LED Lamp 333-2SYGD/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 2.0V - 60mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness Brilliant Yellow Green LED lamp. The device is designed using AlGaInP chip technology, encapsulated in a green diffused resin, and is intended for applications requiring reliable and robust illumination with various viewing angle options. The product is compliant with relevant environmental standards.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include its high luminous intensity, availability in different colors and intensities, and packaging options such as tape and reel for automated assembly. It is specifically engineered for applications demanding superior brightness. The target markets and typical applications include consumer electronics displays, indicator lights, and backlighting systems for devices like television sets, computer monitors, telephones, and other computing equipment.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the device's key electrical, optical, and thermal parameters as defined under standard test conditions (Ta=25°C).

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

• Continuous Forward Current (IF): 25 mA. Exceeding this current continuously will degrade the LED's lifetime and luminous output.
• Peak Forward Current (IFP): 60 mA. This is the maximum allowable pulsed current, typically specified under a duty cycle of 1/10 at 1 kHz. It is crucial for applications involving brief, high-current pulses.
• Reverse Voltage (VR): 5 V. Applying a reverse bias voltage greater than this value can cause immediate and catastrophic failure of the LED junction.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate without exceeding its maximum junction temperature, calculated as Forward Voltage (VF) multiplied by Forward Current (IF).
• Operating & Storage Temperature: The device is rated for operation from -40°C to +85°C and can be stored from -40°C to +100°C. These ranges ensure mechanical and chemical stability of the epoxy resin and semiconductor materials.
• Soldering Temperature (Tsol): 260°C for 5 seconds. This defines the maximum thermal profile the LED package can withstand during wave or reflow soldering processes.

2.2 Electro-Optical Characteristics

These parameters define the device's performance under normal operating conditions (IF=20mA). The 'Typ.' column represents the expected median value, while 'Min.' and 'Max.' define the acceptable production spread.

• Luminous Intensity (Iv): 40-80 mcd (Typ. 80 mcd). This is the perceived brightness of the LED as measured in millicandelas. The wide range indicates a binning process; designers must account for the minimum value for worst-case brightness scenarios.
• Viewing Angle (2θ1/2): 30 degrees (Typical). This is the full angle at which the luminous intensity drops to half of its peak value (on-axis). A 30-degree angle indicates a relatively focused beam, suitable for directional indicators.
• Peak & Dominant Wavelength (λp, λd): 575 nm and 573 nm respectively. The peak wavelength is the spectral point of maximum radiant power. The dominant wavelength is the perceived color point. The close values indicate a spectrally pure yellow-green emission.
• Spectrum Radiation Bandwidth (Δλ): 20 nm. This is the spectral width at half the maximum intensity (FWHM). A bandwidth of 20 nm is characteristic of AlGaInP-based LEDs, offering good color purity.
• Forward Voltage (VF): 1.7V to 2.4V (Typ. 2.0V). This is the voltage drop across the LED when driven at 20mA. Circuit designs must use current-limiting resistors or drivers sized for the maximum VF to ensure the current does not exceed the maximum rating if the supply voltage is fixed.
• Reverse Current (IR): 10 μA (Max.) at VR=5V. This is the leakage current when the device is reverse-biased. It is typically very low for healthy LEDs.

Measurement Tolerances: The datasheet notes specific uncertainties: ±0.1V for VF, ±10% for Iv, and ±1.0nm for λd. These must be factored into precision design calculations.

3. Binning System Explanation

The provided data implies a binning structure based on key performance parameters to ensure consistency in mass production. While a detailed binning matrix is not fully elaborated, the following can be inferred from the specification tables and label explanations:

• Luminous Intensity / Flux Binning: The Iv range of 40-80 mcd suggests devices are sorted into bins based on their measured output at 20mA. The 'CAT' field on the packing label likely denotes this rank or category.
• Wavelength / Color Binning: The 'HUE' field on the label corresponds to the Dominant Wavelength (λd). Given the typical value is 573 nm, production lots are likely characterized and labeled with their specific dominant wavelength to maintain color consistency within an application.
• Forward Voltage Binning: The VF range of 1.7V to 2.4V indicates that LEDs may also be grouped by their forward voltage characteristics. Matching VF in parallel circuits can help achieve uniform current sharing.

