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LTC-5689TBZ Blue 7-Segment LED Display Datasheet - 0.56-inch Digit Height - 3.6V Forward Voltage - InGaN Blue Chip - English Technical Document

Complete technical specifications for the LTC-5689TBZ, a 0.56-inch triple-digit blue seven-segment LED display with InGaN chip and integrated Zener diode protection.
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PDF Document Cover - LTC-5689TBZ Blue 7-Segment LED Display Datasheet - 0.56-inch Digit Height - 3.6V Forward Voltage - InGaN Blue Chip - English Technical Document

1. Product Overview

The LTC-5689TBZ is a high-performance, triple-digit, seven-segment alphanumeric display module. It is designed for applications requiring clear, bright numeric readouts with excellent visibility. The core component of this display is an InGaN (Indium Gallium Nitride) blue LED chip epitaxially grown on a sapphire substrate, which provides stable and efficient light emission. A key integrated feature is a Zener diode for each segment, offering protection against reverse voltage spikes, a critical factor for enhancing the long-term reliability of the display in electrically noisy environments.

The display features a black face with white segments, creating a high-contrast appearance that significantly improves readability under various lighting conditions. It is categorized as a Common Anode type display, which is a standard configuration for multiplexed driving circuits commonly used in microcontroller-based systems. The device is compliant with RoHS (Restriction of Hazardous Substances) directives, ensuring it is manufactured with lead-free materials.

1.1 Core Advantages and Target Market

The primary advantages of the LTC-5689TBZ stem from its optoelectronic design and robust construction. The use of InGaN technology delivers high brightness and a consistent blue color with a dominant wavelength typically around 470-475 nm. The continuous, uniform segments ensure a professional and seamless character appearance, which is crucial for user interfaces in consumer electronics, industrial control panels, instrumentation, and test equipment.

Its low power requirement makes it suitable for battery-powered or energy-conscious devices. The wide viewing angle ensures the display remains legible even when viewed from the side, expanding its usability in panel-mounted applications. The solid-state reliability of LEDs, combined with the added Zener diode protection, makes this display a durable choice for applications demanding long operational life and stability.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

Understanding the absolute maximum ratings is essential for preventing device failure during circuit design and operation. The ratings define the limits beyond which permanent damage may occur.

2.2 Electrical & Optical Characteristics (Ta=25°C)

These parameters are measured under specific test conditions and represent the typical performance of the device.

3. Binning and Categorization System

The datasheet explicitly states the device is \"Categorized for Luminous Intensity.\" This is a common practice in LED manufacturing to group products based on measured performance parameters.

4. Performance Curve Analysis

The datasheet references \"Typical Electrical/Optical Characteristic Curves.\" While the specific graphs are not provided in the excerpt, standard LED curves can be inferred and are critical for design.

5. Mechanical, Package & Pinout Information

5.1 Package Dimensions

The display has a digit height of 0.56 inches (14.2 mm). All mechanical dimensions are provided in millimeters with a standard tolerance of ±0.25 mm unless otherwise specified. A specific note mentions a pin tip shift tolerance of +0.4 mm, which is important for PCB footprint design to ensure proper alignment and solderability.

5.2 Internal Circuit Diagram and Pin Connection

The internal circuit diagram reveals the architecture: each segment (A-G, DP1-5) is an individual InGaN blue LED chip in series with a Zener diode. All these LED-Zener pairs share a common anode connection per digit. The pinout is as follows:

This configuration is ideal for multiplexing. By sequentially driving the common anodes (pins 9,10,11,12) HIGH and sinking current through the appropriate segment cathode pins, all three digits and five decimal points can be controlled with a relatively low pin count from a microcontroller.

6. Soldering, Assembly & Handling Guidelines

Adherence to soldering specifications is critical. The device can withstand a maximum solder temperature of 260°C for 3 seconds, measured 1.6 mm below the package body. Standard lead-free reflow profiles (IPC/JEDEC J-STD-020) are generally applicable. Care must be taken to avoid mechanical stress on the pins during insertion and to prevent excessive heating during hand soldering. For storage, the recommended range is -35°C to +85°C in a dry, non-condensing environment.

