Blue LED PLCC 2.8x3.5x0.65mm 2.8-3.4V 300mA 12-22lm 450-460nm Datasheet - English Technical Document

1. Product Overview

1.1 General Description

The BNRI35TS-DK-2T is a blue light emitting diode based on InGaN technology. It is housed in a compact PLCC package with dimensions of 2.8 mm × 3.5 mm × 0.65 mm. The device offers a wide viewing angle and is suitable for surface mount assembly. Its moisture sensitivity level is Class 3, and it meets RoHS compliance standards.

1.2 Features

• PLCC package for high reliability and easy assembly.
• Extremely wide viewing angle of 120°.
• Suitable for all SMT assembly and solder processes.
• Available on tape and reel packaging (4000 pcs/reel).
• Moisture sensitivity level: Level 3.
• RoHS compliant and lead-free.

1.3 Applications

• Architectural lighting: hotels, markets, household fixtures.
• Indoor display and signage.
• Landscape illumination and decorative lighting.
• General purpose lighting where high efficacy and narrow wavelength are needed.

2. Electrical and Optical Parameters

2.1 Product Parameters (at TS=25°C)

Table 1-1 summarizes the electrical and optical characteristics at 300 mA forward current:

• Forward Voltage (VF): 2.8 V (min) – 3.4 V (max), typical not specified.
• Reverse Current (IR): max 10 µA at VR=5 V.
• Luminous Flux (Φv): 12 lm (min) – 22 lm (max) at 300 mA.
• Viewing Angle (2θ1/2): 120 degrees (typical).
• Dominant Wavelength (λd): 450 nm (min) – 460 nm (max).
• Thermal Resistance (RTHJ-S): 35 °C/W (typical).

Absolute maximum ratings (Table 1-2):

• Power Dissipation (PD): 1224 mW
• Forward Current (IF): 360 mA
• Peak Forward Current (IFP): 400 mA (1/10 duty, 0.1 ms pulse)
• Reverse Voltage (VR): 5 V
• ESD (HBM): 2000 V (yield >80%)
• Operating Temperature (TOPR): -40 to +85 °C
• Storage Temperature (Tstg): -40 to +100 °C
• Junction Temperature (TJ): 110 °C

2.2 Bin Classification (IF=300mA)

Forward voltage bins: G0 (2.8-3.0V), H0 (3.0-3.2V), I0 (3.2-3.4V).
Luminous flux bins: PIA (12-15 lm), PJA (15-18 lm), PED (18-20 lm), QED (20-22 lm).
Dominant wavelength bins: A10 (450-452.5 nm), A20 (452.5-455 nm), B10 (455-457.5 nm), B20 (457.5-460 nm).

3. Mechanical and Packaging Details

3.1 Package Dimensions

The package is of PLCC type with top view dimensions 2.80 mm × 3.50 mm (length × width). Side view thickness is 0.65 mm. Bottom view shows two pads for cathode and anode, with polarity marking. Soldering patterns are provided for optimal pad layout (see Fig.1-4 and Fig.1-5). All dimensions tolerance is ±0.2 mm unless stated.

3.2 Carrier Tape and Reel

Carrier tape: standard 8 mm or 12 mm tape (exact width not specified), with polarity mark and top tape. Reel dimensions: A (outer diameter) 178 ±1 mm, B (width) 10.5 ±0.5 mm, C (hub diameter) 59 mm, D (hub hole diameter) 13.5 ±0.5 mm. Max 4000 pcs per reel.

3.3 Label Form Specification

Labels include: Part Number, Spec Number, Lot Number, Bin Code (including luminous flux and dominant wavelength), Forward Voltage range, Quantity, and Date.

Packaging consists of reel in moisture barrier bag with desiccant and humidity indicator, placed in cardboard box.

4. Typical Optical and Electrical Characteristics Curves

Several characteristic curves are provided to illustrate device behavior under various conditions:

• Forward Voltage vs. Forward Current (Fig 1-7): At 300 mA, forward voltage is approximately 2.9-3.1 V. The curve shows typical exponential diode behavior.
• Forward Current vs. Relative Intensity (Fig 1-8): Relative intensity increases with current, with saturation at higher currents. At 300 mA, relative intensity is near 1.0.
• Solder Temperature vs. Relative Luminous Flux (Fig 1-9): Luminous flux decreases as solder temperature rises, dropping to about 0.8 of initial value at 90°C.
• Solder Temperature vs. Forward Current (Fig 1-10): Maximum allowed forward current decreases with temperature to ensure junction temperature limit.
• Forward Voltage vs. Solder Temperature (Fig 1-11): Forward voltage decreases linearly with temperature, with a negative coefficient.
• Wavelength vs. Pin Temperature (Fig 1-12): Dominant wavelength shifts slightly (about 2 nm) over temperature range from 20°C to 100°C.
• Spectrum Distribution (Fig 1-13): Peak emission at approximately 455-460 nm, with a narrow FWHM typical of InGaN blue LEDs.

5. Reliability Testing

5.1 Test Conditions

LEDs are subjected to multiple reliability tests as per JEDEC standards:

• Reflow: 260°C max, 2 times.
• Thermal Shock: -40°C to 100°C, 15 min dwell, 100 cycles.
• High Temperature Storage: 100°C, 1000 hours.
• Low Temperature Storage: -40°C, 1000 hours.
• Life Test: Ta=25°C, IF=300mA, 1000 hours.
• High Temperature High Humidity Life: 60°C/90%RH, IF=150mA, 1000 hours.

