7344-15SUGC/S400-X6 LED Lamp Datasheet - 5mm Round - Voltage 3.3V - Brilliant Green - 110mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the 7344-15SUGC/S400-X6 LED lamp. This component is a high-brightness, brilliant green light-emitting diode designed for a variety of indicator and backlighting applications. The device utilizes InGaN chip technology encapsulated in a water-clear resin, resulting in a vibrant and intense green output.

1.1 Core Features and Advantages

The LED offers several key features that make it suitable for demanding electronic designs:

• High Luminous Intensity: Delivers a typical luminous intensity of 11000 mcd at a forward current of 20mA, ensuring excellent visibility.
• Narrow Viewing Angle: Features a typical 20-degree half-intensity viewing angle (2θ1/2), providing a focused beam of light ideal for directed illumination.
• Robust Construction: Designed for reliability and longevity in various operating conditions.
• Environmental Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
• Packaging Options: Available on tape and reel for automated assembly processes.

1.2 Target Applications

This LED is specifically engineered for applications requiring a compact, bright green indicator. Primary application areas include:

• Status indicators on consumer electronics (TV sets, monitors, telephones).
• Backlighting for switches, panels, and displays.
• General-purpose indicator lights in computer peripherals and industrial control panels.

2. Technical Parameters and Specifications

A detailed analysis of the device's electrical, optical, and thermal characteristics is essential for proper circuit design and integration.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Continuous Forward Current (I_F): 25 mA
• Peak Forward Current (I_FP): 100 mA (Duty 1/10 @ 1kHz)
• Reverse Voltage (V_R): 5 V
• Power Dissipation (P_d): 110 mW
• Operating Temperature (T_opr): -40°C to +85°C
• Storage Temperature (T_stg): -40°C to +100°C
• Soldering Temperature (T_sol): 260°C for 5 seconds (wave or dip soldering).

2.2 Electro-Optical Characteristics (T_a=25°C)

The following parameters are measured under standard test conditions (I_F=20mA unless specified) and represent the typical performance of the device.

• Luminous Intensity (I_v): Min: 8000 mcd, Typ: 11000 mcd
• Viewing Angle (2θ_1/2): Typ: 20 degrees
• Peak Wavelength (λ_p): Typ: 518 nm
• Dominant Wavelength (λ_d): Typ: 525 nm
• Spectral Bandwidth (Δλ): Typ: 35 nm
• Forward Voltage (V_F): Min: 2.7V, Typ: 3.3V, Max: 3.7V
• Reverse Current (I_R): Max: 50 μA (at V_R=5V)

Design Note: The forward voltage has a range from 2.7V to 3.7V. Designers must ensure the current-limiting resistor is calculated using the maximum V_F to guarantee the LED does not exceed its maximum current rating under worst-case conditions.

3. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate the device's behavior under varying conditions.

3.1 Spectral Distribution and Directivity

The Relative Intensity vs. Wavelength curve confirms the monochromatic nature of the output, centered around 518-525 nm (brilliant green). The Directivity curve visually represents the 20-degree viewing angle, showing how light intensity decreases sharply outside the central beam.

3.2 Electrical and Thermal Relationships

• Forward Current vs. Forward Voltage (I-V Curve): This curve is exponential, typical for diodes. The typical forward voltage of 3.3V is specified at 20mA. The curve helps in understanding the dynamic resistance of the LED.
• Relative Intensity vs. Forward Current: Luminous output increases with current but not linearly. Operating above the recommended continuous current (25mA) may yield diminishing returns in brightness while significantly increasing heat and reducing lifespan.
• Relative Intensity vs. Ambient Temperature: LED light output generally decreases as ambient temperature rises. This curve is critical for applications operating in high-temperature environments to ensure sufficient brightness is maintained.
• Forward Current vs. Ambient Temperature (De-rating Curve): This is arguably the most important curve for reliability. It shows the maximum allowable forward current that must not be exceeded as the ambient temperature increases. To ensure long-term reliability, the operating current must be de-rated according to this curve, especially near the maximum operating temperature of 85°C.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED is housed in a standard 5mm round package (T-1 3/4). Key dimensional notes from the drawing include:

• Overall lead spacing is 2.54mm (0.1\") typical.
• The height of the flange must be less than 1.5mm.
• Standard dimensional tolerance is ±0.25mm unless otherwise specified.

Polarity Identification: The longer lead is the anode (positive), and the shorter lead is the cathode (negative). The package may also have a flat side on the rim near the cathode lead.

