Blue LED PLCC2 3.5x2.8x1.84mm - Forward Voltage 3.0V - Power 102mW - 465-475nm Datasheet

1. Product Overview

The RF-BNRA30TS-BB is a high-performance blue LED designed for demanding applications such as automotive interior lighting and switches. It utilizes GaN-on-substrate technology to deliver a dominant wavelength of 465-475 nm with a typical forward voltage of 3.0 V at 20 mA. The device is housed in a compact PLCC2 package measuring 3.50 mm x 2.80 mm x 1.84 mm, making it suitable for automated SMT assembly. With an extremely wide viewing angle of 120 degrees and moisture sensitivity level 2, this LED offers excellent design flexibility. It is fully compliant with RoHS and REACH directives and has passed qualification testing based on AEC-Q101 guidelines for automotive-grade discrete semiconductors.

2. Technical Parameter Deep Dive

2.1 Electrical Characteristics

At a test condition of IF = 20 mA and Ts = 25 °C, the forward voltage (VF) ranges from 2.8 V (minimum) to 3.4 V (maximum) with a typical value of 3.0 V. The reverse current (IR) at VR = 5 V is limited to a maximum of 10 μA. The luminous intensity (IV) ranges from 430 mcd (minimum) to 800 mcd (maximum) under the same test condition, with a typical value of 600 mcd. The dominant wavelength (Wd) is specified between 465 nm and 475 nm, with typical value at 467 nm.

2.2 Absolute Maximum Ratings

The LED must not exceed the following absolute maximum ratings: power dissipation (PD) 102 mW, forward current (IF) 30 mA, peak forward current (IFP) 100 mA (1/10 duty cycle, 10 ms pulse width), reverse voltage (VR) 5 V, electrostatic discharge (ESD) 2000 V (HBM), operating temperature (TOPR) -40 to +100 °C, storage temperature (TSTG) -40 to +100 °C, and junction temperature (TJ) 120 °C. Exceeding these ratings may cause permanent damage.

2.3 Thermal Characteristics

The thermal resistance from junction to solder point (RthJ-S) is specified at a maximum of 300 °C/W. Proper thermal management is essential to maintain junction temperature below 120 °C and ensure long-term reliability.

3. Binning System

3.1 Forward Voltage Bins

At IF = 20 mA, the forward voltage is divided into six bins: G1 (2.8-2.9 V), G2 (2.9-3.0 V), H1 (3.0-3.1 V), H2 (3.1-3.2 V), I1 (3.2-3.3 V), I2 (3.3-3.4 V). This binning allows customers to select LEDs with tight VF tolerance for uniform current distribution in series or parallel configurations.

3.2 Luminous Intensity Bins

Luminous intensity is binned into J20 (430-530 mcd), K10 (530-650 mcd), and K20 (650-800 mcd). This ensures consistent brightness in applications requiring matched light output.

3.3 Dominant Wavelength Bins

The dominant wavelength is binned into D10 (465-467.5 nm), D20 (467.5-470 nm), E10 (470-472.5 nm), and E20 (472.5-475 nm). This provides tight color control for automotive interior lighting where color consistency is critical.

4. Performance Curves Analysis

4.1 Forward Voltage vs. Forward Current

As shown in Fig. 1-7, the forward current increases exponentially with forward voltage. At 3.0 V the current is approximately 20 mA; at 3.2 V it rises to about 120 mA. This highlights the need for current-limiting resistors or constant-current drive.

4.2 Relative Intensity vs. Forward Current

Fig. 1-8 shows that relative luminous intensity increases almost linearly with forward current up to 30 mA. At 20 mA the relative intensity is about 80%, and at 30 mA it reaches approximately 100%.

4.3 Solder Temperature vs. Relative Intensity and Forward Current

Figs. 1-9 and 1-10 demonstrate that as the solder temperature rises from 25 °C to 100 °C, relative intensity drops to about 85% of its value at 25 °C, and the maximum allowable forward current derates from 30 mA to about 10 mA. Thermal derating is essential for reliable operation at elevated ambient temperatures.

4.4 Forward Voltage vs. Solder Temperature

From Fig. 1-11, forward voltage decreases linearly with increasing temperature at a rate of approximately -2 mV/°C. This negative temperature coefficient must be considered in converter design.

4.5 Radiation Pattern

The radiation diagram (Fig. 1-12) shows a lambertian-like distribution with a half-power angle of about 120 degrees, confirming the wide viewing angle characteristic.

4.6 Spectrum and Wavelength vs. Current

Fig. 1-13 illustrates that the dominant wavelength shifts slightly (within ±3 nm) as forward current varies from 0 to 80 mA. The spectrum (Fig. 1-14) is a narrow peak centered around 467 nm with a full width at half maximum of approximately 25 nm, typical for InGaN blue LEDs.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED package measures 3.50 mm x 2.80 mm x 1.84 mm (length x width x height). The top view shows a rectangular light-emitting area of approximately 2.40 mm x 2.18 mm. The bottom view reveals two solder pads with polarity marking: the anode pad is larger (2.0 mm x 1.25 mm) and the cathode pad is smaller (0.75 mm x 1.25 mm). Recommended solder pads (Fig. 1-5) are provided with a pitch of 4.45 mm between pad centers to ensure proper solder joint formation. All dimensions are in millimeters with tolerances of ±0.2 mm unless otherwise noted.

