LED Lamp 484-10SYGT/S530-E2 Datasheet - Brilliant Yellow Green - 20mA - 12.5mcd - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a high-brightness Brilliant Yellow Green LED lamp. The device is designed using AlGaInP chip technology, encapsulated in a green transparent resin, to deliver superior luminous performance for a variety of indicator and backlighting applications. Its core advantages include a choice of viewing angles, availability on tape and reel for automated assembly, and compliance with major environmental and safety standards including RoHS, REACH, and Halogen-Free requirements.

1.1 Target Market & Applications

This LED is engineered for applications demanding reliable and consistent light output. Typical application areas include status indicators and backlighting in consumer electronics and computing devices. Specific applications mentioned are TV sets, computer monitors, telephones, and general computer peripherals.

2. Absolute Maximum Ratings

The device's operational limits must not be exceeded to ensure reliability and prevent permanent damage. All ratings are specified at an ambient temperature (Ta) of 25°C.

• Continuous Forward Current (IF): 25 mA
• Peak Forward Current (IFP): 60 mA (at 1/10 duty cycle, 1 kHz)
• Reverse Voltage (VR): 5 V
• Power Dissipation (Pd): 60 mW
• Operating Temperature Range (Topr): -40°C to +85°C
• Storage Temperature Range (Tstg): -40°C to +100°C
• Soldering Temperature (Tsol): 260°C for 5 seconds (wave or reflow)

3. Electro-Optical Characteristics

The key performance parameters are measured under standard test conditions (Ta=25°C, IF=20mA) unless otherwise stated. These define the light output, color, and electrical behavior of the LED.

3.1 Luminous & Color Metrics

• Luminous Intensity (Iv): Typical value is 12.5 millicandelas (mcd), with a minimum of 6.3 mcd.
• Viewing Angle (2θ1/2): The half-intensity angle is typically 80 degrees, defining the beam spread.
• Peak Wavelength (λp): Typically 575 nanometers (nm).
• Dominant Wavelength (λd): Typically 573 nm, which is the perceived color.
• Spectrum Radiation Bandwidth (Δλ): Typically 15 nm, indicating the spectral purity.

3.2 Electrical Parameters

• Forward Voltage (VF): Ranges from 1.7V (Min) to 2.4V (Max), with a typical value of 2.0V at 20mA.
• Reverse Current (IR): Maximum of 10 μA when a reverse voltage of 5V is applied.

Note: Measurement uncertainties are provided for forward voltage (±0.1V), luminous intensity (±10%), and dominant wavelength (±1.0nm).

4. Performance Curve Analysis

The datasheet includes several characteristic graphs that illustrate device behavior under varying conditions. These are essential for circuit design and thermal management.

4.1 Spectral & Spatial Distribution

The Relative Intensity vs. Wavelength curve shows the emission spectrum centered around 575nm. The Directivity pattern graph visually represents the 80-degree viewing angle, showing how light intensity decreases from the center axis.

4.2 Current-Voltage Relationship

The Forward Current vs. Forward Voltage (IV Curve) graph is non-linear, typical for diodes. It shows the voltage rise with increasing current, crucial for designing current-limiting circuitry. The Relative Intensity vs. Forward Current curve demonstrates that light output increases with current but may not be perfectly linear, especially as thermal effects become significant.

4.3 Temperature Dependence

The Relative Intensity vs. Ambient Temperature curve shows that light output decreases as the ambient temperature increases, a critical factor for high-temperature applications. The Forward Current vs. Ambient Temperature graph (likely under constant voltage or power) may illustrate how device characteristics shift with temperature, affecting drive conditions.

5. Mechanical & Package Information

5.1 Package Dimensions

A detailed dimensional drawing is provided. Key notes include: all dimensions are in millimeters; the flange height must be less than 1.5mm; and the general tolerance is ±0.25mm unless otherwise specified. Engineers must refer to this drawing for PCB footprint design and clearance checks.

5.2 Polarity Identification

The cathode (negative) lead is typically indicated by a flat spot on the lens, a shorter lead, or other marking as shown in the package diagram. Correct polarity must be observed during assembly.

6. Binning & Ordering Information

The product uses a grading system for key parameters to ensure consistency within a batch. The label on the packaging indicates these grades.

• CAT: Ranks of Luminous Intensity.
• HUE: Ranks of Dominant Wavelength (color).
• REF: Ranks of Forward Voltage.

Other label fields include Customer's Production Number (CPN), Production Number (P/N), Packing Quantity (QTY), and Lot Number (LOT No).

7. Packaging Specification

The LEDs are packed to prevent damage from electrostatic discharge (ESD) and moisture.

• Primary Packing: Anti-electrostatic bag.
• Secondary Packing: Inner carton containing 5 bags.
• Tertiary Packing: Outside carton containing 10 inner cartons.
• Packing Quantity: Minimum 200 to 1000 pieces per bag. Therefore, one outside carton contains between 10,000 and 50,000 pieces (10 inner cartons * 5 bags * 200-1000 pcs).

8. Assembly, Soldering & Handling Guidelines

8.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Misaligned PCB holes can cause stress and degrade performance.
• Cut leads at room temperature.

8.2 Storage

• Store at ≤30°C and ≤70% Relative Humidity upon receipt. Shelf life is 3 months under these conditions.
• For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

8.3 Soldering Process

Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.

