LED Lamp 1003SUBD/S400-A6 Datasheet - Blue Diffused - 468nm Peak Wavelength - 20mcd Luminous Intensity - 3.3V Forward Voltage - English Technical Document

1. Product Overview

This document provides the technical specifications for a high-brightness, blue diffused LED lamp. The device is designed for applications requiring reliable performance and consistent light output. It features a wide viewing angle and is available in tape and reel packaging for automated assembly processes.

1.1 Core Advantages

• High Brightness: Engineered for applications demanding superior luminous intensity.
• Wide Viewing Angle: Offers a typical viewing angle (2θ1/2) of 110 degrees for broad illumination.
• Robust Construction: Built for reliability and longevity in various operating conditions.
• Environmental Compliance: The product is lead-free (Pb-free) and complies with relevant environmental regulations.
• Packaging Flexibility: Available on tape and reel to facilitate high-volume, automated manufacturing.

1.2 Target Applications

This LED is suitable for a variety of indicator and backlighting applications, including but not limited to:

• Television sets
• Computer monitors
• Telephones
• General computer peripherals and consumer electronics

2. Technical Parameter Analysis

The following sections provide a detailed, objective interpretation of the key technical parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied.
• Peak Forward Current (IFP): 100 mA at a duty cycle of 1/10 and 1 kHz. Suitable for pulsed operation.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause breakdown.
• Power Dissipation (Pd): 90 mW. The maximum power the package can dissipate at Ta=25°C.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +100°C (storage).
• Soldering Temperature (Tsol): 260°C for 5 seconds. Defines the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics (Ta=25°C)

These parameters are measured under standard test conditions (IF=20mA) and define the device's performance.

• Luminous Intensity (Iv): Typical value is 20 millicandelas (mcd), with a minimum of 10 mcd. This quantifies the perceived brightness.
• Viewing Angle (2θ1/2): 110 degrees (typical). The angle at which luminous intensity is half the peak value.
• Peak Wavelength (λp): 468 nm (typical). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): 470 nm (typical). The single wavelength perceived by the human eye.
• Forward Voltage (VF): 3.3 V (typical), ranging from 2.7 V to 4.0 V at 20 mA. Important for driver circuit design.
• Reverse Current (IR): Maximum 50 µA at VR=5V. Indicates the leakage current in reverse bias.

3. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate device behavior under varying conditions.

3.1 Spectral Distribution

The Relative Intensity vs. Wavelength curve shows a peak around 468 nm with a typical spectral bandwidth (Δλ) of 35 nm, confirming its blue color emission with a diffused resin for wider light dispersion.

3.2 Electrical and Thermal Behavior

• Forward Current vs. Forward Voltage (IV Curve): Shows the exponential relationship typical of diodes. At the typical forward voltage of 3.3V, the current is 20 mA.
• Relative Intensity vs. Forward Current: Luminous intensity increases with current but may not be perfectly linear; designers should consult the curve for precise drive current planning.
• Relative Intensity vs. Ambient Temperature: Luminous output generally decreases as ambient temperature rises. Proper heat sinking is crucial for maintaining brightness.
• Forward Current vs. Ambient Temperature: For a fixed voltage, the forward current may change with temperature due to the diode's negative temperature coefficient.

4. Mechanical and Packaging Information

4.1 Package Dimensions

The LED is provided in a standard lamp-style package. Key dimensional notes include:

• All dimensions are in millimeters (mm).
• The flange height must be less than 1.5mm.
• The general tolerance for unspecified dimensions is ±0.25mm.

Designers must refer to the detailed dimensioned drawing in the datasheet for exact lead spacing, body size, and recommended PCB footprint.

4.2 Polarity Identification

The cathode is typically indicated by a flat side on the LED lens or a shorter lead. The datasheet diagram should be consulted for the specific marking on this model.

5. Soldering and Assembly Guidelines

Adherence to these guidelines is critical for ensuring reliability and preventing damage during the assembly process.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid applying stress to the package. Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Soldering Parameters

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature max 300°C (30W max), soldering time max 3 seconds.
• Wave/Dip Soldering: Preheat temperature max 100°C (60 sec max). Solder bath temperature max 260°C for 5 seconds.
• Avoid multiple soldering cycles. Do not apply stress to leads while hot.
• Allow LEDs to cool gradually to room temperature without mechanical shock.

5.3 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity after receipt.
• Shelf life under these conditions is 3 months. For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.4 Cleaning

If cleaning is necessary:

• Use isopropyl alcohol at room temperature for no more than one minute.
• Air dry at room temperature.
• Avoid ultrasonic cleaning unless absolutely necessary and pre-qualified, as it can damage the LED.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packed to prevent electrostatic discharge (ESD) and moisture damage.

• Primary Packing: Anti-static bags.
• Quantity: 200 to 500 pieces per bag. 5 bags per inner carton. 10 inner cartons per master (outside) carton.

