LED Lamp 204-10SYGC/S530-E2 Datasheet - 5mm Round - Voltage 2.0V - Brilliant Yellow Green - 60mW - English Technical Document

1. Product Overview

The 204-10SYGC/S530-E2 is a high-brightness, through-hole LED lamp designed for applications requiring reliable and robust illumination. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to produce a Brilliant Yellow Green light output. The device is housed in a standard 5mm round, water-clear epoxy resin package, offering a compact and versatile solution for various indicator and backlighting applications.

This LED series is engineered to deliver consistent performance with a choice of viewing angles. It is compliant with major environmental and safety standards, including RoHS (Restriction of Hazardous Substances), EU REACH regulation, and is manufactured as a Halogen-Free component, ensuring its suitability for modern electronic designs with stringent material requirements.

1.1 Core Advantages and Target Market

The primary advantages of this LED lamp include its high luminous intensity, reliable construction, and broad environmental compliance. Its robust design makes it suitable for applications where long-term reliability is critical. The product is available on tape and reel for automated assembly processes, enhancing manufacturing efficiency.

The target applications for this device are primarily in consumer and industrial electronics where clear, bright indication is needed. Typical use cases include status indicators, backlighting for buttons or panels, and general-purpose illumination in compact spaces. Its specifications make it a suitable choice for cost-effective yet reliable lighting solutions.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key technical parameters specified in the datasheet. Understanding these values is crucial for proper circuit design and ensuring the LED operates within its safe operating area (SOA).

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current that can be continuously applied to the LED under specified ambient conditions (T_a=25°C). Exceeding this value will generate excessive heat, potentially degrading the semiconductor junction and reducing lifespan.
• Peak Forward Current (I_FP): 60 mA. This rating applies to pulsed operation with a duty cycle of 1/10 at 1 kHz. It allows for brief periods of higher current, which can be useful for achieving higher instantaneous brightness in multiplexed or pulsed applications.
• Reverse Voltage (V_R): 5 V. The LED can withstand a maximum of 5 volts in the reverse-biased direction. Applying a higher reverse voltage can cause junction breakdown and catastrophic failure. Circuit designs should include protection, such as a series resistor or a parallel protection diode, if reverse voltage conditions are possible.
• Power Dissipation (P_d): 60 mW. This is the maximum total power (V_F * I_F) the package can dissipate without exceeding its maximum junction temperature. Proper heat sinking or current derating at higher ambient temperatures is necessary to stay within this limit.
• Operating & Storage Temperature: The device is rated for operation from -40°C to +85°C and can be stored from -40°C to +100°C. This wide range ensures functionality in harsh environments.
• Soldering Temperature: 260°C for 5 seconds. This defines the maximum thermal profile the LED can endure during wave or hand soldering processes without damaging the internal bonds or the epoxy lens.

2.2 Electro-Optical Characteristics

These parameters, measured at a standard test current of 20 mA and an ambient temperature of 25°C, define the optical and electrical performance of the LED.

• Luminous Intensity (I_v): 125 mcd (Min), 250 mcd (Typ). This specifies the amount of visible light emitted in a given direction. The typical value of 250 millicandelas indicates a bright output suitable for many indicator applications. The minimum guaranteed value is 125 mcd, which is important for design consistency.
• Viewing Angle (2θ_1/2): 20° (Typ). This is the full angle at which the luminous intensity is half of the peak intensity (measured on-axis). A 20° viewing angle indicates a relatively narrow beam, concentrating light in a forward direction. This is ideal for applications requiring a directed light source rather than wide-area illumination.
• Peak Wavelength (λ_p): 575 nm (Typ). This is the wavelength at which the spectral power distribution of the emitted light is maximum. For a Brilliant Yellow Green LED, this falls in the yellow-green region of the visible spectrum.
• Dominant Wavelength (λ_d): 573 nm (Typ). This is the single wavelength perceived by the human eye that matches the color of the LED light. It is the primary parameter for color specification.
• Forward Voltage (V_F): 1.7 V (Min), 2.0 V (Typ), 2.4 V (Max) at I_F=20mA. This is the voltage drop across the LED when forward-biased and conducting current. The typical value of 2.0V is critical for calculating the current-limiting resistor value in a series circuit: R = (V_supply - V_F) / I_F. Designing for the maximum V_F ensures sufficient current drive under all conditions.
• Reverse Current (I_R): 10 μA (Max) at V_R=5V. This is the small leakage current that flows when the diode is reverse-biased within its maximum rating.

