LED Lamp 6324-15SUBC/S400-X10 Datasheet - Blue Color - 3.3V Forward Voltage - 20mA Operating Current - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness blue LED lamp, identified by the part number 6324-15SUBC/S400-X10. This component belongs to a series specifically engineered for applications demanding superior luminous output. The LED is offered in a standard lamp package configuration, making it suitable for a wide range of electronic assembly processes. Its core design prioritizes reliability and robustness in various operating environments.

The device is compliant with major environmental and safety directives, including RoHS (Restriction of Hazardous Substances), EU REACH regulations, and is manufactured as a halogen-free component. This compliance ensures the product meets stringent international standards for electronic components. The LED is available supplied on tape and reel for automated pick-and-place assembly, enhancing production efficiency in high-volume manufacturing settings.

1.1 Core Advantages and Target Market

The primary advantage of this LED is its combination of high luminous intensity and a reliable package. With a typical intensity of 500 millicandelas (mcd) at a standard 20mA drive current, it delivers significant brightness for its form factor. The product is designed for general-purpose indicator and backlighting applications in consumer and industrial electronics. Key target markets include the manufacturers of television sets, computer monitors, telephones, and various computer peripherals where consistent, bright blue indication or illumination is required. The choice of various viewing angles allows designers to select the optimal radiation pattern for their specific application, balancing between wide area coverage and axial intensity.

2. Technical Parameter Deep-Dive

This section provides a detailed, objective analysis of the LED's key technical parameters as defined in its datasheet. Understanding these specifications is crucial for proper circuit design and ensuring long-term reliability.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not operating conditions.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (I_FP): 100 mA. This pulsed current rating (at a duty cycle of 1/10 and 1 kHz frequency) allows for brief periods of overdrive, useful for multiplexing or strobe applications.
• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (P_d): 90 mW. This is the maximum power the package can dissipate as heat, calculated as Forward Voltage multiplied by Forward Current.
• Operating & Storage Temperature: The device can operate from -40°C to +85°C and be stored from -40°C to +100°C.
• Soldering Temperature: The leads can withstand 260°C for 5 seconds, which is compatible with standard lead-free reflow soldering profiles.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current (I_F) of 20 mA, unless otherwise specified.

• Luminous Intensity (I_v): Typical value is 500 mcd, with a minimum of 250 mcd. This specifies the perceived brightness of the LED as measured by the human eye.
• Viewing Angle (2θ_1/2): 60 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak axial value.
• Peak Wavelength (λ_p): 468 nm (typical). This is the wavelength at which the spectral power distribution of the emitted light is maximum.
• Dominant Wavelength (λ_d): 470 nm (typical). This is the single wavelength perceived by the human eye, defining the "blue" color of the LED.
• Spectrum Radiation Bandwidth (Δλ): 35 nm (typical). This indicates the spectral width of the emitted light, measured at half the maximum intensity (FWHM).
• Forward Voltage (V_F): Ranges from 2.7V (min) to 3.7V (max), with a typical value of 3.3V at 20mA. This is crucial for designing the current-limiting circuitry.
• Reverse Current (I_R): Maximum of 50 μA when a 5V reverse bias is applied.

The datasheet also notes measurement uncertainties: ±0.1V for V_F, ±10% for I_v, and ±1.0nm for λ_d.

3. Binning System Explanation

The product utilizes a binning system to categorize units based on key optical and electrical parameters. This ensures consistency within a production batch for applications requiring tight color or brightness matching. The packing label includes codes for these bins:

• CAT: Ranks of Luminous Intensity. Units are sorted into bins based on their measured light output.
• HUE: Ranks of Dominant Wavelength. This bins LEDs according to their specific shade of blue.
• REF: Ranks of Forward Voltage. LEDs are grouped by their forward voltage drop at the test current.

Designers should consult with the supplier for the specific bin code definitions and availability to ensure the selected bin meets the application's requirements for color consistency and electrical performance.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions. These are essential for understanding performance beyond the single-point specifications at 25°C/20mA.

4.1 Relative Intensity vs. Wavelength

This curve graphically shows the spectral power distribution, with a peak around 468 nm and a typical FWHM of 35 nm, confirming the monochromatic blue emission from the InGaN chip.