5. Assembly, Soldering, and Handling Guidelines

Proper handling is crucial to prevent damage and ensure optimal performance.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the base of the epoxy bulb.
• Perform lead forming before soldering.
• Avoid applying stress to the LED package or its base during forming.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity (RH).
• Recommended storage life after shipment is 3 months.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Recommendations

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering:

• Iron Tip Temperature: Max 300°C (for a 30W max iron).
• Soldering Time: Max 3 seconds per lead.

Wave/Dip Soldering:

• Preheat Temperature: Max 100°C (for max 60 seconds).
• Soldering Bath Temperature & Time: Max 260°C for 5 seconds.

Critical Notes:

• Avoid stress on leads during high-temperature soldering.
• Do not solder (dip or hand) more than once.
• Protect the LED from mechanical shock until it cools to room temperature.
• Avoid rapid cooling from peak soldering temperature.
• Always use the lowest effective soldering temperature.

5.4 Cleaning

• Clean only if necessary using isopropyl alcohol at room temperature for ≤1 minute.
• Air dry at room temperature.
• Avoid ultrasonic cleaning. If absolutely required, extensive pre-qualification is necessary to ensure no damage occurs.

5.5 Heat Management and ESD

• Heat Management: Proper thermal design is essential. Use the de-rating curve to select an appropriate operating current based on the expected ambient temperature around the LED in the final application. Inadequate heat sinking can lead to premature brightness degradation and failure.
• ESD (Electrostatic Discharge): This LED is sensitive to electrostatic discharge. Standard ESD handling precautions must be observed during assembly and handling, including the use of grounded workstations and wrist straps.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packaged to ensure protection during shipping and handling:

• Primary Packing: 200-500 pieces per anti-static bag.
• Secondary Packing: 5 bags per inner carton.
• Tertiary Packing: 10 inner cartons per master (outside) carton.

6.2 Label Explanation

Labels on packaging contain key information:

• P/N: Production Number (the part number, e.g., 7344-15SUGC/S400-X6).
• LOT No: Lot Number for traceability.
• QTY: Packing Quantity in the bag/carton.
• CAT/HUE: Indicates rank/grade and dominant wavelength bin.

7. Application Design Considerations and FAQs

7.1 Typical Application Circuit

The most common drive method is a simple series resistor. The resistor value (R_s) is calculated as: R_s = (V_supply - V_F) / I_F. Always use the maximum V_F from the datasheet (3.7V) in this calculation to ensure the current never exceeds the desired I_F (e.g., 20mA) under all conditions. For a 5V supply: R_s = (5V - 3.7V) / 0.020A = 65 Ohms. The nearest standard value (68 Ohms) is a safe choice.

7.2 Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at its peak current of 100mA?
A: Only under very specific pulsed conditions (1/10 duty cycle at 1kHz). For continuous operation, the absolute maximum is 25mA. Exceeding this will drastically reduce lifespan and may cause immediate failure.

Q: Why is the viewing angle so narrow (20 degrees)?
A> The narrow viewing angle is a design feature for applications requiring a focused beam of light, such as indicator lights that need to be seen from a specific direction or for optical coupling. It is achieved through the shape of the epoxy lens.

Q: How do I interpret the Dominant Wavelength (525nm) vs. Peak Wavelength (518nm)?
A: Peak Wavelength (λ_p) is the single wavelength where the emission spectrum is strongest. Dominant Wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED. The human eye's sensitivity (photopic response) affects λ_d. For green LEDs, λ_d is often slightly longer than λ_p.

Q: What is the most critical factor for long-term reliability?
A> Proper thermal management and current de-rating. Operating the LED at or below its recommended current, especially in warmer environments (using the de-rating curve), is the single most important practice to ensure longevity and stable light output.

8. Technical Principles and Context

8.1 Operating Principle

This LED is based on InGaN (Indium Gallium Nitride) semiconductor technology. When a forward voltage is applied across the p-n junction, electrons and holes recombine within the active region, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength of the emitted light—in this case, brilliant green. The water-clear epoxy resin acts as a primary lens, shaping the light output and providing mechanical and environmental protection.

8.2 Comparison and Trends

The 5mm round LED package (like the 7344) is a mature and widely used through-hole technology. Its key advantages are ease of hand assembly, robustness, and high light output from a proven package. Compared to newer surface-mount device (SMD) LEDs (e.g., 3528, 5050), through-hole LEDs like this one are generally better suited for applications requiring very high single-point brightness, simpler prototyping, or where wave soldering of through-hole components is already in use. The industry trend, however, is towards smaller SMD packages for higher density, automated placement, and better thermal management via PCB pads. This particular device represents a high-performance option within the classic through-hole LED category.