 260°C for 5 seconds

A recommended soldering temperature profile graph is provided, emphasizing a controlled ramp-up, peak, and cool-down phase. Key additional instructions include:

• Avoid mechanical stress on leads at high temperature.
• Do not solder (dip or hand) more than once.
• Protect the LED from shock/vibration until it cools to room temperature after soldering.
• Avoid rapid cooling from peak temperature.
• Use the lowest possible soldering temperature that achieves a reliable joint.

5.4 Cleaning

• Clean only if necessary, using isopropyl alcohol at room temperature for ≤1 minute.
• Dry at room temperature.
• Do not use ultrasonic cleaning routinely. If absolutely required, pre-qualify the process (power, time, fixture) to ensure no damage occurs.

5.5 Heat Management

Effective thermal management is critical for LED longevity and performance stability. Designers must consider the heat dissipation path in the application. The operating current should be appropriately de-rated based on the ambient temperature, referring to the de-rating curve typically found in the product specification. The note explicitly states that the temperature surrounding the LED in the application must be managed.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to ensure protection from electrostatic discharge (ESD) and moisture.

• Primary Packing: Anti-electrostatic bag.
• Secondary Packing: Inner carton containing multiple bags.
• Tertiary Packing: Outside carton containing multiple inner cartons.

Packing Quantity: Typically 200-500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per outside carton.

6.2 Label Explanation

Labels on packaging contain several key identifiers:

• CPN: Customer's Production Number
• P/N: Production Number (Part Number)
• QTY: Packing Quantity
• CAT: Ranks (likely performance bins)
• HUE: Dominant Wavelength
• REF: Reference
• LOT No: Lot Number for traceability

7. Application Suggestions and Design Considerations

7.1 Typical Application Scenarios

This high-brightness blue LED is ideal for:

• Status Indicators: Providing clear, visible power-on or activity signals in dim or bright ambient light.
• Backlighting: For small LCD displays, keypads, or decorative panels in consumer devices.
• Decorative Lighting: In accent lighting for electronics where a sharp blue color is desired.

7.2 Critical Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit the forward current to 20mA or less for continuous operation. Do not connect directly to a voltage source.
• PCB Layout: Design the PCB footprint exactly per the package dimensions. Ensure adequate copper area or thermal vias for heat dissipation if operating near maximum ratings.
• ESD Protection: Implement standard ESD handling procedures during assembly, as LEDs are sensitive to electrostatic discharge.
• Optical Design: The 20° viewing angle is relatively narrow. Consider this for lens or light guide design to achieve the desired illumination pattern.

8. Technical Comparison and Differentiation

While a direct comparison requires specific competitor data, this LED's key differentiators based on its datasheet are its combination of high luminous intensity (up to 2000 mcd) and comprehensive compliance (RoHS, REACH, Halogen-Free). The narrow 20° viewing angle is a specific feature, not an advantage or disadvantage universally, but a characteristic that makes it suitable for applications requiring directed light rather than wide-area illumination. The robust soldering specifications (260°C for 5s) indicate good compatibility with standard lead-free reflow processes.

9. Frequently Asked Questions (FAQ)

Q: What is the recommended operating current for this LED?
A: The standard test condition and typical operating point is 20mA DC. It should not exceed 25mA continuously.

Q: Can I drive this LED with a 5V supply?
A: Not directly. With a typical Vf of 3.3V at 20mA, a series resistor is required. The value can be calculated as R = (Supply Voltage - Vf) / If. For a 5V supply: R = (5V - 3.3V) / 0.02A = 85 ohms. Use the nearest standard value (e.g., 82 or 100 ohms) and check the resulting current.

Q: How do I identify the anode and cathode?
A: For a standard radial LED lamp, the longer lead is the anode (+). Often, the cathode (-) side of the plastic lens or the flange has a flat edge or mark.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range is -40°C to +85°C, which covers many outdoor conditions. However, the package is not inherently waterproof. For outdoor use, additional environmental sealing (conformal coating, enclosures) is necessary to protect against moisture and contaminants.

Q: Why is maintaining a 3mm distance from the solder joint to the bulb so important?
A: This prevents excessive heat from traveling up the lead and damaging the internal semiconductor die or the epoxy encapsulant, which can cause premature failure or darkening of the lens.

10. Practical Use Case Example

Scenario: Designing a status indicator for a network router.
The LED needs to be clearly visible from across a room. The designer selects this LED for its high brightness (2000 mcd). They design a PCB with a footprint matching the package drawing. A 100-ohm current-limiting resistor is placed in series with the LED, connected to a 3.3V microcontroller GPIO pin. This provides approximately (3.3V - 3.3V)/100Ω = 0mA at low logic and (3.3V - 2.7V)/100Ω = 6mA at high logic (using min Vf), which is safe and sufficiently bright. During assembly, the production line uses the specified wave soldering profile. The narrow 20° viewing angle is perfect, as it creates a bright, focused spot of light directed at the user, even in a well-lit room.

11. Operating Principle Introduction

This is a light-emitting diode (LED), a semiconductor photonic device. Its core is a chip made of InGaN materials. When a forward voltage is applied (exceeding the forward voltage Vf), electrons and holes are injected across the semiconductor p-n junction. When these charge carriers recombine, they release energy in the form of photons (light). The specific wavelength (blue, 470 nm) is determined by the bandgap energy of the InGaN material system. The water-clear epoxy resin encapsulant protects the chip, acts as a lens to shape the light output (creating the 20° viewing angle), and enhances light extraction from the semiconductor.

12. Technology Trends and Context

Blue LEDs based on InGaN technology represent a foundational achievement in solid-state lighting. The development of efficient blue LEDs enabled the creation of white LEDs (by combining blue with yellow phosphors) and full-color RGB displays. Current trends in LED technology focus on increasing efficiency (lumens per watt), improving color rendering index (CRI) for white light, achieving higher power densities for general lighting, and developing miniaturized and integrated solutions (like micro-LEDs). This particular component fits into the category of a standard, reliable, mid-power indicator LED, a workhorse component whose basic technology is mature and widely deployed across the electronics industry.