LED Lamp 383-2SUBC/C470/S400-A6 Datasheet - Blue Color - 3.3V Typical Forward Voltage - 20mA Operating Current - English Technical Documentation

1. Product Overview

This document details the specifications for a high-brightness blue LED lamp, designed for applications requiring superior luminous output. The device utilizes an InGaN chip to produce blue light with a typical dominant wavelength of 470nm. It is characterized by a compact package, reliable performance, and compliance with environmental standards including RoHS, REACH, and halogen-free requirements.

1.1 Core Advantages

• High Luminous Intensity: Offers a typical luminous intensity of 3200 mcd at 20mA, making it suitable for backlighting and indicator applications requiring high visibility.
• Narrow Viewing Angle: Features a typical viewing angle (2θ1/2) of 20 degrees, providing focused and directed light output.
• Environmental Compliance: The product is compliant with RoHS, EU REACH, and is halogen-free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm), ensuring suitability for modern electronic manufacturing.
• Packaging Flexibility: Available on tape and reel for automated assembly processes.
• Robust Construction: Designed to be reliable and robust under specified operating conditions.

1.2 Target Market & Applications

This LED is primarily targeted at consumer electronics and display backlighting markets. Its key application areas include:

• Television Sets (TV Backlighting)
• Computer Monitors
• Telephones
• General Computer Peripherals and Indicators

2. In-Depth Technical Parameter Analysis

A comprehensive analysis of the device's electrical, optical, and thermal limits and characteristics.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or beyond these limits is not advised.

• Continuous Forward Current (I_F): 25 mA
• Peak Forward Current (I_FP): 100 mA (Duty Cycle 1/10 @ 1 kHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 90 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Soldering Temperature (T_sol): 260°C for 5 seconds (wave or reflow)

2.2 Electro-Optical Characteristics (T_a=25°C)

These are the typical performance parameters measured under standard test conditions (20mA forward current, unless otherwise specified).

• Luminous Intensity (I_v): Min: 1600 mcd, Typ: 3200 mcd. This high intensity is a key feature for backlighting.
• Viewing Angle (2θ_1/2): Typical: 20 degrees. This narrow beam is ideal for directed lighting.
• Peak Wavelength (λ_p): Typical: 468 nm.
• Dominant Wavelength (λ_d): Typical: 470 nm. This defines the perceived blue color.
• Spectrum Radiation Bandwidth (Δλ): Typical: 35 nm. This indicates the spectral purity of the blue light.
• Forward Voltage (V_F): Min: 2.7V, Typ: 3.3V, Max: 3.7V at I_F=20mA. Designers must account for this voltage drop in their driver circuits.
• Reverse Current (I_R): Max: 50 μA at V_R=5V.

Measurement Uncertainties: Luminous Intensity (±10%), Dominant Wavelength (±1.0nm), Forward Voltage (±0.1V).

3. Binning System Explanation

The datasheet indicates the use of a binning system to categorize LEDs based on key performance variations. This ensures consistency within a production batch for critical applications.

• CAT (Ranks of Luminous Intensity): Bins LEDs according to their measured light output.
• HUE (Ranks of Dominant Wavelength): Bins LEDs based on the specific shade or peak of blue color emitted.
• REF (Ranks of Forward Voltage): Bins LEDs according to their forward voltage drop at a specified current.

Specific bin codes (e.g., C470 in the part number) are used in the ordering information to select the desired performance characteristics.

4. Performance Curve Analysis

The provided characteristic curves offer deeper insight into device behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking around 468-470 nm (blue) with a typical bandwidth of 35 nm, confirming the monochromatic nature of the output.

4.2 Directivity Pattern

The polar plot illustrates the 20-degree viewing angle, showing how light intensity decreases sharply outside the central beam.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This non-linear curve is crucial for driver design. It shows the exponential relationship between current and voltage, with the typical operating point at 20mA/3.3V. The curve helps in selecting appropriate current-limiting resistors or constant-current drivers.

4.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output (intensity) increases with forward current. However, operation must remain within the absolute maximum rating of 25mA continuous current to prevent overheating and accelerated degradation.

4.5 Thermal Performance Curves

Relative Intensity vs. Ambient Temperature: Shows that luminous output decreases as ambient temperature rises. Effective thermal management is essential to maintain brightness in the application.

Forward Current vs. Ambient Temperature: This de-rating curve is critical for reliability. It indicates the maximum allowable forward current must be reduced as the ambient temperature increases to stay within the device's power dissipation limits and prevent thermal runaway.

5. Mechanical & Package Information

5.1 Package Dimensions

The LED features a standard radial leaded package (often referred to as a \"lamp\" package). Key dimensional notes from the drawing include:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm (0.059\").
• Standard tolerance is ±0.25mm unless otherwise specified.

The dimensional drawing provides precise measurements for lead spacing, body diameter, and overall height, which are essential for PCB footprint design and mechanical fit.

5.2 Polarity Identification

The cathode (negative lead) is typically identified by a flat spot on the LED lens or by the shorter lead. The datasheet diagram should be consulted for the specific polarity marking of this component.

6. Soldering & Assembly Guidelines

Proper handling is critical to ensure reliability and prevent damage.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package; misalignment during PCB mounting can cause resin cracking and failure.
• Cut leads at room temperature.

6.2 Storage Conditions

• Store at ≤30°C and ≤70% RH after receipt. Shelf life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Parameters

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:

- Iron Tip Temperature: 300°C Max. (30W Max.)

- Soldering Time: 3 seconds Max.