6.2 Label Explanation

Labels on packaging may include codes for:

• Customer Part Number (CPN)
• Production Number (P/N)
• Quantity (QTY)
• Quality/Performance Ranks (CAT)
• Dominant Wavelength (HUE)
• Lot Number (LOT No.)

7. Application Notes and Design Considerations

7.1 Heat Management

Effective thermal management is essential for LED performance and lifetime. The forward voltage has a negative temperature coefficient. As the junction temperature rises for a fixed voltage, the current increases, which can lead to thermal runaway if not controlled. The power dissipation (Pd) rating of 90 mW must be respected. For operation at high ambient temperatures or with high drive currents, the current should be de-rated according to the relevant temperature derating curve (implied in the datasheet notes). Designers should ensure adequate PCB copper area or other heat sinking methods to keep the junction temperature within safe limits.

7.2 Circuit Design

Due to the typical forward voltage of 3.3V and a maximum of 4.0V, a current-limiting resistor or constant-current driver is mandatory when connecting to a voltage source above ~2.7V. The resistor value can be calculated using Ohm's Law: R = (V_supply - Vf_led) / I_desired. Using the maximum Vf (4.0V) in calculations ensures the current does not exceed limits even with device-to-device variation. For applications requiring stable brightness, a constant-current driver is recommended over a simple resistor.

7.3 Optical Design

The diffused resin package provides a wide (110°) viewing angle, making it suitable for applications requiring wide-area illumination or indicators that need to be visible from various angles. The blue color (468-470nm) is often used for status indicators, backlighting, or decorative lighting. Designers should consider the luminous intensity (20 mcd typical) to ensure sufficient brightness for the intended viewing distance and ambient light conditions.

8. Technical Comparison and Differentiation

While specific competitor data is not provided here, key differentiators of this LED based on its datasheet include its combination of a relatively high typical luminous intensity (20 mcd) for a standard lamp package, a wide 110-degree viewing angle facilitated by the diffused resin, and robust absolute maximum ratings (25mA continuous current). Its availability on tape and reel makes it competitive for automated, cost-sensitive, high-volume production lines common in consumer electronics manufacturing.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (468 nm) is the physical wavelength where the LED emits the most optical power. Dominant wavelength (470 nm) is the psychophysical single wavelength that the human eye perceives as matching the color of the LED's light. They are often close but not identical, especially for non-monochromatic sources.

9.2 Can I drive this LED at 30mA for more brightness?

No. The Absolute Maximum Rating for continuous forward current (IF) is 25 mA. Exceeding this rating risks permanent damage to the device and voids any reliability guarantees. For higher brightness, select an LED rated for a higher drive current.

9.3 How do I interpret the "Pb free" and RoHS compliance statement?

"Pb free" means the device does not intentionally contain lead. The statement "The product itself will remain within RoHS compliant version" indicates that the LED component complies with the Restriction of Hazardous Substances directive, which restricts the use of specific hazardous materials (like lead, mercury, cadmium) in electrical and electronic equipment. However, designers must verify the compliance of the entire final assembled product.

10. Practical Application Example

Scenario: Designing a status indicator for a network router.

1. Requirement: A blue "power/active" indicator visible from across a room.
2. Selection: This LED is suitable due to its blue color and good luminous intensity.
3. Circuit Design: The router's internal power rail is 5V. Using the typical Vf of 3.3V and a target current of 20 mA, the series resistor is R = (5V - 3.3V) / 0.020A = 85 Ohms. A standard 82 or 100 Ohm resistor would be chosen. Using the max Vf (4.0V) for a worst-case check: (5V-4V)/82Ω ≈ 12.2 mA, which is still above the minimum for visible light.
4. Layout: The PCB footprint matches the datasheet's package dimensions. A small amount of copper pour around the leads aids in heat dissipation.
5. Assembly: The LEDs are placed via tape and reel feeder. The board undergoes a reflow process adhering to the 260°C for 5 seconds profile.

11. Operating Principle

This device is a light-emitting diode (LED). It operates on the principle of electroluminescence in a semiconductor material (InGaN for blue light). When a forward voltage is applied across the p-n junction, electrons and holes recombine, releasing energy in the form of photons (light). The specific material composition (InGaN) determines the bandgap energy and thus the wavelength (color) of the emitted light, which in this case is blue. The diffused epoxy resin encapsulant scatters the light, creating a wider viewing angle and a softer appearance compared to a clear lens.

12. Technology Trends

LED technology continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and lower cost. While this is a standard indicator LED, broader industry trends include the miniaturization of packages (e.g., from 0603 to 0402 and smaller SMD sizes), the integration of multiple chips (RGB, white), and the development of LEDs for specialized applications like UV-C disinfection, horticultural lighting, and high-speed visible light communication (Li-Fi). For indicator applications, reliability, cost-effectiveness, and ease of assembly remain primary drivers.