LED Lamp 523-2SUGD/S400-A6 Datasheet - Brilliant Green - 3.3V Typ. - 90mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the 523-2SUGD/S400-A6 LED lamp. This component is a brilliant green, diffused LED designed for applications requiring higher brightness levels. It is a reliable and robust surface-mount device available on tape and reel for automated assembly processes. The product is compliant with RoHS directives and is lead-free.

1.1 Core Advantages

The primary advantages of this LED series include a choice of various viewing angles to suit different application needs, high reliability, and compliance with modern environmental standards. Its design prioritizes consistent performance in demanding conditions.

1.2 Target Applications

This LED is suitable for a range of consumer and industrial electronics where indicator or backlighting functions are required. Typical applications include television sets, computer monitors, telephones, and other computing devices.

2. Technical Parameter Deep Dive

This section details the critical electrical, optical, and thermal parameters that define the operational limits and performance of the LED.

2.1 Absolute Maximum Ratings

The absolute maximum ratings specify the limits beyond which permanent damage to the device may occur. These values are measured at an ambient temperature (Ta) of 25°C.

• Continuous Forward Current (IF): 25 mA
• Peak Forward Current (IFP): 100 mA (at a duty cycle of 1/10 and 1 kHz frequency)
• Reverse Voltage (VR): 5 V
• Power Dissipation (Pd): 90 mW
• Operating Temperature Range (Topr): -40°C to +85°C
• Storage Temperature Range (Tstg): -40°C to +100°C
• Soldering Temperature (Tsol): 260°C for 5 seconds (wave or reflow soldering)

Operating the device continuously at or near these maximum ratings is not recommended and will adversely affect reliability.

2.2 Electro-Optical Characteristics

The electro-optical characteristics define the typical performance of the LED under normal operating conditions (Ta=25°C, IF=20mA unless otherwise stated).

• Luminous Intensity (Iv): 160 mcd (Min.), 320 mcd (Typ.)
• Viewing Angle (2θ1/2): 130° (Typ.)
• Peak Wavelength (λp): 518 nm (Typ.)
• Dominant Wavelength (λd): 525 nm (Typ.)
• Spectrum Radiation Bandwidth (Δλ): 35 nm (Typ.)
• Forward Voltage (VF): 2.7 V (Min.), 3.3 V (Typ.), 3.7 V (Max.) at IF=20mA
• Reverse Current (IR): 50 μA (Max.) at VR=5V

Measurement Tolerances: Forward Voltage ±0.1V, Luminous Intensity ±10%, Dominant Wavelength ±1.0nm.

3. Binning System Explanation

The product is categorized based on key performance parameters to ensure consistency within a production lot. The packing label includes codes for these bins.

• CAT: Ranks of Luminous Intensity. This indicates the specific brightness bin for the LED.
• HUE: Ranks of Dominant Wavelength. This specifies the color/wavelength bin.
• REF: Ranks of Forward Voltage. This categorizes LEDs based on their forward voltage drop.

Consult the manufacturer's detailed binning documentation for specific code definitions when precise color or intensity matching is critical for an application.

4. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate the LED's behavior under varying conditions. Understanding these curves is essential for optimal circuit design.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking at approximately 518 nm (Typical) with a bandwidth (FWHM) of 35 nm, confirming the brilliant green color output.

4.2 Directivity Pattern

The directivity curve visualizes the 130° viewing angle, showing how light intensity is distributed spatially. This wide angle is suitable for applications requiring broad illumination.

4.3 Forward Current vs. Forward Voltage (IV Curve)

This graph depicts the non-linear relationship between forward current (IF) and forward voltage (VF). The typical VF is 3.3V at 20mA. Designers must use appropriate current-limiting resistors or drivers based on this curve.

4.4 Relative Intensity vs. Forward Current

This curve shows how light output increases with forward current. It is crucial for understanding the efficacy and for designing circuits where brightness control via current is implemented.

4.5 Temperature Dependence

Two key curves illustrate temperature effects: Relative Intensity vs. Ambient Temperature: Shows the decrease in light output as ambient temperature rises, highlighting the importance of thermal management. Forward Current vs. Ambient Temperature: May illustrate how the forward voltage characteristic shifts with temperature, affecting driver circuit performance.

5. Mechanical and Package Information

The package drawing provides the critical physical dimensions for PCB layout and assembly. Key dimensions include the lead spacing, body size, and recommended land pattern. The drawing also clearly indicates the polarity (cathode/anode) via physical markers or asymmetrical features, which is essential for correct orientation during assembly to prevent reverse bias damage.

6. Soldering and Assembly Guidelines

Proper handling is critical to maintain LED performance and reliability. These guidelines are based on the component's material properties and construction.

6.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Misalignment during PCB mounting can cause resin deterioration.
• Cut leads at room temperature.

6.2 Storage

• Store at ≤30°C and ≤70% RH. Shelf life is 3 months from shipment.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: - Iron Tip Temperature: Max. 300°C (for a 30W max iron) - Soldering Time: Max. 3 seconds per lead

Wave/Dip Soldering: - Preheat Temperature: Max. 100°C (for max. 60 seconds) - Solder Bath Temperature & Time: Max. 260°C for 5 seconds - A recommended soldering profile graph should be followed to control thermal stress.

Critical Notes: - Avoid stress on leads at high temperatures. - Do not solder (dip/hand) more than once. - Protect the LED from shock/vibration while cooling to room temperature after soldering. - Avoid rapid cooling processes.

6.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning unless pre-qualified, as it can damage the die or bonds.

6.5 Heat Management

Proper thermal design is essential. The operating current must be de-rated according to the derating curve (refer to the product specification) based on the ambient temperature surrounding the LED in the application. Exceeding thermal limits reduces light output and lifespan.

