LED Lamp 583UYD/S530-A3 Specification - 5.8mm Round - 2.0V - 60mW - Brilliant Yellow - English Technical Document

1. Product Overview

The 583UYD/S530-A3 is a high-brightness, brilliant yellow LED lamp designed for through-hole mounting applications. This device utilizes AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology to produce a vibrant yellow emission with a diffused yellow resin lens. The series is engineered to deliver reliable performance in a robust package, making it suitable for a variety of indicator and backlighting applications where consistent color and intensity are required.

The core advantages of this LED include its choice of viewing angles, availability on tape and reel for automated assembly, and compliance with major environmental and safety standards including RoHS, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). Its primary target markets include consumer electronics, telecommunications, and computing peripherals.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The device is designed to operate within strict electrical and thermal limits to ensure long-term reliability. The absolute maximum ratings define the boundaries beyond which permanent damage may occur.

• Continuous Forward Current (IF): 25 mA. This is the maximum DC current that can be continuously applied to the LED under normal operating conditions.
• Peak Forward Current (IFP): 60 mA. This rating applies to pulsed operation with a duty cycle of 1/10 at 1 kHz, allowing for brief periods of higher brightness.
• Reverse Voltage (VR): 5 V. Exceeding this reverse bias voltage can cause junction breakdown.
• Power Dissipation (Pd): 60 mW. This is the maximum power the package can dissipate, calculated as Forward Voltage (VF) * Forward Current (IF).
• Operating Temperature (Topr): -40 to +85 \u00b0C. The ambient temperature range for reliable operation.
• Storage Temperature (Tstg): -40 to +100 \u00b0C.
• Soldering Temperature (Tsol): 260 \u00b0C for 5 seconds, defining the reflow soldering profile tolerance.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25 \u00b0C and IF=20 mA, providing the baseline performance data.

• Luminous Intensity (Iv): Typical value is 20 mcd, with a minimum of 10 mcd. This quantifies the perceived brightness of the yellow light output. The measurement uncertainty is \u00b110%.
• Viewing Angle (2\u03b81/2): 170 degrees (typical). This very wide viewing angle indicates a highly diffused lens, making the LED suitable for applications requiring visibility from a broad range of perspectives.
• Peak Wavelength (\u03bbp): 591 nm (typical). The wavelength at which the spectral radiant intensity is maximum.
• Dominant Wavelength (\u03bbd): 589 nm (typical). The single wavelength that describes the perceived color of the LED, with a measurement uncertainty of \u00b11.0 nm.
• Spectrum Radiation Bandwidth (\u0394\u03bb): 15 nm (typical). The spectral width at half the maximum intensity, indicating color purity.
• Forward Voltage (VF): Ranges from 1.7 V (min) to 2.4 V (max), with a typical value of 2.0 V at 20 mA. The measurement uncertainty is \u00b10.1 V. This parameter is critical for current-limiting resistor calculation.
• Reverse Current (IR): Maximum of 10 \u03bcA at VR=5V, indicating good junction integrity.

3. Binning System Explanation

The product utilizes a binning system to categorize LEDs based on key optical and electrical parameters, ensuring consistency within an application. The labels on the packaging (CAT, HUE, REF) correspond to these bins.

• CAT (Ranks of Luminous Intensity): Groups LEDs based on their measured luminous intensity (Iv). This allows designers to select parts with a specific brightness range.
• HUE (Ranks of Dominant Wavelength): Categorizes LEDs according to their dominant wavelength (\u03bbd), which directly correlates to the shade of yellow. This ensures color uniformity across multiple indicators.
• REF (Ranks of Forward Voltage): Sorts LEDs by their forward voltage (VF) drop. Consistent VF bins can simplify power supply design and current regulation.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that illustrate device behavior under varying conditions.

4.1 Relative Intensity vs. Wavelength

This curve shows the spectral power distribution, peaking at approximately 591 nm (yellow) with a typical bandwidth of 15 nm. The shape confirms the use of AlGaInP technology, known for efficient yellow and amber emission.

4.2 Directivity Pattern

The polar plot illustrates the 170-degree viewing angle, showing a Lambertian-like emission pattern softened by the diffused resin, resulting in a wide, even glow rather than a focused beam.

4.3 Forward Current vs. Forward Voltage (I-V Curve)

The curve demonstrates the exponential relationship typical of a diode. At the recommended 20 mA operating point, the voltage is typically 2.0V. The curve is essential for designing the driving circuit, especially for determining the appropriate current-limiting resistor value: R = (Vsupply - VF) / IF.

