Blue LED RF-A2P08-B695-A2 Specification - Size 1.60x0.80x0.55mm - Voltage 3.0V - Power ~0.09W - English Tech Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness blue Light Emitting Diode (LED) designed for demanding applications. The device utilizes a Gallium Nitride (GaN) on Substrate chip technology encapsulated in a compact, industry-standard PLCC2 (Plastic Leaded Chip Carrier) surface-mount package. Its primary design focus is reliability and performance in automotive environments, as evidenced by its qualification alignment with the AEC-Q101 standard for discrete semiconductors.

1.1 General Description

The LED emits blue light with a dominant wavelength typically between 465nm and 475nm. The package dimensions are extremely compact, measuring 1.60 mm in length, 0.80 mm in width, and 0.55 mm in height. This small form factor makes it suitable for space-constrained designs while maintaining excellent optical output.

1.2 Core Features & Advantages

• PLCC2 Package: Standard surface-mount footprint ensures compatibility with automated pick-and-place and reflow soldering processes.
• Wide Viewing Angle: Emits light over an extremely wide 120-degree viewing angle (typical), providing uniform illumination.
• SMT Compatibility: Fully suitable for all standard SMT assembly and soldering processes.
• Tape & Reel Packaging: Supplied on carrier tape and reel for efficient, automated manufacturing.
• Moisture Sensitivity Level 2 (MSL 2): Requires baking if exposed to ambient air for more than one year prior to reflow soldering.
• Environmental Compliance: The product is compliant with RoHS (Restriction of Hazardous Substances) and REACH regulations.
• Automotive Grade Qualification: The product qualification test plan is based on the guidelines of AEC-Q101, the stress test qualification standard for automotive-grade discrete semiconductors.

1.3 Target Market & Application

This LED is specifically targeted at the automotive electronics market, where reliability, longevity, and performance under harsh conditions are paramount.

• Primary Application: Automotive interior lighting, including dashboard backlighting, switch illumination, and ambient mood lighting.
• Secondary Application: General-purpose indicator lights and backlighting in switches for consumer and industrial electronics.

2. In-Depth Technical Parameter Analysis

2.1 Electrical & Optical Characteristics (Ts=25°C)

The following parameters are defined under standard test conditions at an ambient temperature of 25°C with a forward current (I_F) of 20mA.

• Forward Voltage (V_F): Ranges from 2.8V (Min) to 3.4V (Max), with a typical value of 3.0V. This is a critical parameter for driver circuit design.
• Luminous Intensity (I_V): Delivers high brightness, ranging from 280 millicandelas (mcd) minimum to 530 mcd maximum, with a typical output of 400 mcd.
• Dominant Wavelength (W_d): Specifies the peak wavelength of the blue light emitted, guaranteed to be between 465 nm and 475 nm.
• Viewing Angle (2θ_1/2): Defined as the full angle at which intensity is half the peak value. The typical value is 120 degrees, indicating a very wide, diffuse light pattern.
• Thermal Resistance (R_THJ-S): The junction-to-solder point thermal resistance is typically 300 °C/W. This value is crucial for calculating the junction temperature rise during operation.
• Reverse Current (I_R): Is limited to a maximum of 10 μA when a reverse voltage (V_R) of 5V is applied.

2.2 Absolute Maximum Ratings

Exceeding these limits may cause permanent damage to the device. Designers must ensure operating conditions stay within these boundaries.

• Power Dissipation (P_D): 102 mW maximum.
• Continuous Forward Current (I_F): 30 mA maximum.
• Peak Forward Current (I_FP): 50 mA maximum, allowed under pulsed conditions (1/10 duty cycle, 10ms pulse width).
• Reverse Voltage (V_R): 5 V maximum.
• Electrostatic Discharge (ESD) HBM: Withstands up to 2000V (Human Body Model) with a yield over 90%. ESD precautions during handling are still required.
• Operating Temperature (T_OPR): -40°C to +100°C.
• Storage Temperature (T_STG): -40°C to +100°C.
• Maximum Junction Temperature (T_J): 120°C absolute maximum. The actual operating forward current must be determined by measuring package temperature to ensure T_J is not exceeded.