4. Performance Curve Analysis

The typical characteristic curves provide crucial insights into the device's behavior under varying conditions, which are essential for robust circuit and thermal design.

4.1 Relative Intensity vs. Wavelength

This curve graphically represents the spectral power distribution, showing a peak around 575 nm with a FWHM of approximately 20 nm. It confirms the monochromatic nature of the light output, centered in the yellow-green region of the visible spectrum.

4.2 Directivity Pattern

The directivity (or radiation pattern) curve illustrates the spatial distribution of light. The provided 30-degree viewing angle is derived from this pattern. The curve shape is typical of a standard LED lamp with a dome lens, showing a near-Lambertian or slightly focused emission profile.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between current and voltage, typical of a diode. The 'knee' voltage is around 1.8V-2.0V. Beyond this point, a small increase in voltage causes a large increase in current, highlighting the critical need for current regulation, not voltage regulation, when driving LEDs.

4.4 Relative Intensity vs. Forward Current (L-I Curve)

This curve demonstrates the relationship between drive current and light output. It is generally linear within the recommended operating range but will saturate and eventually degrade at very high currents. Operating at the typical 20mA ensures a good balance of efficiency, brightness, and longevity.

4.5 Thermal Characteristics

The curves for Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature (at constant voltage) are critically important. They show that luminous output decreases as ambient temperature increases due to reduced internal quantum efficiency and increased non-radiative recombination. Conversely, for a fixed applied voltage, the forward current will increase with temperature because the diode's forward voltage has a negative temperature coefficient. This creates a potential thermal runaway scenario if not properly managed with a constant-current driver.

5. Mechanical and Packaging Information

5.1 Package Dimensions and Drawing

The datasheet includes a detailed dimensional drawing. Key specifications derived from the drawing and notes include: all dimensions are in millimeters (mm), the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise specified. The drawing defines the lead spacing, body size, and overall shape, which are essential for PCB footprint design (land pattern).

5.2 Polarity Identification

While not explicitly detailed in the provided text, standard LED lamps typically identify the cathode (negative lead) via a flat edge on the lens, a shorter lead, or a marking on the package. The PCB footprint must be designed to match this polarity to ensure correct orientation during assembly.

6. Soldering and Assembly Guidelines

Proper handling is essential to maintain device reliability and performance.

6.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb base to prevent stress cracks.
• Forming must be done before soldering.
• Cut leads at room temperature to avoid thermal shock.
• PCB holes must align perfectly with LED leads to avoid mounting stress.

6.2 Storage Conditions

• Store at ≤30°C and ≤70% Relative Humidity (RH) upon receipt. Shelf life under these conditions is 3 months.
• For longer storage (up to 1 year), use a sealed container with a nitrogen atmosphere and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Process

Critical Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

• Hand Soldering: Iron tip temperature max 300°C (for a 30W max iron), soldering time max 3 seconds.
• Wave/DIP Soldering: Preheat temperature max 100°C (for max 60 seconds). Solder bath temperature max 260°C for a maximum immersion time of 5 seconds.
• A recommended soldering temperature profile is provided, which should be followed to minimize thermal stress.
• Avoid mechanical stress on leads during and immediately after soldering while the device is hot.
• Do not perform dip/hand soldering more than once.
• Cool down gradually from peak soldering temperature; avoid rapid quenching.

6.4 Cleaning

• Clean only if necessary, using isopropyl alcohol at room temperature for ≤1 minute. Air dry.
• Ultrasonic cleaning is strongly discouraged. If absolutely required, extensive pre-qualification is necessary to determine safe power levels and duration, as ultrasonic energy can damage the internal die bonds or the epoxy package.

