LED Lamp 1254-10SURD/S530-A3 Specification - Brilliant Red - 20mA - 400mcd - 30° Viewing Angle - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness Brilliant Red LED lamp. The device is part of a series engineered for applications demanding superior luminous output and reliability. It utilizes AlGaInP chip technology encapsulated in a red diffused resin, delivering a distinct brilliant red emission. The product is designed with a focus on robustness and compliance with modern environmental and safety standards, including being Pb-free, RoHS compliant, compliant with EU REACH, and meeting halogen-free requirements (Br < 900 ppm, Cl < 900 ppm, Br+Cl < 1500 ppm). It is available in tape and reel packaging for automated assembly processes.

1.1 Core Advantages and Target Market

The primary advantage of this LED is its combination of high luminous intensity (up to 400 mcd typical) with a reliable and robust construction. The availability of various viewing angles (with this specific variant featuring a 30° half-angle) allows designers to select the optimal beam pattern for their application. Its compliance with international environmental directives makes it suitable for global markets. The target applications are primarily in consumer electronics, including television sets, computer monitors, telephones, and general computing equipment where indicator or backlighting functions are required.

2. Technical Parameter Deep-Dive

This section provides an objective and detailed analysis of the device's key technical parameters as defined in the datasheet.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Continuous Forward Current (I_F): 25 mA. Exceeding this current continuously will generate excessive heat, degrading the LED's lifetime and potentially causing catastrophic failure.
• Peak Forward Current (I_FP): 60 mA (at 1/10 duty cycle, 1 kHz). This rating allows for short pulses of higher current, useful for multiplexing or PWM dimming schemes, but the average current must remain within the continuous rating.
• Reverse Voltage (V_R): 5 V. LEDs have very low reverse breakdown voltages. Applying a reverse voltage greater than 5V can cause immediate and irreversible junction breakdown.
• Power Dissipation (P_d): 60 mW. This is the maximum power the package can dissipate as heat at an ambient temperature (T_a) of 25°C. The actual usable dissipation decreases as ambient temperature rises.
• Operating & Storage Temperature: -40°C to +85°C (Operating), -40°C to +100°C (Storage). These ranges define the environmental conditions the device can withstand during use and non-operational periods.
• Soldering Temperature: 260°C for 5 seconds. This is critical for wave or reflow soldering processes to avoid thermal damage to the epoxy package and internal wire bonds.

2.2 Electro-Optical Characteristics

These characteristics are measured under standard test conditions (T_a=25°C, I_F=20mA) and define the device's performance.

• Luminous Intensity (I_v): 250 mcd (Min), 400 mcd (Typ). This is the primary measure of brightness. The typical value of 400 mcd indicates a very bright output for a standard LED lamp. Designers should use the minimum value for worst-case brightness calculations.
• Viewing Angle (2θ_1/2): 30° (Typ). This is the full angle at which the luminous intensity drops to half of its peak value. A 30° angle produces a relatively focused beam, suitable for directional indicators.
• Peak Wavelength (λ_p): 632 nm (Typ). The wavelength at which the spectral emission is strongest. For a brilliant red, this falls in the upper red/orange region of the spectrum.
• Dominant Wavelength (λ_d): 624 nm (Typ). This is the single wavelength perceived by the human eye that matches the color of the LED's light. It is the key parameter for color specification.
• Forward Voltage (V_F): 1.7V (Min), 2.0V (Typ), 2.4V (Max) at 20mA. This is the voltage drop across the LED when operating. It is crucial for designing the current-limiting circuitry. The driver must be able to handle the maximum V_F to ensure proper current regulation.
• Reverse Current (I_R): 10 μA (Max) at V_R=5V. This is the small leakage current when the diode is reverse-biased within its maximum rating.

Measurement Uncertainties: The datasheet notes specific tolerances for measurements: ±0.1V for V_F, ±10% for I_v, and ±1.0nm for λ_d. These must be considered in high-precision applications.

3. Performance Curve Analysis

The provided characteristic curves offer deeper insight into the device's behavior under varying conditions.

3.1 Spectral Distribution and Directivity

The Relative Intensity vs. Wavelength curve shows a typical Gaussian-like distribution centered around 632 nm, with a spectral bandwidth (Δλ) of approximately 20 nm. This narrow bandwidth is characteristic of AlGaInP LEDs and results in a saturated color. The Directivity curve visually confirms the 30° viewing angle, showing how intensity falls off symmetrically with angle from the central axis.