3. Binning System Explanation

To ensure consistent color and brightness in production, LEDs are sorted (binned) based on key parameters measured at I_F=20mA. This allows designers to select parts that meet specific application requirements.

3.1 Forward Voltage (V_F) Binning

LEDs are categorized into six voltage bins (G1, G2, H1, H2, I1, I2), each covering a 0.1V range from 2.8-2.9V up to 3.3-3.4V. This helps in designing stable constant-current drivers.

3.2 Luminous Intensity (I_V) Binning

Sorted into three brightness bins: I2 (280-350 mcd), J1 (350-430 mcd), and J2 (430-530 mcd). This is essential for achieving uniform brightness in multi-LED arrays.

3.3 Dominant Wavelength (W_d) Binning

Sorted into four color bins (D1, D2, E1, E2), each covering a 2.5 nm range from 465-467.5 nm up to 472.5-475 nm. This ensures tight color consistency, which is critical for aesthetic applications like automotive interiors.

4. Performance Curve Analysis

4.1 Forward Voltage vs. Forward Current (I-V Curve)

The provided characteristic curve (Fig. 1-7) graphically shows the relationship between the forward voltage (V_F) and the forward current (I_F) for this blue LED. This curve is nonlinear. At very low currents, the voltage is minimal. As current increases, the V_F rises sharply once it surpasses the diode's turn-on threshold (approximately between 2.7V and 3.0V for this device). Beyond this point, the curve has a relatively stable slope, representing the dynamic resistance of the LED. This curve is vital for:

• Driver Design: Determining the required output voltage of a constant-current LED driver for a given operating current.
• Power Calculation: Accurately calculating power dissipation (P = V_F * I_F) at any operating point.
• Thermal Analysis: Understanding how V_F might shift with temperature, as junction temperature affects the I-V characteristic.

5. Mechanical & Package Information

5.1 Package Dimensions & Drawings

The LED is housed in a rectangular PLCC2 package. Key dimensions include an overall size of 1.60mm (L) x 0.80mm (W) x 0.55mm (H). The lens (dome) has a height of 0.35mm from the top surface of the package body. Standard dimensional tolerances are ±0.2mm unless otherwise specified.

5.2 Polarity Identification

The cathode (-) terminal is identified by a distinctive green marking on the bottom side of the package. Correct polarity orientation during PCB assembly is essential for proper function.

5.3 Recommended Soldering Land Pattern

A land pattern (footprint) for PCB design is provided. Following this recommended pattern ensures good solder joint formation, proper alignment, and effective thermal transfer from the LED's thermal pad (if applicable) to the PCB.

6. SMT Soldering & Assembly Guidelines

6.1 Reflow Soldering Instructions

The device is suitable for standard infrared (IR) or convection reflow soldering processes. A specific reflow profile is recommended, detailing the preheat, soak, reflow, and cooling phases with time and temperature limits. Adhering to this profile prevents thermal shock, ensures reliable solder joints, and protects the LED's internal structure and epoxy lens from damage due to excessive heat. The Moisture Sensitivity Level (MSL 2) must be observed; if the packaging has been opened for more than 12 months, the components require baking before reflow to prevent \"popcorning\" or delamination.

7. Packaging & Ordering Information

7.1 Packaging Specification

The LEDs are supplied in industry-standard packaging for automated assembly.

• Carrier Tape: Dimensions for the embossed carrier tape that holds individual LEDs are specified, including pocket size, pitch, and tape width.
• Reel: Dimensions for the reel onto which the carrier tape is wound are provided, including reel diameter, width, and hub size.
• Labels: The specification includes the format and required information for the labels on the reel and outer packaging.

7.2 Moisture Barrier & Shipping Packaging

The reel is packaged inside a moisture barrier bag (MBB) with a desiccant and a humidity indicator card to maintain dryness during storage and shipment. These are then packed in a cardboard box suitable for shipping.

8. Application Design Suggestions

8.1 Typical Application Circuits

For reliable operation, drive the LED with a constant current source, not a constant voltage. A simple series resistor can be used for basic applications with a stable supply voltage (e.g., V_CC - V_F) / I_F = R. For automotive applications or where supply voltage varies, a dedicated LED driver IC or a current-regulated circuit is strongly recommended to maintain consistent brightness and protect the LED from over-current.