Measurement Uncertainties: The datasheet notes specific tolerances for key measurements: ±0.1V for V_F, ±10% for I_v, and ±1.0nm for λ_d. These must be considered in precision applications.

3. Performance Curve Analysis

The provided characteristic curves offer valuable insights into the LED's behavior under varying conditions, which is essential for robust system design.

3.1 Relative Intensity vs. Wavelength

This spectral distribution curve shows the light output as a function of wavelength. For an AlGaInP-based yellow-green LED, the spectrum is typically a single, relatively narrow peak centered around the dominant wavelength (573 nm typ). The full width at half maximum (FWHM), indicated by the spectrum radiation bandwidth (Δλ) of 20 nm typ, defines the color purity. A narrower bandwidth indicates a more saturated, pure color.

3.2 Directivity Pattern

The directivity (or radiation pattern) curve illustrates how light intensity varies with angle from the central axis. For a LED with a 20° viewing angle, this curve will show a sharp drop in intensity beyond approximately ±10° from the center. This pattern is influenced by the shape of the epoxy lens and the position of the chip within the package.

3.3 Forward Current vs. Forward Voltage (I-V Curve)

This fundamental curve demonstrates the exponential relationship between current and voltage in a semiconductor diode. For LEDs, the "turn-on" or "knee" voltage is clearly visible. Operating significantly above this knee voltage results in a rapid increase in current for a small increase in voltage. This highlights the critical importance of using a current-limiting mechanism (almost always a series resistor for simple circuits) rather than attempting to drive an LED with a constant voltage source alone.

3.4 Relative Intensity vs. Forward Current

This curve shows that light output (luminous intensity) is generally proportional to forward current, but the relationship is not perfectly linear, especially at higher currents. Efficiency (light output per unit of electrical input) may decrease at very high currents due to increased heat generation and other non-ideal effects. It is important to operate within the recommended current range for optimal efficiency and longevity.

3.5 Thermal Characteristics

The curves for Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature are crucial for thermal management.

• Intensity vs. Temperature: Typically, the luminous output of an LED decreases as the junction temperature increases. This curve quantifies that derating. For reliable performance in high-temperature environments, the drive current may need to be reduced to compensate for this drop in efficiency and to prevent thermal runaway.
• Forward Voltage vs. Temperature: The forward voltage of an LED has a negative temperature coefficient; it decreases as temperature increases. This can have implications for constant-voltage drive circuits, as a lower V_F at high temperature could lead to an increase in current if not properly regulated.

4. Mechanical and Package Information

4.1 Package Dimensions

The LED is housed in a standard 5mm round radial-leaded package. Key dimensional notes from the datasheet include:

• All dimensions are in millimeters.
• The height of the flange (the rim at the base of the dome) must be less than 1.5mm (0.059"). This is important for clearance during PCB mounting.
• The general tolerance for unspecified dimensions is ±0.25mm, which is standard for this type of component.

The dimensional drawing provides precise measurements for the lead spacing, body diameter, lens height, and lead length and diameter. These are critical for PCB footprint design, ensuring proper fit in the mounting holes and correct positioning of the lens relative to the panel or diffuser.

4.2 Polarity Identification

For radial-leaded LEDs, the cathode is typically identified by a flat spot on the rim of the plastic flange and/or by the shorter lead length. The datasheet diagram should clearly indicate which lead is the cathode (usually the one marked with the flat edge). Correct polarity is essential for device operation.

5. Soldering and Assembly Guidelines

Adhering to these guidelines is paramount to ensuring the reliability and longevity of the LED after assembly.

5.1 Lead Forming

• Bending must occur at a point at least 3mm from the base of the epoxy bulb to avoid transferring stress to the internal wire bonds.
• Forming must be done before soldering, while the leads and package are at room temperature.
• Excessive stress during forming can crack the epoxy or damage the internal die attachment.
• PCB holes must align perfectly with the LED leads to avoid mounting stress.