3.2 Electrical and Thermal Relationships

The Forward Current vs. Forward Voltage (I-V Curve) exhibits the classic exponential diode relationship. At the typical operating point of 20mA, the voltage is 2.0V. The curve is essential for understanding the dynamic resistance of the LED and for thermal analysis, as V_F has a negative temperature coefficient.

The Relative Intensity vs. Forward Current curve shows that light output is nearly linear with current in the lower range but may saturate at higher currents due to thermal and efficiency droop. Operating at or below 20mA is optimal for linearity and longevity.

3.3 Temperature Dependence

The Relative Intensity vs. Ambient Temperature curve demonstrates a significant decrease in light output as temperature increases. This is a critical design factor; the LED will be dimmer in a hot environment (e.g., inside an enclosed electronic device) compared to lab conditions at 25°C.

The Forward Current vs. Ambient Temperature curve, when considered with the power dissipation rating, forms the basis for de-rating. As ambient temperature rises, the maximum allowable continuous forward current must be reduced to keep the junction temperature within safe limits and prevent accelerated degradation. The datasheet advises consulting the specific de-rating curve for the product.

4. Mechanical and Package Information

4.1 Package Dimensions

The datasheet includes a detailed dimensional drawing of the LED lamp. Key mechanical specifications include:

• All dimensions are in millimeters.
• The height of the flange (the rim at the base of the dome) must be less than 1.5mm (0.059"). This is important for clearance in the final assembly.
• The standard tolerance for unspecified dimensions is ±0.25mm, which is typical for this class of component.
• The drawing defines the lead spacing, body diameter, overall height, and the shape of the lens. Precise dimensions are critical for PCB footprint design and ensuring proper fit in housings or lenses.

4.2 Polarity Identification

The cathode (negative) lead is typically identified by a flat spot on the LED lens, a shorter lead, or a mark on the package. The dimensional drawing should clearly indicate this. Correct polarity is essential during installation, as applying reverse voltage can damage the device.

5. Soldering and Assembly Guidelines

Proper handling is crucial for reliability. The guidelines are based on preventing mechanical, thermal, and electrostatic damage.

5.1 Lead Forming

• Bending must occur at least 3mm from the base of the epoxy bulb to avoid transferring stress to the internal die and wire bonds.
• Forming must be done before soldering.
• Cutting leads should be done at room temperature to prevent thermal shock.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

5.2 Storage

• Recommended storage: ≤30°C and ≤70% Relative Humidity (RH).
• Shelf life after shipping: 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

Hand Soldering: Iron tip temperature ≤300°C (for a max 30W iron), soldering time ≤3 seconds per lead. Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Dip (Wave) Soldering: Preheat ≤100°C for ≤60 seconds. Solder bath temperature ≤260°C for ≤5 seconds. Maintain the 3mm distance rule.

Critical Soldering Notes:

• Avoid stress on leads during high-temperature phases.
• Do not solder (dip or hand) the same LED more than once.
• Protect the LED from mechanical shock until it cools to room temperature after soldering.
• Allow gradual cooling; avoid rapid quenching.
• Always use the lowest effective soldering temperature and time.

5.4 Cleaning

If cleaning is necessary:

• Use isopropyl alcohol at room temperature.
• Immersion time should be no more than one minute.
• Air dry at room temperature.
• Avoid ultrasonic cleaning unless absolutely necessary and only after thorough pre-qualification testing, as cavitation can damage the internal structure.

5.5 Heat Management and ESD

Heat Management: Effective thermal design is mandatory. The current must be de-rated according to the ambient temperature, as shown in the product's de-rating curve. Controlling the LED's operating temperature is key to maintaining brightness and long-term reliability.

ESD (Electrostatic Discharge): This LED is sensitive to ESD. Standard ESD precautions must be followed during handling and assembly: use grounded workstations, wrist straps, and conductive containers. ESD can cause latent or catastrophic damage to the semiconductor die.

6. Packaging and Ordering Information

6.1 Packing Specification

The device is packed to ensure moisture resistance and protection from electrostatic discharge.

• Primary Packing: 200-1000 pieces per anti-static bag.
• Secondary Packing: 4 bags per inner carton.
• Tertiary Packing: 10 inner cartons per master (outside) carton.

6.2 Label Explanation

Labels on the packaging contain key information for traceability and identification:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 1254-10SURD/S530-A3).
• QTY: Quantity of pieces in the bag/carton.
• CAT: Ranks or binning code (e.g., for intensity or wavelength).
• HUE: Dominant Wavelength code.
• REF: Reference information.
• LOT No: Manufacturing Lot Number for traceability.