8.2 Critical Design Considerations

• Thermal Management: The maximum power dissipation and junction temperature must not be exceeded. For high-brightness operation or high ambient temperatures, consider PCB copper pour under and around the LED's footprint to act as a heat sink.
• Current Limiting: Always implement proper current limiting. The absolute maximum continuous current is 30mA. Operating at or near this limit requires excellent thermal design.
• ESD Protection: Implement ESD protection on PCB inputs and follow ESD-safe handling procedures during assembly, as specified by the 2000V HBM rating.

9. Technical Comparison & Advantages

Compared to non-automotive grade LEDs or older through-hole packages, this device offers several key advantages:

• Reliability: AEC-Q101 alignment signifies testing under extreme conditions (high/low temperature, humidity, thermal shock), making it suitable for the harsh automotive environment.
• Miniaturization: The 1.6x0.8mm footprint allows for high-density PCB layouts, enabling sleek and compact automotive interior designs.
• Manufacturability: The SMT PLCC2 package and tape & reel supply are optimized for high-speed, automated assembly, reducing manufacturing cost and improving consistency.
• Optical Performance: The combination of high luminous intensity (up to 530 mcd) and a wide 120-degree viewing angle provides excellent, uniform illumination for indicator and backlight applications.

10. Frequently Asked Questions (FAQ)

10.1 What is the typical forward voltage for design calculations?

Use 3.0V for initial calculations, but design your driver circuit to accommodate the full bin range from 2.8V to 3.4V to ensure proper operation with any LED from the production lot.

10.2 Can I drive this LED at its maximum current of 30mA continuously?

Yes, but only if the thermal design ensures the junction temperature (T_J) remains below 120°C. At 30mA and a typical V_F of 3.0V, the power dissipation is 90mW. With a thermal resistance of 300°C/W, this would cause a 27°C temperature rise from the solder point to the junction. Therefore, the solder point temperature must be kept below 93°C for T_J to stay under 120°C. Adequate PCB heatsinking is essential.

10.3 What does \"Moisture Sensitivity Level 2 (MSL 2)\" mean for my production process?

It means the packaged LEDs can be exposed to factory floor ambient conditions (

11. Design Use Case Example

Scenario: Automotive Dashboard Switch Backlighting. A designer needs to illuminate 10 tactile switches on a dashboard panel. Uniform blue color and brightness are critical for aesthetics. They would select LEDs from the same wavelength bin (e.g., all from bin E1: 470-472.5nm) and the same luminous intensity bin (e.g., all from bin J2: 430-530 mcd) to guarantee consistency. A single constant-current driver capable of supplying 200mA (10 LEDs * 20mA each) would be used. The PCB layout would include a modest copper fill under each LED's footprint to aid heat dissipation, as the dashboard environment can become warm. The MSL 2 requirement would be communicated to the contract manufacturer to ensure proper handling before the SMT process.

12. Operating Principle

This is a semiconductor light source. It is based on a Gallium Nitride (GaN) chip. When a forward voltage exceeding the diode's turn-on threshold is applied, electrons and holes recombine at the semiconductor junction within the chip. In this type of material (direct bandgap semiconductor), this recombination process releases energy in the form of photons (light). The specific composition of the semiconductor layers determines the wavelength (color) of the emitted light—in this case, blue. The chip is encapsulated in a plastic package with a molded epoxy lens that shapes the light output and provides physical and environmental protection.

13. Technology Trends

The development of efficient blue GaN-based LEDs was a foundational achievement in solid-state lighting. Key industry trends relevant to this type of component include:

• Increased Efficiency: Ongoing research aims to improve the lumens-per-watt (efficacy) of LEDs, reducing energy consumption and thermal load for the same light output.
• Higher Reliability & Power Density: Advancements in packaging materials, thermal interfaces, and chip design allow for higher operating currents and temperatures while maintaining long lifespans, especially critical for automotive applications.
• Miniaturization: The drive for smaller, more densely packed electronic assemblies continues, pushing for even more compact LED packages while maintaining or improving optical performance.
• Smart Integration: A broader trend involves integrating control circuitry (drivers, sensors) directly with LEDs, but for standard indicator components like this one, the focus remains on cost-effective, reliable discrete performance.