4.2 Directivity Pattern

A polar plot illustrates the spatial distribution of light, corresponding to the 60-degree viewing angle. The intensity is highest along the central axis (0°) and decreases symmetrically towards the edges.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship typical of a diode. The forward voltage increases logarithmically with current. At the recommended 20mA operating point, the voltage is typically 3.3V. This curve is vital for thermal management, as V_F has a negative temperature coefficient.

4.4 Relative Intensity vs. Forward Current

This plot demonstrates that light output is approximately linear with current in the normal operating range. Driving the LED beyond its maximum ratings will not yield proportional increases in light and will generate excessive heat.

4.5 Temperature Dependence Curves

Two key curves show the effect of ambient temperature (T_a):

• Relative Intensity vs. Ambient Temp.: Luminous output decreases as ambient temperature rises. This de-rating must be accounted for in designs operating at high temperatures.
• Forward Current vs. Ambient Temp.: For a fixed voltage, the forward current would increase with temperature due to the negative temperature coefficient of V_F. This highlights the critical importance of using a constant-current driver, not a constant-voltage source, to prevent thermal runaway.

5. Mechanical and Package Information

The LED is housed in a standard lamp-style package. The package drawing provides critical dimensions for PCB footprint design and clearance checks.

• All dimensions are provided in millimeters.
• A key note specifies that the height of the flange must be less than 1.5mm (0.059 inches).
• The default tolerance for unspecified dimensions is ±0.25mm.
• The drawing typically shows lead spacing, package body size, lens shape, and the position of the cathode indicator (usually a flat side or shorter lead).

Designers must adhere strictly to these dimensions when creating the PCB land pattern to ensure proper soldering and alignment.

6. Soldering and Assembly Guidelines

Proper handling is essential to maintain reliability. The datasheet provides detailed instructions.

6.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb base.
• Form leads before soldering.
• Avoid stressing the package; cut leads at room temperature.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

6.2 Storage

• Store at ≤30°C and ≤70% RH. Shelf life is 3 months from shipment.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

Hand Soldering: Iron tip ≤300°C (max 30W), time ≤3 seconds, keep solder joint ≥3mm from bulb. Wave/DIP Soldering: Preheat ≤100°C (≤60 sec), solder bath ≤260°C for ≤5 sec, keep joint ≥3mm from bulb. A recommended soldering profile graph is provided, showing a gradual ramp-up, a plateau within the 260°C limit, and a controlled cooling ramp. Rapid cooling is not recommended. Avoid multiple soldering cycles and mechanical stress while the LED is hot.

6.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute. Avoid ultrasonic cleaning unless pre-qualified, as it can damage the die or wire bonds.

6.5 Heat Management

Proper thermal design is critical. The operating current must be de-rated at higher ambient temperatures (refer to the de-rating curve). The temperature around the LED in the final application must be controlled to maintain performance and longevity.

6.6 ESD (Electrostatic Discharge) Precautions

The LED is sensitive to ESD and surge voltage, which can damage the semiconductor die. Standard ESD handling procedures (e.g., grounded workstations, wrist straps) must be followed during assembly and handling.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged for protection and automated handling:

• They are placed in anti-electrostatic bags.
• Bags are packed into inner cartons.
• Inner cartons are packed into master outside cartons.
• Packing Quantity: Minimum 200 to 500 pieces per bag. Five bags per inner carton. Ten inner cartons per outside carton.

7.2 Label Explanation

The packaging label includes:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (6324-15SUBC/S400-X10).
• QTY: Quantity in the package.
• CAT/HUE/REF: Binning codes for Intensity, Wavelength, and Voltage.
• LOT No: Traceable manufacturing lot number.

8. Application Suggestions

8.1 Typical Application Scenarios

As listed, primary applications are as status indicators or backlights in:

• TV Sets and Monitors (power, input source indicators).
• Telephones (message waiting, line status).
• Computers and Peripherals (power on, HDD activity).

Its high brightness also makes it suitable for panel indicators in well-lit environments.

8.2 Design Considerations

• Driver Circuit: Always use a series current-limiting resistor or a constant-current driver. Calculate the resistor value using R = (Supply Voltage - V_F) / I_F. Use the maximum V_F from the datasheet to ensure current does not exceed limits under all conditions.
• Thermal Management: On a PCB, ensure adequate copper area around the LED leads to act as a heat sink, especially if driven near maximum current.
• Viewing Angle: Select the appropriate viewing angle variant for the application. A 60-degree angle offers a good balance between axial brightness and wide visibility.
• ESD Protection: In sensitive environments, consider adding a transient voltage suppression (TVS) diode or a small capacitor in parallel with the LED (with a series resistor) to protect against voltage spikes.