6.5 Heat Management

Effective thermal management is paramount for LED performance and lifetime. The current must be de-rated appropriately at higher ambient temperatures, as indicated by the de-rating curve referenced in the datasheet. The design must ensure the temperature around the LED body is controlled, typically by using a PCB with adequate thermal relief, thermal vias, or an external heatsink for high-power applications.

6.6 Electrostatic Discharge (ESD) Protection

These LEDs are sensitive to electrostatic discharge. ESD can cause latent damage or immediate failure. Always handle components in an ESD-protected area using grounded wrist straps and conductive mats. Use ESD-safe packaging and equipment during all assembly and handling processes.

7. Packaging and Ordering Information

7.1 Packing Specification

The devices are packed to prevent mechanical and electrostatic damage during shipping and handling.

• Primary Packaging: Anti-electrostatic bags.
• Secondary Packaging: Inner cartons containing 5 bags.
• Tertiary Packaging: Outside cartons containing 10 inner cartons.
• Packing Quantity: Minimum 200 to 500 pieces per bag. Therefore, one outside carton contains between 10,000 and 25,000 pieces (10 inner cartons * 5 bags * 200-500 pcs/bag).

7.2 Label Explanation

The packing label contains several codes for traceability and identification:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Production Number (e.g., 333-2SYGD/S530-E2).
• QTY: Quantity of pieces in the bag.
• CAT: Rank or performance category (likely related to luminous intensity bin).
• HUE: Dominant Wavelength code.
• REF: Reference code.
• LOT No: Manufacturing Lot Number for traceability.

8. Application Suggestions and Design Considerations

8.1 Typical Application Scenarios

This LED is well-suited for:

• Status Indicators: Power, activity, or mode indicators in consumer electronics (TVs, monitors, phones, computers) due to its high brightness and focused viewing angle.
• Backlighting: Edge-lighting for small LCD panels or icon backlighting where uniform, bright illumination is needed.
• Front Panel Displays: Illumination for buttons, switches, or panel meters.

8.2 Critical Design Considerations

• Current Limiting: ALWAYS use a series current-limiting resistor or a constant-current driver. Calculate the resistor value using the maximum forward voltage (2.4V) to ensure current never exceeds 25mA under worst-case conditions (minimum VF). Formula: R = (V_supply - VF_max) / I_desired.
• Thermal Design: Account for the negative effects of temperature on light output and forward voltage. Provide adequate PCB copper area or other means of heat sinking, especially in high ambient temperature environments or enclosed spaces.
• ESD Protection: Incorporate ESD protection diodes on signal lines connected to LED anodes/cathodes that are exposed to user interfaces or external connectors.
• Optical Design: The 30-degree viewing angle provides a relatively narrow beam. For wider illumination, consider using a diffuser lens or selecting an LED with a wider native viewing angle.

9. Technical Comparison and Differentiation

While a direct comparison with specific competitor parts is not provided, this LED's key differentiating features based on its datasheet are:

• Chip Technology: Uses AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material, which is highly efficient for producing amber, yellow, and green light compared to older technologies.
• Brightness: Offers a typical luminous intensity of 80 mcd at 20mA, which is competitive for a standard lamp package in this color.
• Robustness: The datasheet emphasizes reliable and robust construction, with detailed handling and soldering guidelines that suggest a design focused on withstand standard assembly processes.
• Compliance: Stated as Pb-free and RoHS compliant, meeting modern environmental regulations for electronic components.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25 mA. Operating at 30mA exceeds this rating, which will significantly reduce the LED's lifespan, cause rapid lumen depreciation, and may lead to catastrophic thermal failure.