4.4 Relative Intensity vs. Forward Current

This graph shows that light output (relative intensity) increases approximately linearly with forward current up to the maximum rated continuous current. It highlights the importance of stable current drive for consistent brightness.

4.5 Thermal Performance Curves

Relative Intensity vs. Ambient Temperature: Shows the luminous intensity decreasing as ambient temperature increases. This thermal derating is a fundamental characteristic of LEDs, where higher junction temperatures reduce photon generation efficiency. Proper heat sinking or current derating is necessary in high-temperature environments.
Forward Current vs. Ambient Temperature: This curve is likely intended to show the relationship under constant voltage or power conditions, emphasizing the need for constant current drive to compensate for the negative temperature coefficient of the forward voltage.

5. Mechanical and Package Information

5.1 Package Dimension

The LED features a standard 5.8mm round radial leaded package. Key dimensions include the lead spacing (approximately 2.54mm or 0.1\"), the overall diameter, and the height. The flange height is specified to be less than 1.5mm. The leads are made of a solderable material, and the body is made of yellow diffused epoxy resin. The cathode is typically identified by a flat spot on the lens rim or by the shorter lead, though the datasheet should be consulted for the specific polarity marking.

5.2 Pad Design & PCB Layout

For PCB mounting, holes should be aligned precisely with the lead diameter and spacing (2.54mm). A recommended pad layout would include annular rings sufficient for reliable soldering. The note stresses that stress on the leads during mounting can degrade the epoxy resin and LED performance.

6. Soldering and Assembly Guidelines

Proper handling is critical to prevent damage to the LED epoxy and the semiconductor die.

6.1 Lead Forming

• Bending must occur at least 3mm from the epoxy bulb base.
• Forming must be done before soldering and at room temperature.
• Avoid stressing the package; misaligned PCB holes can induce harmful stress.

6.2 Storage Conditions

• Recommended: \u2264 30\u00b0C and \u2264 70% Relative Humidity.
• Shelf life after shipping is 3 months. For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

6.3 Soldering Parameters

Hand Soldering: Iron tip temperature max 300\u00b0C (for 30W iron), soldering time max 3 seconds, maintain minimum 3mm distance from solder joint to epoxy bulb.
Wave/DIP Soldering: Preheat temperature max 100\u00b0C (60 sec max), solder bath temperature max 260\u00b0C for 5 seconds, maintain 3mm distance from joint to bulb.
Critical Notes: Do not apply stress to leads during soldering. Do not solder more than once. Protect the LED from mechanical shock while cooling. Use the lowest possible temperature for the process. Follow the recommended soldering profile which includes preheat, laminar wave contact, and controlled cooling phases.

6.4 Cleaning

If necessary, clean only with isopropyl alcohol at room temperature for \u2264 1 minute. Do not use ultrasonic cleaning unless pre-qualified, as cavitation can damage the internal structure or bonds.

7. Thermal Management and ESD Protection

7.1 Heat Management

Although power dissipation is relatively low (60mW), proper thermal design is still essential for longevity and stable light output. The current must be derated appropriately at higher ambient temperatures, as indicated by the derating curve. Designers should ensure the surrounding temperature in the application is controlled and consider the thermal path from the LED leads to the PCB.

7.2 ESD (Electrostatic Discharge) Sensitivity

The AlGaInP semiconductor die is sensitive to electrostatic discharge and surge voltages. ESD events can cause immediate failure or latent damage that reduces long-term reliability. Proper ESD controls (grounded workstations, wrist straps, conductive foam) must be used during handling and assembly. The device is packaged in anti-static bags with moisture-resistant materials for this reason.

8. Packaging and Ordering Information

8.1 Packing Specification

The product is available in bulk and on tape and reel. The standard packing flow is:
1. LEDs are placed in anti-electrostatic bags (200-500 pieces per bag).
2. Five bags are packed into one inner carton.
3. Ten inner cartons are packed into one master outside carton.

8.2 Label Explanation

The packaging labels include: CPN (Customer's Part Number), P/N (Manufacturer's Part Number: 583UYD/S530-A3), QTY (Quantity), CAT/HUE/REF (Binning codes), and LOT No. (Traceability lot number).

9. Application Suggestions and Design Considerations

9.1 Typical Application Scenarios

• Status Indicators: Power-on, standby, function active indicators in TV sets, monitors, telephones, and computers.
• Backlighting: For legends on switches, keypads, or panels where a soft, diffused yellow glow is desired.
• General Purpose Signaling: Warning lights, attention indicators in consumer and industrial equipment.