9. Technical Comparison and Differentiation

While direct competitor comparison requires specific alternative part numbers, this LED's key differentiating features based on its datasheet are:

• High Brightness: A typical 500 mcd at 20mA is a significant output for a standard lamp package.
• Comprehensive Compliance: Simultaneous compliance with RoHS, REACH, and Halogen-Free standards is a strong advantage for global markets and environmentally conscious designs.
• Robust Specifications: Clear absolute maximum ratings and detailed handling instructions reduce application risk.
• Tape & Reel Availability: Supports high-speed automated assembly, reducing manufacturing cost for volume production.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED with a 5V supply directly? A: No. The typical forward voltage is 3.3V. Connecting it directly to 5V would cause excessive current flow, potentially destroying the LED. You must use a current-limiting resistor. For example, with a 5V supply and a target of 20mA, using the max V_F of 3.7V for safety: R = (5V - 3.7V) / 0.020A = 65 Ohms. A 68 Ohm resistor would be a standard choice.

Q2: Why does the luminous intensity decrease when the ambient temperature increases? A: This is a fundamental characteristic of semiconductor LEDs. As temperature rises, the efficiency of the light-generating recombination processes inside the InGaN chip decreases, leading to lower optical output for the same electrical input. The de-rating curve quantifies this effect.

Q3: What is the difference between Peak Wavelength and Dominant Wavelength? A: Peak Wavelength (468 nm) is the physical peak of the light spectrum emitted. Dominant Wavelength (470 nm) is a calculated value that represents the single wavelength of pure monochromatic light that would be perceived by the human eye as having the same color as the LED's output. They are often close but not identical.

Q4: How critical is the 3mm distance for soldering and lead bending? A: Very critical. The epoxy resin bulb is sensitive to heat and mechanical stress. Keeping a 3mm distance ensures the heat from soldering does not thermally shock the epoxy (causing cracks or delamination) and that bending stress is not transferred to the fragile internal wire bonds connected to the semiconductor die.

11. Practical Design and Usage Case

Scenario: Designing a front-panel power indicator for a desktop computer. Requirements: Visible in a bright room, powered from the system's 5V standby rail, reliable for long-term operation. Design Steps: 1. Component Selection: This blue LED is suitable due to its high brightness (500 mcd typical). 2. Circuit Calculation: Using the 5V standby rail. Assuming a conservative V_F of 3.5V and a desired I_F of 15mA (for longevity and lower heat), the resistor value is R = (5V - 3.5V) / 0.015A = 100 Ohms. Power rating of resistor: P = I²R = (0.015)² * 100 = 0.0225W. A standard 1/8W (0.125W) resistor is more than sufficient. 3. PCB Layout: Place the LED at the front panel location. Include a generous copper pour connected to the cathode and anode leads to act as a heat sink. Follow the package dimensions for the footprint. 4. Assembly: Follow the wave soldering guidelines if the PCB is assembled via that process, ensuring the LED is placed last or masked if possible to minimize thermal exposure.

12. Operating Principle Introduction

This LED is based on a semiconductor chip made of Indium Gallium Nitride (InGaN), as indicated in the materials section. When a forward voltage exceeding the diode's threshold (approx. 2.7V) is applied, electrons and holes are injected into the active region of the chip. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, blue (~470 nm). The epoxy resin lens serves to protect the chip, shape the light output beam (60-degree viewing angle), and enhance light extraction from the semiconductor material.

13. Technology Trends

LED technology continues to evolve. While this component represents a mature, standard product, broader industry trends that influence such devices include:

• Increased Efficiency: Ongoing materials science research aims to improve the lumens-per-watt (efficacy) of LEDs, reducing energy consumption for the same light output.
• Miniaturization: The drive for smaller electronic devices pushes for LEDs in ever-smaller package footprints while maintaining or increasing brightness.
• Enhanced Reliability: Improvements in packaging materials and die-attach techniques continue to extend operational lifetimes and tolerance to harsh environments.
• Smart Integration: A trend towards LEDs with integrated drivers, controllers, or even sensors within the package, though this is more prevalent in high-end lighting modules than in basic indicator lamps.

This datasheet reflects a well-established, reliable product designed for mass-market applications where proven performance and cost-effectiveness are paramount.