LED Lamp 383-2SYGD/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 2.0V - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness Brilliant Yellow Green LED lamp. The device is part of a series engineered for applications demanding superior luminous output and reliability. It utilizes AlGaInP chip technology encapsulated in a green diffused resin, delivering a distinct and vibrant yellow-green emission.

The core advantages of this LED include its robust construction, compliance with major environmental regulations (RoHS, REACH, Halogen-Free), and availability in various packaging options such as tape and reel for automated assembly. It is designed for integration into a wide range of consumer and industrial electronic products where consistent, bright indicator lighting is required.

The target market encompasses manufacturers of display panels, communication devices, and computing equipment, where component reliability and optical performance are critical.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied to the LED.
• Peak Forward Current (IFP): 60 mA. This pulsed current rating (at 1/10 duty cycle, 1 kHz) allows for brief periods of higher intensity, useful for multiplexing or strobe effects.
• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Power Dissipation (Pd): 60 mW. The maximum power the package can dissipate as heat, calculated as VF * IF.
• Operating & Storage Temperature: Ranges from -40°C to +85°C (operating) and -40°C to +100°C (storage). This wide range ensures functionality in harsh environments.
• Soldering Temperature (Tsol): 260°C for 5 seconds. This defines the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and IF=20mA, providing the baseline performance data.

• Luminous Intensity (Iv): 40 (Min), 80 (Typ) mcd. This specifies the perceived brightness of the LED to the human eye. The typical value of 80 mcd indicates a bright output suitable for indicator applications.
• Viewing Angle (2θ1/2): 25° (Typ). This narrow viewing angle concentrates the light output into a more directed beam, ideal for applications requiring a focused spot of light.
• Peak Wavelength (λp): 575 nm (Typ). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): 573 nm (Typ). The single wavelength perceived by the human eye, defining the "Brilliant Yellow Green" color.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (Typ). The range of wavelengths emitted, indicating a relatively pure color.
• Forward Voltage (VF): 1.7 (Min), 2.0 (Typ), 2.4 (Max) V. The voltage drop across the LED when operating at 20mA. This is crucial for circuit design and current-limiting resistor calculation.
• Reverse Current (IR): 10 μA (Max) at VR=5V. Specifies the leakage current under reverse bias.

Measurement uncertainties are provided for key parameters: Luminous Intensity (±10%), Dominant Wavelength (±1.0nm), and Forward Voltage (±0.1V), which are important for quality control and design margin analysis.

3. Performance Curve Analysis

The datasheet includes several characteristic curves that illustrate device behavior under varying conditions. These are essential for understanding performance beyond the standard test point.

3.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution. The peak is centered around 575 nm with a typical bandwidth (FWHM) of 20 nm, confirming the yellow-green color point. The shape is characteristic of AlGaInP semiconductor material.

3.2 Directivity Pattern

The radiation pattern plot visualizes the 25° viewing angle. Intensity is highest at 0° (on-axis) and decreases to half at approximately ±12.5° off-axis, defining the 2θ1/2 angle.

3.3 Forward Current vs. Forward Voltage (IV Curve)

This graph shows the exponential relationship between current (I) and voltage (V) for a diode. The curve allows designers to determine the VF at currents other than 20mA. The typical VF of 2.0V at 20mA is visible on this plot.

3.4 Relative Intensity vs. Forward Current

This curve demonstrates that light output (intensity) is approximately linear with forward current within the operating range. It confirms that driving the LED at its maximum continuous current (25mA) will yield higher brightness than at the test current of 20mA.

3.5 Thermal Performance Curves

Two key graphs relate performance to ambient temperature (Ta): Relative Intensity vs. Ambient Temp: Shows that luminous output decreases as temperature increases. This de-rating is critical for applications in high-temperature environments; the LED will be less bright when hot. Forward Current vs. Ambient Temp: Illustrates how the forward voltage (VF) changes with temperature for a given current. Typically, VF has a negative temperature coefficient for LEDs, meaning it decreases slightly as temperature rises.

4. Mechanical & Package Information

4.1 Package Dimensions

The mechanical drawing provides critical dimensions for PCB footprint design and assembly. Key specifications include: - All dimensions are in millimeters. - The flange height must be less than 1.5mm (0.059\"). - A general tolerance of ±0.25mm applies unless otherwise specified. The drawing details the lead spacing, body size, and recommended land pattern for soldering, ensuring proper mechanical fit and thermal management.