7. Application Notes and Design Considerations

7.1 Typical Application Circuits

The most common drive method is multiplexing. A microcontroller will use output pins to control transistor switches (e.g., PNP or P-channel MOSFETs) on the common anode lines and use sink-capable I/O ports or driver ICs (like 74HC595 shift registers with ULN2003 darlington arrays) on the cathode lines. A current-limiting resistor is required for each cathode line (or built into the driver). The multiplexing frequency should be high enough to avoid flicker (typically >60 Hz).

7.2 Design Considerations

8. Technical Comparison and Differentiation

Compared to standard seven-segment displays without protection diodes, the LTC-5689TBZ offers significantly improved resilience against electrical overstress from back-EMF, inductive switching, or wiring errors. Compared to displays using older GaP or GaAsP technology, the InGaN blue chip provides higher brightness and a more vibrant, saturated blue color. The 0.56-inch digit height places it in a category suitable for medium-range viewing, larger than miniature SMD displays but smaller than large panel meters.

9. Frequently Asked Questions (FAQ)

Q: Can I drive this display with a 3.3V microcontroller system?
A: Possibly, but with caution. The typical VF is 3.6V, which is higher than 3.3V. You may get very dim or no illumination. A boost circuit or a driver IC powered from a higher voltage (like 5V) would be required for the LED supply, while the control signals can remain at 3.3V logic levels.

Q: Why is there a reverse current (IR) specification if I shouldn't apply reverse voltage?
A: The IR test is a manufacturing quality check to ensure the Zener diode and LED junction are intact. It is not an operational guideline. Continuous reverse bias can degrade the device.

Q: How do I control the decimal points independently?
A: The five decimal points are split into two groups: DP1/DP2/DP3 (common cathode on Pin 8) and DP4/DP5 (individual cathodes on Pins 14 & 13, common anode on Pin 12). They must be driven accordingly in the multiplexing sequence.

10. Practical Application Example

Case: Designing a Simple 3-Digit Voltmeter Readout. A microcontroller with an ADC measures a voltage. The firmware converts the reading to three digits. Using a multiplexing routine, it activates Digit 1's anode (Pin 11), then sets the cathode pins (1-7, 8 for DP) to ground pattern for the first digit's value, waits a short interval, then deactivates Digit 1 and activates Digit 2 (Pin 10), and so on. The decimal point (e.g., DP2) is illuminated by activating its common anode group (Pin 12 for DP4/DP5, or included in the digit cycle for DP1/2/3) and pulling its specific cathode low during the correct digit's active period. Current-limiting resistors of 100 Ohms on each cathode line would provide a safe operating point from a 5V supply.

11. Operational Principle

The device operates on the principle of electroluminescence in a semiconductor p-n junction. When a forward voltage exceeding the diode's turn-on threshold (approximately 3.3-3.6V for this InGaN LED) is applied, electrons and holes recombine in the active region, releasing energy in the form of photons. The specific material composition (InGaN) determines the bandgap energy, which corresponds to the blue wavelength of the emitted light. The integrated Zener diode conducts heavily when a reverse voltage exceeds its breakdown voltage, thereby shunting harmful reverse current away from the LED junction and protecting it from damage.

12. Technology Trends

InGaN-based LEDs represent a mature and highly efficient technology for blue and green emission. Trends in display technology include a move towards higher pixel density (smaller segments or dot-matrix), integrated drivers and controllers within the display package, and the adoption of surface-mount device (SMD) packages for automated assembly. While discrete seven-segment displays remain vital for specific applications, their role is increasingly complemented by OLED and TFT LCD modules that offer greater flexibility for graphics and multi-color output. The integration of protection components like Zener diodes, as seen in the LTC-5689TBZ, reflects an industry focus on improving robustness and reliability in cost-sensitive applications.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.