9.2 Design Considerations

• Current Drive: Always use a constant current source or a current-limiting resistor in series with the LED. Calculate the resistor using R = (Vs - Vf) / If, considering the maximum Vf from the datasheet to ensure If does not exceed ratings.
• Viewing Angle: The 170-degree angle makes it ideal for front-panel indicators but less suitable for focused beam applications.
• Color Consistency: For multi-LED arrays, specify tight HUE and CAT bins to ensure uniform appearance.
• PCB Layout: Ensure holes are correctly spaced to avoid lead stress. Provide sufficient copper area around the leads for heat dissipation if operating at high ambient temperatures.

10. Technical Comparison and Differentiation

The 583UYD/S530-A3 differentiates itself in the market through several key features. Compared to older technology yellow LEDs (e.g., using filtered light or less efficient materials), the AlGaInP chip provides higher brightness and superior color purity. The wide 170-degree viewing angle with diffused resin offers a more pleasing, soft emission compared to narrow-angle water-clear lenses. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) makes it suitable for global markets with strict regulations. The availability on tape and reel supports cost-effective, high-volume automated assembly processes.

11. Frequently Asked Questions (FAQ)

11.1 What is the recommended operating current?

The standard test condition is 20 mA, which is a safe and typical operating point well below the absolute maximum of 25 mA. For maximum longevity, especially in high-temperature environments, operating below 20 mA is advisable.

11.2 How do I identify the cathode?

While not explicitly shown in the provided text, standard practice for this package type is that the cathode is the shorter lead and/or is indicated by a flat edge on the round plastic lens. Always verify with the physical sample or manufacturer's drawing.

11.3 Can I drive this LED with a 5V supply?

Yes, but a series current-limiting resistor is mandatory. For example, with a typical Vf of 2.0V and desired If of 20mA: R = (5V - 2.0V) / 0.02A = 150 Ohms. Use the maximum Vf (2.4V) to calculate the minimum safe resistor value: R_min = (5V - 2.4V) / 0.02A = 130 Ohms. A 150-ohm resistor is a suitable choice.

11.4 Why does brightness decrease over time/temperature?

LEDs experience lumen depreciation. High junction temperatures accelerate this process due to increased defect generation in the semiconductor lattice. Ensuring proper heat management and driving the LED below its maximum ratings slows this degradation.

12. Practical Application Case Study

Scenario: Designing a multi-indicator panel for a desktop modem. The panel requires distinct, diffused yellow lights for \"Power,\" \"Internet,\" and \"Wi-Fi\" status. The 583UYD/S530-A3 is selected for its wide viewing angle, ensuring visibility from various desk positions, and its brilliant yellow color offers good contrast against a black bezel. To ensure uniform brightness and color across all three LEDs, the designer specifies a tight binning range for CAT (Luminous Intensity) and HUE (Dominant Wavelength) in the purchase order. A simple driver circuit is implemented using the modem's 3.3V rail and 68-ohm current-limiting resistors per LED, resulting in a forward current of approximately 19 mA ((3.3V - 2.0V)/68Ω \u2248 19.1 mA). The PCB layout places the LED holes precisely 2.54mm apart and includes small copper pours connected to the cathode leads to aid in heat dissipation.

13. Technology Principle Introduction

The 583UYD/S530-A3 is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material grown on a substrate. When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn defines the wavelength of the emitted light--in this case, yellow (~589-591 nm). The yellow diffused epoxy resin serves multiple purposes: it acts as a lens to shape the light output, provides mechanical and environmental protection for the delicate semiconductor chip and wire bonds, and contains phosphors or diffusion particles to scatter the light and create the wide, uniform viewing angle.

14. Industry Trends and Developments

The LED industry continues to evolve towards higher efficiency, greater reliability, and miniaturization. While through-hole LEDs like the 583UYD remain vital for many applications, especially where robustness and ease of manual assembly are priorities, there is a strong market trend towards surface-mount device (SMD) packages (e.g., 0603, 0805, 2835) for automated PCB assembly. Future developments in AlGaInP technology may focus on further improving luminous efficacy (lumens per watt) and color stability over temperature and lifetime. Additionally, integration of drive electronics and smart features directly into LED packages is an ongoing trend, though for simple indicator lamps like this, the discrete component approach offers cost-effectiveness and design flexibility.