4.2 Polarity Identification

The cathode (negative) lead is typically indicated by a flat spot on the LED lens, a shorter lead, or a marking on the package. Correct polarity must be observed during installation to prevent reverse bias damage.

5. Soldering & Assembly Guidelines

Proper handling is crucial for reliability. Detailed instructions are provided:

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package; stress can crack the epoxy or damage the die.
• Cut leads at room temperature.
• Ensure PCB holes align perfectly with LED leads to avoid mounting stress.

5.2 Storage

• Store at ≤30°C and ≤70% RH. Shelf life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.3 Soldering Process

General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: - Iron tip temperature: Max 300°C (for a 30W max iron). - Soldering time: Max 3 seconds per lead.

Wave/DIP Soldering: - Preheat temperature: Max 100°C (for max 60 seconds). - Solder bath temperature & time: Max 260°C for 5 seconds. - A recommended soldering profile graph is provided, showing the ideal temperature vs. time curve through preheat, soak, reflow, and cooling zones.

Critical Notes: - Avoid stress on leads during high-temperature phases. - Do not solder (dip or hand) more than once. - Protect the LED from shock/vibration until it cools to room temperature after soldering. - Avoid rapid cooling processes. - Always use the lowest effective temperature.

5.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Air dry at room temperature.
• Avoid ultrasonic cleaning unless absolutely necessary and pre-qualified, as it can damage the LED die or bonds.

5.5 Heat Management

Effective thermal design is essential for longevity and performance maintenance. - Consider heat sinking during the application design phase. - De-rate the operating current appropriately based on the ambient temperature, referring to the de-rating curve (implied by the performance graphs). - Control the temperature around the LED in the final application.

5.6 ESD (Electrostatic Discharge) Protection

The LED is sensitive to electrostatic discharge and voltage surges, which can damage the semiconductor die. Standard ESD handling precautions must be observed during all assembly and handling processes. Use grounded workstations, wrist straps, and conductive containers.

6. Packaging & Ordering Information

6.1 Packing Specification

The LEDs are packaged to ensure protection during shipping and handling: - Primary Packing: Anti-electrostatic bags (min. 200 to 500 pieces per bag). - Secondary Packing: 5 bags are placed into one inner carton. - Tertiary Packing: 10 inner cartons are packed into one master outside carton. This multi-level packing protects against moisture, static, and physical damage.

6.2 Label Explanation

Labels on the packaging contain key information for traceability and identification: - CPN: Customer's Production Number. - P/N: Manufacturer's Production Number (e.g., 383-2SYGD/S530-E2). - QTY: Packing Quantity. - CAT: Ranks/Bin for Luminous Intensity. - HUE: Ranks/Bin for Dominant Wavelength. - REF: Ranks/Bin for Forward Voltage. - LOT No: Manufacturing Lot Number for traceability.

7. Application Suggestions

7.1 Typical Application Scenarios

As listed in the datasheet, this LED is suitable for: - TV Sets & Monitors: Used as status indicators, backlighting for buttons, or decorative lighting. - Telephones: Call status indicators, message waiting lights, or keypad backlighting. - Computers: Power-on indicators, hard drive activity lights, or decorative accents on peripherals. Its high brightness and reliable performance make it ideal for consumer electronics where long life and consistent color are important.

7.2 Design Considerations

• Current Limiting: Always use a series resistor or constant current driver to limit the forward current to the desired value (e.g., 20mA). Calculate the resistor value using R = (Vsupply - VF) / IF.
• Thermal Design: Ensure adequate PCB copper area or other heat sinking if operating near maximum ratings or in high ambient temperatures.
• Optical Design: The 25° viewing angle provides a focused beam. For wider illumination, consider using a diffuser lens or selecting an LED with a wider viewing angle.
• ESD Protection: In sensitive applications, consider adding transient voltage suppression (TVS) diodes or other protection on the LED lines.