7. Application Suggestions and Design Considerations

7.1 Typical Application Scenarios

This LED is ideally suited for:

• Status Indicators: Power-on, standby, or function-active lights in TVs, monitors, and computers where high brightness ensures good visibility.
• Backlighting: For small legends or symbols on control panels or telephones.
• General Purpose Signaling: Any application requiring a clear, bright red visual signal in consumer electronics.

7.2 Design Considerations

• Current Limiting: Always drive the LED with a constant current source or a voltage source with a series resistor. Calculate the resistor value based on the supply voltage (V_CC), the LED's maximum V_F, and the desired I_F (e.g., 20mA). R = (V_CC - V_{F_max}) / I_F.
• Thermal Management: Ensure the PCB and surrounding design allow for heat dissipation. Avoid placing the LED near other heat-generating components. Consider using thermal vias in the PCB pad if high duty cycles or elevated ambient temperatures are expected.
• Optical Integration: The 30° viewing angle provides a focused beam. For wider illumination, external diffusers or lenses may be required. Ensure the mechanical housing provides proper alignment and does not obstruct the viewing angle.
• ESD Protection: In sensitive or exposed applications, consider adding a small transient voltage suppression (TVS) diode or a resistor-capacitor network in parallel with the LED to protect against voltage spikes.

8. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at 30mA for extra brightness?
A1: No. The Absolute Maximum Rating for continuous forward current is 25 mA. Operating at 30 mA exceeds this rating, which will overstress the junction, leading to rapid brightness degradation, color shift, and potentially immediate failure. Always operate at or below the specified maximum continuous current.

Q2: The typical V_F is 2.0V, but my circuit uses a 5V supply. What resistor value should I use?
A2: You must design for the worst-case (maximum) V_F to ensure the current never exceeds the limit. Using V_{F_max} = 2.4V and I_F = 20mA: R = (5V - 2.4V) / 0.02A = 130 Ohms. The nearest standard value is 130Ω or 150Ω. Using 150Ω gives I_F ≈ (5-2.4)/150 = 17.3mA, which is a safe and common operating point.

Q3: How much will the brightness drop if my device's internal temperature is 60°C?
A3: Referring to the "Relative Intensity vs. Ambient Temperature" curve, at 60°C the relative intensity is approximately 0.8 (or 80%) of its value at 25°C. Therefore, if the LED outputs 400 mcd at 25°C, it will output roughly 320 mcd at 60°C. This must be factored into the optical design.

Q4: Is this LED suitable for automotive applications?
A4: The specified operating temperature range (-40°C to +85°C) covers many automotive environmental requirements. However, automotive applications typically demand components qualified to specific standards (like AEC-Q102) for reliability under vibration, humidity, and extended temperature cycling. This standard datasheet does not indicate such qualification. For automotive use, a specifically qualified product variant should be sought.

9. Technology Introduction and Trends

9.1 Principle of Operation

This LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor where they recombine. This recombination process releases energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, brilliant red around 624-632 nm. The red diffused epoxy resin package serves to protect the chip, act as a primary lens to shape the beam (30° angle), and diffuse the light to reduce glare and create a uniform appearance.

9.2 Industry Trends

The LED industry continues to evolve with several clear trends impacting components like this one:

• Increased Efficiency (lm/W): While this datasheet specifies luminous intensity (mcd), the broader trend is toward higher luminous efficacy, meaning more light output per electrical watt input, reducing energy consumption and thermal load.
• Miniaturization: Packages are constantly getting smaller while maintaining or improving light output.
• Enhanced Reliability and Lifetime: Improvements in chip design, packaging materials (like silicone instead of epoxy for better heat and UV resistance), and manufacturing processes are pushing rated lifetimes well beyond 50,000 hours.
• Stricter Environmental Compliance: The move towards halogen-free, RoHS, and REACH compliance, as seen in this product, is now a baseline requirement, driven by global regulations and consumer demand.
• Smart and Integrated Solutions: The trend is moving from discrete indicator lamps towards integrated LED modules with built-in drivers (ICs) and controllers, enabling dimming, color mixing, and communication protocols like I2C.

While this particular LED represents a mature and well-established technology for standard indicator use, its specifications reflect the ongoing demands for performance, reliability, and environmental responsibility in the electronics component market.