5.2 Polarity and Handling

The LED has a clear polarity mark (a small dot or notch on the package) indicating the cathode side. Care should be taken to align the polarity mark with the PCB silkscreen. The silicone encapsulant is soft; avoid applying pressure directly onto the lens surface during handling or pick-and-place operations.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The recommended reflow soldering profile follows JEDEC standards: preheat from 150 °C to 200 °C for 60-120 seconds, ramp-up to 217 °C with a maximum slope of 3 °C/s, maintain above 217 °C for no more than 60 seconds, peak temperature 260 °C for up to 10 seconds (with a maximum of 30 seconds within 5 °C of peak), and cool-down at a rate not exceeding 6 °C/s. The total time from 25 °C to peak should be less than 8 minutes. Do not reflow more than twice, and if more than 24 hours elapse between reflows, the LEDs must be baked before reuse.

6.2 Hand Soldering

For manual soldering, use a soldering iron set below 300 °C and complete the joint in less than 3 seconds. Only one hand soldering operation is allowed per LED.

6.3 Storage and Baking

Unopened moisture barrier bags should be stored at ≤30 °C and ≤75% relative humidity, to be used within one year from the date of seal. After opening, use within 24 hours under ≤30 °C and ≤60% RH. If the storage conditions are exceeded or the desiccant indicator has changed color, bake the LEDs at 60±5 °C for ≥24 hours before use.

7. Packaging and Ordering Information

7.1 Carrier Tape and Reel

The LEDs are supplied in tape-and-reel packaging with 2000 pieces per reel. The carrier tape has a width of 8.0 mm, with a pitch of 4.0 mm (typical for PLCC2). The reel diameter is 178 mm, hub diameter 60 mm, and core diameter 13.0 mm. The tape has a cover tape that is heat-sealed on the top side.

7.2 Label Information

Each reel carries a label containing: Part Number (PART NO.), Specification Number (SPEC NO.), Lot Number (LOT NO.), Bin Code (BIN CODE), Luminous Flux (Ф), Chromaticity Bin (XY), Forward Voltage (VF), Wavelength (WLD), Quantity (QTY), and Date of Manufacture (DATE). The bin code is essential for ordering specific VF/IV/Wd combinations.

7.3 Moisture Barrier Bag and Box

Reels are sealed in a moisture barrier bag along with a desiccant and a humidity indicator card. The bag is then packed into cardboard boxes for shipping. The outer box bears handling warnings such as "Attention: Observe Precautions for Handling Electrostatic Sensitive Devices."

8. Application Recommendations

8.1 Typical Applications

This blue LED is ideal for automotive interior lighting such as dashboard illumination, ambient lighting, and switch indication. It can also be used in status indicators, backlighting, and general signage where a narrow-spectrum blue light source is required.

8.2 Design Considerations

• Always include a current-limiting resistor or use a constant-current driver to prevent overcurrent due to VF variations.
• Maintain junction temperature below 120 °C by providing adequate heat sinking or by derating the forward current at high ambient temperatures.
• In series/parallel arrays, ensure each LED receives nearly equal current by matching VF bins or using individual current sources.
• Avoid exposure to sulfur-containing compounds above 100 ppm, bromine above 900 ppm, chlorine above 900 ppm, or total halogens above 1500 ppm in the surrounding environment or mating materials.
• Minimize volatile organic compounds (VOCs) from nearby adhesives, sealants, or plastics to prevent silicone discoloration and light output degradation.
• Provide ESD protection measures (e.g., grounded workstations, ionizers) as the LED is sensitive to electrostatic discharge (ESD threshold 2 kV HBM).

9. Technology Comparison

Compared to standard PLCC2 LEDs, the RF-BNRA30TS-BB offers a wider viewing angle (120° vs. typical 90°) and tighter wavelength binning (down to 2.5 nm steps). Its AEC-Q101 qualification makes it suitable for automotive stress conditions (temperature cycles, high humidity, etc.) that consumer-grade parts may not survive. The thermal resistance of 300 °C/W is typical for this package but requires careful thermal management in high-power applications.

10. Frequently Asked Questions

10.1 Can I use this LED at 30 mA continuously?

Yes, the absolute maximum forward current is 30 mA. However, at this current the junction temperature may rise significantly depending on the thermal environment. It is recommended to derate at elevated solder temperatures as shown in the derating curve. For long-term reliability, operating at 20-25 mA is preferable.

10.2 What is the typical luminosity at 20 mA?

The typical luminous intensity is 600 mcd at IF=20 mA. Depending on the bin, it can range from 430 to 800 mcd.

10.3 How do I clean the LED after soldering?

Use isopropyl alcohol as a cleaning solvent. Avoid ultrasonic cleaning as it may damage the LED. Ensure that any cleaning solvent does not attack the silicone encapsulant.

11. Application Case Example

Consider an automotive interior ambient light strip containing 20 LEDs in series. Each LED has a typical VF of 3.0 V at 20 mA. Assuming a 14 V vehicle electrical system, the series voltage drop is 60 V, which exceeds the supply. Instead, a parallel configuration with individual current-limiting resistors is more practical. For a single LED, a resistor of (14 V – 3.0 V) / 0.02 A = 550 Ω (use 560 Ω standard value) would limit current to about 19.6 mA. If multiple LEDs are used, each should have its own resistor to prevent current hogging due to VF bin differences.

12. Principle of Operation

The blue LED is based on Gallium Nitride (GaN) epitaxially grown on a sapphire or silicon substrate. When forward-biased, electrons and holes recombine in the quantum well region, emitting photons with energy corresponding to the bandgap of the InGaN material. The dominant wavelength is controlled by the indium composition. The light output is extracted through the transparent package and the silicone lens, which also shapes the radiation pattern.

13. Development Trends

Blue LEDs continue to evolve toward higher efficiency (lm/W) and better color stability over temperature and lifetime. The automotive industry demands higher reliability standards such as AEC-Q102, and future versions of this product may incorporate improved thermal management and a wider operating temperature range. Miniaturization (e.g., 2835 package remains popular) and integration with intelligent control (e.g., matrix lighting) are ongoing trends.