5.2 Soldering Process

The datasheet provides specific recommendations for both hand and dip soldering:

• Hand Soldering: Iron tip temperature maximum 300°C (for a 30W max iron), soldering time maximum 3 seconds per lead. Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
• Dip (Wave) Soldering: Preheat temperature maximum 100°C for up to 60 seconds. Solder bath temperature maximum 260°C for a maximum immersion time of 5 seconds. Again, maintain 3mm clearance from the bulb.
• A recommended soldering profile graph typically shows a gradual temperature ramp-up, a controlled time above liquidus, and a controlled cooldown. Rapid thermal cycling should be avoided.
• Critical Rule: Dip or hand soldering should be performed only once. Repeated heating significantly increases the risk of failure.
• After soldering, the LED must be protected from mechanical shock or vibration until it returns to room temperature to prevent stress on the hot, softened epoxy and internal bonds.

5.3 Storage Conditions

LEDs are moisture-sensitive devices. The recommended storage after shipment is at 30°C or less and 70% relative humidity or less, with a shelf life of 3 months. For longer storage (up to one year), they should be kept in a sealed container with a nitrogen atmosphere and desiccant. Rapid temperature changes in humid environments must be avoided to prevent condensation inside the package.

5.4 Cleaning

If cleaning is necessary after soldering, use only isopropyl alcohol at room temperature for no more than one minute. Ultrasonic cleaning is strongly discouraged as the high-frequency vibrations can fracture the delicate wire bonds inside the package. If absolutely required, the process must be carefully qualified beforehand.

6. Heat and ESD Management

6.1 Heat Management

Effective thermal management is the key to LED reliability and stable light output. The current must be derated appropriately at higher ambient temperatures, as indicated by the de-rating curve. The temperature surrounding the LED in the final application must be controlled. This often involves considering PCB layout (copper area for heat spreading), ambient airflow, and potentially the use of heatsinks for high-power or high-density applications.

6.2 ESD (Electrostatic Discharge) Protection

The semiconductor die is highly sensitive to electrostatic discharge. ESD events can cause immediate failure or latent damage that reduces long-term reliability. Proper ESD handling procedures must be followed during all stages of production, assembly, and handling. This includes the use of grounded workstations, wrist straps, and conductive containers. The packing materials specified (anti-electrostatic bags) are designed to protect the devices during transport and storage.

7. Packaging and Ordering Information

7.1 Packing Specification

The LEDs are packaged to ensure protection from moisture, electrostatic discharge, and physical damage:

• Primary Packing: A minimum of 200-1000 pieces are packed in one anti-electrostatic bag.
• Secondary Packing: Four bags are placed into one inner carton.
• Tertiary Packing: Ten inner cartons are packed into one master outside carton for shipment.

7.2 Label Explanation

The packing labels contain several codes for traceability and identification:

• CPN: Customer's Production Number.
• P/N: Manufacturer's Production Number (the part number).
• QTY: Packing Quantity within the bag/carton.
• CAT / Ranks: May indicate performance bins (e.g., for luminous intensity or wavelength).
• HUE: Dominant Wavelength value for that specific batch.
• LOT No: Lot Number for full manufacturing traceability.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

The most basic and common drive circuit for a single LED is a series current-limiting resistor. The resistor value is calculated as: R = (V_supply - V_F) / I_F. For example, with a 5V supply, a typical V_F of 2.0V, and a desired I_F of 20mA: R = (5V - 2.0V) / 0.020A = 150 Ω. The power rating of the resistor should be at least P = I_F² * R = (0.02)² * 150 = 0.06W, so a standard 1/8W (0.125W) or 1/4W resistor is sufficient.

For driving multiple LEDs, they are typically connected in series (if the supply voltage is high enough to overcome the sum of V_Fs) with a single resistor, or in parallel each with its own series resistor. Parallel connection without individual resistors is not recommended due to V_F variation between LEDs, which can cause uneven current sharing and brightness.

8.2 Design Considerations

• Current Drive: Always design for a constant or well-regulated current, not voltage.
• Thermal Design: Consider the ambient temperature and provide adequate thermal relief on the PCB, especially if driving near the maximum continuous current.
• Optical Design: The 20° viewing angle creates a focused beam. For wider illumination, a diffuser lens or reflector may be needed. The water-clear lens provides the highest light transmission.
• Reverse Voltage Protection: In circuits where reverse voltage is possible (e.g., AC coupling, inductive loads), include a protection diode in parallel with the LED (cathode to anode) to clamp reverse voltage to a safe level (~0.7V).