Hand Soldering: Iron tip temperature max 300°C (for 30W max iron), soldering time max 3 seconds.
Dip/Wave Soldering: Preheat temperature max 100°C (for max 60 sec), solder bath temperature max 260°C for max 5 seconds.

A recommended soldering temperature profile is provided, emphasizing preheat, a controlled time above liquidus, and a controlled cooldown rate. Avoid laminar wave fluxing and rapid cooling. Soldering (dip or hand) should be performed only once. Avoid stress on leads while hot, and protect the LED from shock until it cools to room temperature.

8.4 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Do not use ultrasonic cleaning unless absolutely necessary and pre-qualified, as it can damage the LED.

8.5 Heat Management

Adequate heat sinking must be considered during the application design phase. The operating current and ambient temperature directly affect junction temperature, which in turn impacts luminous output and long-term reliability. The derating curves provided are essential for determining safe operating conditions.

9. Application Notes & Design Considerations

9.1 Circuit Design

Always drive the LED with a constant current source or a current-limiting resistor in series with a voltage supply. Calculate the resistor value using the typical forward voltage (2.0V) and the desired current (≤20mA for normal operation), factoring in the power supply voltage. For example: R = (V_supply - VF_LED) / I_desired. Ensure the resistor's power rating is sufficient.

9.2 PCB Layout

Follow the recommended package footprint precisely. Ensure adequate thermal relief if the LED is to be driven at or near its maximum ratings. Keep sensitive analog or RF circuitry away from the LED drive lines to avoid noise injection.

9.3 Optical Integration

The 80-degree viewing angle is suitable for wide-area illumination. For more focused light, external lenses or light guides may be required. The green transparent resin color is part of the optical system and should not be painted over.

10. Technical Comparison & Differentiation

This AlGaInP-based yellow-green LED offers distinct advantages. Compared to older technologies, AlGaInP provides higher efficiency and brightness. The specific wavelength (573nm dominant) is in a region of high human eye sensitivity (photopic response), making it appear very bright at relatively low radiant power. Compliance with Halogen-Free and REACH standards makes it suitable for environmentally conscious designs and markets with strict material regulations.

11. Frequently Asked Questions (FAQ)

Q: Can I drive this LED at 25mA continuously?
A: The Absolute Maximum Rating for continuous forward current is 25mA. For reliable long-term operation, it is advisable to operate below this maximum, typically at 20mA as specified in the standard test conditions.

Q: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λp) is the wavelength at which the emission spectrum has its highest intensity. Dominant Wavelength (λd) is the single wavelength of monochromatic light that would match the perceived color of the LED. They are often close but not identical.

Q: How do I interpret the 'CAT', 'HUE', and 'REF' codes on the label?
A> These are binning codes. 'CAT' groups LEDs by luminous intensity (e.g., higher CAT number may mean higher brightness). 'HUE' groups by dominant wavelength (color). 'REF' groups by forward voltage. Using parts from the same bin ensures color and brightness uniformity in your application.

Q: Why is the storage condition so specific (3 months, then nitrogen)?
A> LED packages can absorb moisture from the air. During high-temperature soldering, this moisture can rapidly expand, causing internal delamination or cracking (the \"popcorn\" effect). The 3-month limit is for bags exposed to ambient air. Nitrogen storage with desiccant prevents moisture absorption for extended periods.

12. Practical Use Case Example

Scenario: Designing a status indicator panel for a network router.
The panel requires multiple bright, reliable indicators for power, network activity, and system errors. The Brilliant Yellow Green LED is selected for the \"System Active\" indicator.

Design Steps:
1. Drive Circuit: The router's internal logic supply is 3.3V. Using the typical VF of 2.0V at 20mA, a series current-limiting resistor is calculated: R = (3.3V - 2.0V) / 0.020A = 65 Ohms. The nearest standard value of 68 Ohms is selected, resulting in a current of approximately 19.1mA, which is safe and provides ample brightness.
2. PCB Design: The footprint from the package dimension drawing is used. A small thermal relief connection is added to the anode and cathode pads to aid soldering without creating a large thermal mass that could stress the LED during cooling.
3. Assembly: LEDs are taken from a single manufacturing lot (same LOT No) and preferably the same HUE and CAT bins to ensure uniform color and brightness across all router units. They are placed using automated pick-and-place equipment from the tape and reel.
4. Soldering: The PCB undergoes a controlled wave soldering process adhering to the 260°C for 5 seconds maximum guideline, with a 3mm minimum distance maintained between the solder wave contact point and the LED body.
5. Result: A highly visible, consistent, and reliable status indicator that meets all performance and regulatory requirements.

13. Operating Principle

This LED is based on an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip. When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor. They recombine, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength of the emitted light—in this case, in the yellow-green spectrum (~573nm). The green transparent epoxy resin package acts as a lens, shaping the light output and providing mechanical and environmental protection for the chip.

14. Technology Trends

The LED industry continues to evolve towards higher efficiency (more lumens per watt), improved color consistency, and lower cost. While this device uses a proven AlGaInP technology for specific colors, broader trends include the development of more robust packaging materials to withstand higher junction temperatures, the integration of phosphors for broader-spectrum white and other colors from blue or UV chips, and the miniaturization of packages for high-density applications. Furthermore, there is a strong drive towards enhancing reliability and longevity under diverse operating conditions, supported by more detailed lifetime testing and predictive modeling in datasheets.