Wave/Dip Soldering:

- Preheat Temperature: 100°C Max. (60 sec Max.)

- Solder Bath Temperature & Time: 260°C Max., 5 seconds Max.

General Soldering Rules:

- Avoid stress on leads during high-temperature operations.

- Do not solder (dip or hand) more than once.

- Protect the LED from shock/vibration until it cools to room temperature after soldering.

- Avoid rapid cooling from peak temperature.

- Always use the lowest effective temperature.

6.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning. If absolutely required, extensive pre-qualification is necessary to ensure no damage occurs.

7. Thermal Management & ESD Precautions

7.1 Heat Management

LED performance and lifespan are highly temperature-dependent. Designers must:

• Consider heat dissipation from the early design stage.
• De-rate the operating current according to the \"Forward Current vs. Ambient Temperature\" curve.
• Control the temperature around the LED in the final application to maintain brightness and longevity.

7.2 ESD (Electrostatic Discharge) Sensitivity

The product is sensitive to electrostatic discharge. Standard ESD handling procedures must be followed during assembly and handling, including the use of grounded workstations, wrist straps, and conductive containers.

8. Packaging & Ordering Information

8.1 Packing Specification

• Primary Packing: Anti-electrostatic bag (Moisture-resistant).
• Secondary Packing: Inner carton.
• Tertiary Packing: Outside carton.

8.2 Packing Quantity

• 200 to 500 pieces per bag.
• 6 bags per inner carton.
• 10 inner cartons per outside carton.

8.3 Label Explanation

Labels on packaging contain critical information:

- CPN: Customer's Production Number

- P/N: Production Number (Part Number)

- QTY: Packing Quantity

- CAT/HUE/REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage.

- LOT No: Traceability Lot Number.

9. Application Design Considerations

9.1 Driver Circuit Design

Due to the non-linear I-V characteristic, a simple series resistor is often sufficient for indicator use. For backlighting arrays or precise current control, a constant current driver is recommended to ensure uniform brightness and protect the LEDs. Calculate the series resistor using R = (V_supply - V_F) / I_F, using the max V_F for a safe design.

9.2 PCB Layout

Ensure the PCB hole pattern matches the LED's lead spacing precisely to avoid mechanical stress. Provide adequate copper area or thermal vias for heat dissipation if operating near maximum ratings.

9.3 Optical Integration

The 20-degree viewing angle makes this LED suitable for applications requiring a focused beam. For wider illumination, secondary optics (lenses or diffusers) will be necessary.

10. Technical Comparison & Differentiation

Compared to standard indicator LEDs, this device's primary differentiators are its very high luminous intensity (3200 mcd typ) and narrow viewing angle. It is engineered for applications where high brightness in a specific direction is paramount, such as backlighting for LCD panels in monitors and TVs, rather than for omnidirectional status indication.

11. Frequently Asked Questions (Based on Technical Parameters)

Q: What is the typical operating current and voltage?

A: The standard test condition is 20mA forward current, resulting in a typical forward voltage drop of 3.3V.

Q: Can I drive this LED with a 5V supply?

A: Yes, but a current-limiting resistor is mandatory. For example, using typical values: R = (5V - 3.3V) / 0.020A = 85 Ohms. A standard 82 or 100 Ohm resistor would be appropriate, but calculations should be verified with min/max V_F.

Q: How does temperature affect brightness?

A: Luminous intensity decreases as ambient temperature increases. Refer to the \"Relative Intensity vs. Ambient Temperature\" curve for specific data. Proper heat sinking is crucial in high-temperature environments.

Q: What do the binning codes (CAT, HUE, REF) mean for my design?

A: They ensure color and brightness consistency. For applications where uniform appearance is critical (e.g., backlight arrays), specifying tight bins for HUE (wavelength) and CAT (intensity) is essential.

12. Practical Use Case Example

Scenario: Designing a simple status indicator for a device panel.

1. Power Source: A 5V rail is available on the PCB.

2. Current Calculation: Target I_F = 20mA. Using max V_F (3.7V) for a conservative design: R = (5V - 3.7V) / 0.020A = 65 Ohms. The nearest standard value is 68 Ohms.

3. Power Check: Power dissipated in resistor P = I²R = (0.02)² * 68 = 0.0272W. A standard 1/8W (0.125W) resistor is sufficient.

4. PCB Design: Place the 68Ω resistor in series with the LED's anode. Follow the package dimensions for the hole layout. Ensure the cathode (identified per datasheet) is connected to ground.

5. Assembly: Follow the lead forming and soldering guidelines precisely, keeping solder joints >3mm from the lens.

13. Operating Principle

This is a semiconductor light-emitting diode (LED). When a forward voltage is applied across the P-N junction (anode positive relative to cathode), electrons and holes recombine within the active region (InGaN chip). This recombination process releases energy in the form of photons (light). The specific material composition (InGaN) and the structure of the semiconductor layers determine the wavelength of the emitted light, which in this case is in the blue spectrum (~470 nm). The epoxy lens encapsulates the chip, provides mechanical protection, and shapes the light output beam.

14. Technology Trends & Context

Blue InGaN LEDs represent a foundational technology in solid-state lighting. The development of efficient blue LEDs was a major scientific achievement, enabling the creation of white LEDs (via phosphor conversion) which revolutionized general lighting. This specific component exemplifies the application of this technology for backlighting and specialized indicator purposes. Trends in the industry continue to focus on increasing luminous efficacy (lumens per watt), improving color rendering, enhancing reliability, and further miniaturization of packages while maintaining or increasing light output.