9. Technical Comparison and Differentiation

Compared to older technology like GaP (Gallium Phosphide) based green LEDs, this AlGaInP device offers significantly higher brightness and efficiency for a given current. The Brilliant Yellow Green color is often more visually distinct and vibrant than standard green.

Within its own category of 5mm round LEDs, its key differentiators are its specific combination of high typical luminous intensity (250 mcd), narrow viewing angle (20°), and full compliance with modern environmental standards (RoHS, REACH, Halogen-Free). The detailed and conservative maximum ratings and handling guidelines also indicate a design focused on robustness and reliability in demanding applications.

10. Frequently Asked Questions (FAQ)

Q: Can I drive this LED with a 3.3V supply?
A: Yes. Using the formula R = (3.3V - 2.0V) / 0.020A = 65 Ω. A 68 Ω standard resistor value would give I_F ≈ 19.1 mA, which is acceptable.

Q: Why is the soldering distance (3mm from the bulb) so important?
A: Heat travels up the metal leads. If solder is applied too close to the epoxy bulb, the excessive heat can soften or crack the epoxy, damage the internal seal, or re-melt the internal wire bonds, leading to immediate or intermittent failure.

Q: The datasheet shows a typical intensity of 250 mcd. What does the minimum of 125 mcd mean for my design?
A: You must design your optical system (e.g., brightness required behind a diffuser) based on the minimum guaranteed value (125 mcd) to ensure all units in your production run meet the requirement. The typical value is what most units will achieve, but there is natural variation.

Q: Can I use this LED outdoors?
A: The operating temperature range (-40°C to +85°C) allows for outdoor use in terms of temperature. However, the epoxy package may be susceptible to UV degradation and moisture ingress over very long periods if not properly encapsulated or protected. For harsh outdoor environments, LEDs specifically rated for such conditions (often with silicone lenses) are recommended.

11. Practical Application Example

Scenario: Designing a status indicator panel for industrial equipment. The panel has multiple indicators showing power, fault, and standby status. Space is limited, and indicators need to be visible in brightly lit environments.

Design Choice: The 204-10SYGC/S530-E2 LED is selected for the "Standby" indicator due to its bright yellow-green color, which is distinct from red (fault) and green (power on). Its 20° viewing angle ensures the light is directed towards the operator's line of sight without excessive spill, improving contrast. The LED is driven at 15 mA (below the 20mA test current) via a current-limiting resistor from the equipment's 24V DC rail. This lower current increases longevity and reduces heat. The PCB footprint is designed exactly per the package dimensions, with 0.8mm holes for the leads. During assembly, a dedicated soldering fixture ensures the 3mm clearance rule is maintained during wave soldering. The final assembly passes a 48-hour burn-in test to screen for early failures.

12. Operating Principle

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. The 204-10SYGC/S530-E2 uses an AlGaInP (Aluminum Gallium Indium Phosphide) compound semiconductor. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers (electrons and holes) recombine, they release energy. In this specific material system, the energy bandgap is such that the released energy corresponds to a photon in the yellow-green wavelength range (~573 nm). The water-clear epoxy resin package serves as a lens, shaping the light output beam and protecting the delicate semiconductor chip.

13. Technology Trends

While through-hole LEDs like the 5mm round package remain popular for prototyping, educational use, and certain industrial applications, the overall industry trend has shifted significantly towards surface-mount device (SMD) packages (e.g., 0603, 0805, 2835, 5050). SMD LEDs offer advantages in automated assembly, board space savings, and often better thermal performance due to a lower profile and direct connection to the PCB pad acting as a heatsink.

Furthermore, the efficiency (lumens per watt) of LED technology continues to improve across all color ranges due to advancements in epitaxial growth, chip design, and package extraction efficiency. For indicator applications, the focus is often on reliability, color consistency, and cost-effectiveness rather than pushing absolute efficiency limits. Compliance with evolving environmental regulations (like Halogen-Free requirements) remains a key driver for component updates and new product introductions.