8. Technical Comparison & Differentiation

While a direct side-by-side comparison with other products is not provided in this single datasheet, key differentiating features of this LED can be inferred: - Chip Technology: Uses AlGaInP (Aluminum Gallium Indium Phosphide), which is known for high efficiency in the yellow, orange, and red spectrum regions, compared to InGaN used for blue and green.Environmental Compliance: Full compliance with RoHS, REACH, and Halogen-Free standards (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm) is a significant advantage for products targeting global markets with strict regulations. - Narrow Viewing Angle: The 25° angle is narrower than many standard LEDs (which are often 30-60°), offering a more directed light output suitable for specific indicator applications.Detailed Handling Instructions: The comprehensive guidelines for soldering, storage, and ESD go beyond basic specs, indicating a design focus on reliability and manufacturability.

9. Frequently Asked Questions (Based on Technical Parameters)

Q1: What resistor value should I use with a 5V supply to drive this LED at 20mA? A1: Using the typical VF of 2.0V: R = (5V - 2.0V) / 0.020A = 150 Ohms. Use the nearest standard value (e.g., 150Ω or 160Ω). Always calculate using the maximum VF (2.4V) to ensure sufficient current limiting under worst-case conditions: R_min = (5V - 2.4V) / 0.020A = 130 Ohms.

Q2: Can I drive this LED at its maximum continuous current of 25mA? A2: Yes, but you must ensure proper heat dissipation. The luminous intensity will be higher than at 20mA (see Relative Intensity vs. Current curve), but the forward voltage will also be slightly higher, and the device will run hotter. De-rating may be necessary in high ambient temperatures.

Q3: The dominant wavelength is 573nm. Will all units be exactly this color? A3: No. The 573nm is a typical value. There is a manufacturing tolerance, and LEDs are often binned into HUE ranks. The measurement uncertainty is ±1.0nm. For consistent color across multiple LEDs in one product, specify or select units from the same HUE bin.

Q4: Why is the soldering distance (3mm from the bulb) so important? A4: This prevents excessive heat from traveling up the lead and into the epoxy bulb during soldering. Excessive heat can cause thermal stress, cracking the epoxy, degrading the internal die attach, or discoloring the lens, which reduces light output.

10. Practical Design & Usage Case

Case: Designing a Status Indicator Panel for a Network Router A designer needs multiple bright, reliable status LEDs (Power, Internet, Wi-Fi, LAN ports) on a router that will be used in various home environments. Selection Rationale: This Brilliant Yellow Green LED is chosen for its high typical intensity (80 mcd), ensuring visibility even in well-lit rooms. Its compliance with environmental regulations is mandatory for the global market. The availability on tape and reel supports high-volume automated PCB assembly. Implementation: The LEDs are driven at 18mA (slightly below the 20mA test point for margin) via a GPIO pin on the main microcontroller with a series resistor. The PCB layout provides a small thermal relief pad connected to a ground plane for heat dissipation. The 25° viewing angle is perfect as the LEDs are mounted behind small, clear apertures on the router's front panel, creating a crisp, bright dot of light for each status. The detailed soldering profile from the datasheet is programmed into the pick-and-place and reflow oven equipment to ensure a high-yield, reliable manufacturing process.

11. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of AlGaInP (Aluminum Gallium Indium Phosphide) layers. When a forward voltage exceeding the junction's built-in potential (approximately 2.0V) is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. Here, they recombine, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, yellow-green at around 573-575 nm. The green diffused resin encapsulant serves to protect the delicate semiconductor die, shape the radiation pattern to a 25° viewing angle, and diffuse the light slightly to improve viewing homogeneity.

12. Technology Trends

LED technology continues to evolve, with general trends impacting devices like this one: - Increased Efficiency: Ongoing material science and chip design improvements lead to higher luminous efficacy (more light output per electrical watt), allowing for either brighter indicators or lower power consumption. - Miniaturization: The drive for smaller electronic devices pushes for LEDs in ever-smaller packages while maintaining or improving optical performance. - Enhanced Reliability & Lifetime: Improvements in packaging materials, die attach methods, and phosphor technology (for white LEDs) continue to extend operational lifetimes and reliability under harsh conditions. - Intelligent Integration: A trend towards LEDs with built-in control ICs (like addressable RGB LEDs) exists, though for simple indicator lamps like this one, the focus remains on cost-effective, high-performance discrete components. - Stricter Environmental Standards: Compliance with regulations like RoHS and REACH is now a baseline requirement. The halogen-free specification highlighted in this datasheet is part of this trend towards eliminating hazardous substances from the electronics supply chain.