6.6 ESD (Electrostatic Discharge) Precautions

The LED die is sensitive to electrostatic discharge. ESD can cause immediate failure or latent damage affecting long-term reliability. Always handle components in an ESD-protected area using appropriate grounding procedures.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packed to prevent damage during shipping and storage: - Primary Packing: 500 pieces per anti-static bag. - Secondary Packing: 5 bags per inner carton. - Tertiary Packing: 10 inner cartons per outside carton. The packaging includes moisture-resistant materials.

7.2 Label Explanation

The packing label contains several codes: - P/N: Production Number (the base part number). - CPN: Customer's Production Number (if assigned). - QTY: Packing Quantity. - CAT/HUE/REF: Binning codes for Intensity, Wavelength, and Voltage. - LOT No: Traceable lot number for quality control.

8. Application Suggestions

8.1 Typical Application Circuits

For basic indicator use, a simple series current-limiting resistor is required. The resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - VF) / IF, where VF is the forward voltage (use 3.3V typical for design margin) and IF is the desired forward current (e.g., 20mA). Ensure the resistor's power rating is sufficient (P = IF² * R).

8.2 Design Considerations

• Current Driving: LEDs are current-driven devices. Always use a constant current source or a current-limiting resistor for stable brightness and longevity.
• Thermal Management: Design the PCB layout to dissipate heat effectively, especially if multiple LEDs are used or if operated at high ambient temperatures. Use adequate copper area.
• ESD Protection: Incorporate ESD protection diodes on signal lines connected to the LED in environments prone to static discharge.
• Optical Design: The 130° viewing angle provides wide coverage. Consider lenses or light guides if beam shaping is needed.

9. Technical Comparison & Differentiation

While specific competitor comparisons are not provided in the datasheet, key differentiating features of this LED can be inferred: - High Typical Brightness (320 mcd): Offers good luminous intensity for its package type and current rating. - Wide Viewing Angle (130°): Suitable for applications requiring broad angular visibility without secondary optics. - Robust Construction: Guidelines for lead forming and soldering suggest a package designed for standard assembly processes.Environmental Compliance: RoHS and lead-free status meets modern regulatory requirements for global markets.

10. Frequently Asked Questions (FAQ)

Q1: What is the difference between Peak Wavelength (518nm) and Dominant Wavelength (525nm)? A: Peak wavelength is the point of highest intensity in the spectrum. Dominant wavelength is the perceived color point, calculated from the spectrum and the human eye response (CIE curve). For green LEDs, they are often close but not identical.

Q2: Can I drive this LED at its maximum continuous current of 25mA? A: While possible, it is not recommended for optimal lifespan, especially at higher ambient temperatures. Always refer to the derating curve. Operating at the typical 20mA provides a good balance of brightness and reliability.

Q3: Why is the minimum distance of 3mm from the solder joint to the bulb so important? A: This prevents excessive heat from traveling up the lead and damaging the internal die attach, wire bonds, or the epoxy resin itself, which can cause premature failure or darkening.

Q4: The storage life is 3 months. What happens if I use older stock? A: Beyond 3 months in standard storage, moisture absorption into the package may exceed safe limits. During soldering, this trapped moisture can vaporize rapidly causing "popcorning" or internal delamination. For older stock, a baking process (following industry standards like IPC/JEDEC J-STD-033) is required before soldering.

11. Practical Use Case Example

Scenario: Designing a status indicator panel for a network router. The panel requires 5 brilliant green LEDs to indicate "power on" and "link activity" for four ports. Each LED will be driven by a 3.3V microcontroller GPIO pin.

Design Steps: 1. Current Limit: Choose a drive current of 15mA for adequate brightness and lower power consumption. Using the typical VF of 3.3V, calculate the series resistor: R = (3.3V - 3.3V) / 0.015A = 0 Ohms. This calculation shows a problem—the GPIO pin voltage equals the LED VF, leaving no voltage drop for a current-limiting resistor.

2. Revised Circuit: Use the system's 5V rail. R = (5V - 3.3V) / 0.015A ≈ 113 Ohms. Use a standard 120 Ohm resistor. Power in the resistor: P = (0.015A)² * 120Ω = 0.027W, so a 1/10W or 1/8W resistor is sufficient.

3. Layout: Place the LEDs on the front panel. On the PCB, ensure the cathode (identified from the package drawing) is connected to the resistor/resistor to ground. Provide a small copper pour around the LED pads to aid heat dissipation, connecting it to a ground plane if possible.

4. Assembly: Follow the wave soldering profile recommended in the datasheet. Ensure the 3mm distance from the pad to the LED body is maintained in the footprint design.

This results in a reliable, consistently bright indicator system.

12. Operating Principle Introduction

This LED is a semiconductor light source. Its core is a chip made of InGaN (Indium Gallium Nitride) materials. When a forward voltage is applied across the anode and cathode, electrons and holes are injected into the active region of the semiconductor. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which in turn defines the wavelength (color) of the emitted light—in this case, brilliant green. The diffused green epoxy resin casing acts as both a protective layer and a primary lens, helping to scatter the light to achieve the wide 130° viewing angle.

13. Technology Trends

The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color rendering, and greater reliability. For indicator-type LEDs like the 523-2SUGD/S400-A6, trends include: - Miniaturization: Development of even smaller package footprints while maintaining or improving light output. - Higher Temperature Tolerance: Materials and designs that allow stable operation in increasingly harsh environments (e.g., under-hood automotive applications). - Integration: Incorporating built-in current limiting resistors or protection diodes within the LED package to simplify circuit design and save board space. - Broadened Color Gamut: Advances in phosphor and semiconductor materials enable more saturated and precise colors for status indication and display backlighting.