5.2 Criteria for Judging Damage

After each test, LEDs should pass: forward voltage within specification, luminous intensity maintenance ≥70%, no open/short circuits or flickering.

6. SMT Reflow Soldering Guidelines

6.1 Reflow Profile

The recommended reflow soldering profile is shown in Fig 3-1. Key parameters:

• Average ramp-up rate: max 3°C/s
• Preheat: 150°C to 200°C for 60-120 seconds
• Time above 217°C: max 60 seconds
• Peak temperature: 260°C max, with time within 5°C of peak: max 10 seconds
• Cooling down: max 6°C/s
• Time from 25°C to peak: max 8 minutes

Reflow soldering should not exceed two times. If more than 24 hours pass after first reflow, LEDs may be damaged. Do not apply stress during heating.

6.2 Hand Soldering

When hand soldering, iron temperature must be below 300°C for less than 3 seconds, and only one attempt is allowed.

6.3 Repairing

Repair is not recommended. If unavoidable, use a double-head soldering iron. Confirm no damage to LED characteristics in advance.

6.4 Cautions

The silicone encapsulant is soft; avoid strong pressure on top surface. Use appropriate pickup nozzle pressure. Do not apply mechanical force or rapid cooling after soldering.

7. Handling Precautions and Storage Conditions

7.1 Environmental Constraints

Sulfur content in mating materials must be below 100 ppm to prevent tarnishing. Bromine content <900 ppm, Chlorine <900 ppm, total Br+Cl <1500 ppm. VOCs that outgas from materials can discolor silicone encapsulant; compatibility must be verified in advance.

7.2 Mechanical Handling

Handle LED by sides using forceps. Do not touch silicone lens directly. Avoid electrostatic discharge as LEDs are sensitive (ESD >2000V HBM). EOS can also cause damage.

7.3 Storage Conditions

Before opening aluminum bag: store ≤30°C, ≤75% RH, within 1 year from date. After opening: ≤30°C, ≤60% RH, 24 hours. If exceeded, baking at 60±5°C for 24 hours is required. If moisture absorbent material faded or package damaged, bake before use.

Cleaning: Isopropyl alcohol is recommended. Ultrasonic cleaning is not recommended due to potential damage.

8. Application Guidance

This blue LED is well-suited for indoor and outdoor architectural lighting, display backlighting, and landscape illumination. When designing with multiple LEDs in series or parallel, consider current distribution and heat dissipation. Always include current-limiting resistors or use constant current drivers to prevent thermal runaway. Thermal design is critical: ensure the board design accommodates heat sinking to keep junction temperature below 110°C. The wide viewing angle (120°) provides uniform light distribution.

9. Technical Comparison and Advantages

Compared to similar PLCC 2835 LEDs, this device offers tightly binned wavelength (450-460 nm) and luminous flux, ensuring color consistency across batches. The PLCC package is known for robust reliability and ease of assembly. The extremely wide viewing angle differentiates it from standard devices. Moisture sensitivity Level 3 is common but compliance to RoHS and ESD robustness adds value. The bin range for flux up to 22 lm at 300 mA is competitive for a blue LED in this package size.

10. Operating Principle and Technology

The LED uses InGaN (indium gallium nitride) as the active material grown on a substrate. When forward biased, electrons and holes recombine in the active region, emitting photons with energy corresponding to the bandgap. The blue emission (450-460 nm) is achieved by adjusting the indium composition. The PLCC package encloses the die and provides electrical connections through lead frames. The silicone encapsulant protects the die and shapes the light output.

11. Industry Trends and Future Outlook

LED technology continues to evolve toward higher efficacy, smaller packages, and greater reliability. Surface mount LEDs like this PLCC package are widely adopted for automated assembly. The trend in blue LEDs includes improved quantum efficiency and narrower spectral output for applications in lighting and displays. As thermal management improves, operating currents can be increased. This LED's performance fits well with current market needs for efficient, compact, and reliable blue light sources.

12. Frequently Asked Questions (FAQ)

Q: What is the typical forward voltage at 300 mA?

A: The forward voltage is typically around 3.0-3.1 V, though it varies within the 2.8-3.4 V range depending on bin. Please refer to bin code on label.

Q: Can I use this LED at currents higher than 300 mA?

A: The absolute maximum forward current is 360 mA (DC) and 400 mA peak (pulsed). Operating above 360 mA may damage the device. Ensure proper heat sinking.

Q: How do I select the correct bin for my application?

A: Choose forward voltage bin based on driver design. For color consistency, select narrow wavelength bin (e.g., A10 or B10). For luminous flux, select based on brightness requirements.

Q: What is the storage life after opening the bag?

A: LEDs must be used within 24 hours after opening if stored at ≤30°C and ≤60% RH. Otherwise, bake at 60°C for 24 hours before use.

Q: Is this LED suitable for outdoor use?

A: The operating temperature range is -40 to +85°C, so it can be used outdoors if properly sealed against moisture. However, the package is not waterproof; external enclosure is required.

Q: Can I clean the LED after soldering?

A: Yes, use isopropyl alcohol. Avoid ultrasonic cleaning.

13. Design Case Examples

Example 1: A linear light bar for indoor display. Use 10 LEDs in series driven by constant current source set to 300 mA. Calculate total voltage drop (approx. 30 V). Use thermal via pads on PCB to dissipate heat. Ensure spacing for adequate heat spreading.

Example 2: A single LED module for landscape spot light. Use a buck converter to drive one LED at 300 mA. Include a lens for beam shaping. The wide viewing angle of the LED itself can be used without diffuser for a wide beam.