Q2: My power supply is 5V. What value resistor should I use for a 20mA drive current?
A: Use the worst-case (maximum) VF of 2.4V for a safe design. R = (5V - 2.4V) / 0.020A = 130 Ohms. The nearest standard higher value is 150 Ohms. With 150 Ohms, the current would be approximately (5V - 2.0V)/150 = 20mA (using typical VF), which is safe. Always verify power dissipation in the resistor: P = I^2 * R = (0.02^2)*150 = 0.06W, so a standard 1/8W (0.125W) resistor is sufficient.

Q3: Why does the light output get dimmer when my device gets hot?
A: This is a fundamental characteristic of LEDs, as shown in the "Relative Intensity vs. Ambient Temp" curve. The efficiency of the semiconductor material decreases with increasing junction temperature, producing less light for the same amount of electrical current. Improved thermal management in your design can mitigate this effect.

Q4: Can I use ultrasonic cleaning to clean the PCB after soldering these LEDs?
A: It is strongly not recommended. The datasheet states that ultrasonic cleaning can damage the LED depending on power and assembly conditions. If you must use it, you need to conduct thorough pre-qualification tests. Safer alternatives are using isopropyl alcohol with gentle brushing or using no-clean flux that does not require post-solder cleaning.

11. Practical Design and Usage Case Study

Scenario: Designing a cluster of status indicators for a network router.
A designer needs 5 bright, green-yellow indicators for power, internet, Wi-Fi, and two Ethernet ports. They choose this LED for its brightness and color.

• Circuit Design: The router's internal logic supply is 3.3V. Using the max VF of 2.4V and a target current of 18mA (to add margin), the resistor value is (3.3V - 2.4V) / 0.018A = 50 Ohms. A 51-Ohm standard resistor is selected. Power per resistor is (0.018^2)*51 ≈ 0.0165W.
• PCB Layout: The PCB footprint is created exactly per the package dimension drawing. Small thermal relief spokes connect the LED pads to a larger ground plane to help with heat dissipation without making soldering difficult.
• Assembly: The assembler follows the guidelines: uses ESD protection, forms leads (if necessary) before placement, and follows the recommended reflow profile with peak temperature not exceeding 260°C.
• Result: The LEDs provide clear, bright indication with consistent color across all five units, and the product passes reliability testing due to proper thermal and electrical design.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The chip material is AlGaInP. When a forward voltage exceeding the diode's turn-on voltage (approximately 1.7-2.0V) is applied, electrons from the n-type region and holes from the p-type region are injected across the junction. These charge carriers recombine in the active region of the semiconductor. A significant portion of these recombinations are radiative, meaning they release energy in the form of photons (light). The specific wavelength of 573-575 nm (yellow-green) is determined by the bandgap energy of the AlGaInP alloy composition used in the chip's active layer. The green diffused epoxy resin package serves to protect the chip, act as a primary lens to shape the light output beam, and diffuse the light to create a more uniform appearance.

13. Technology Trends and Context

This component represents a mature, mainstream technology for monochromatic indicator LEDs. AlGaInP-based LEDs are the standard for high-efficiency red, amber, and yellow-green emission. Current industry trends relevant to such devices include:

• Increased Efficiency: Ongoing research aims to improve the internal quantum efficiency (IQE) and light extraction efficiency (LEE) of these materials, leading to higher luminous intensity for the same input current or the same brightness at lower power.
• Miniaturization: While this is a standard lamp package, the broader trend is towards smaller surface-mount device (SMD) packages (e.g., 0402, 0201) for high-density PCB designs, though often at a trade-off with total light output and heat dissipation capability.
• Enhanced Reliability: Improvements in epoxy resin formulations, die attach materials, and wire bonding techniques continue to push the operational lifetime and temperature tolerance of LEDs.
• Smart Integration: A macro-trend in lighting is the integration of control circuitry (drivers, communication) directly with LED packages, creating "smart" components. While this specific part is a discrete, dumb LED, understanding its basic parameters is foundational for working with more integrated solutions.