LED Lamp 423-2UYC/S530-A6 Datasheet - Brilliant Yellow - 20mA - 2.0V - 90° Viewing Angle - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the 423-2UYC/S530-A6 LED lamp. This component is a surface-mount device (SMD) designed for applications requiring reliable illumination with specific color characteristics. The series is engineered to deliver consistent performance in a compact form factor.

1.1 Core Features and Advantages

The LED offers several key advantages for integration into electronic designs:

• Choice of Viewing Angles: The product is available with various viewing angles to suit different application requirements for light dispersion.
• Packaging Options: Available on tape and reel for compatibility with automated pick-and-place assembly processes.
• High Reliability: Designed to be robust and reliable for long-term operation.
• Environmental Compliance: The product complies with key environmental regulations:
  • RoHS (Restriction of Hazardous Substances) compliant.
  • EU REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) compliant.
  • Halogen-free specification (Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

This LED is suitable for a range of consumer and industrial electronics where indicator or backlighting functions are required. Typical applications include:

• Television Sets
• Computer Monitors
• Telephones
• General Computer Peripherals

2. Technical Parameter Analysis

This section details the critical electrical, optical, and thermal parameters that define the operational limits and performance of the LED.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and IF=20mA, representing typical performance.

Measurement Notes: Tolerances are specified: Forward Voltage (±0.1V), Luminous Intensity (±10%), Dominant Wavelength (±1.0nm).

2.3 Device Selection and Binning

The LED uses an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to produce a \"Brilliant Yellow\" emitted color. The device resin is water clear. The datasheet indicates a binning system for key parameters, though specific bin codes are not detailed here. Typical binning categories for such LEDs include:

• Luminous Intensity (CAT): Ranks based on measured light output.
• Dominant Wavelength (HUE): Ranks based on the perceived color (wavelength).
• Forward Voltage (REF): Ranks based on the voltage drop at a specified current.

Consult the packing label for specific bin codes (CAT, HUE, REF) for a given lot.

3. Performance Curve Analysis

Graphical data provides insight into how the LED behaves under varying conditions.

3.1 Spectral and Angular Distribution

Relative Intensity vs. Wavelength: The curve shows a peak emission around 591 nm (typical), defining its brilliant yellow color. The spectral bandwidth (FWHM) is approximately 15 nm, indicating a relatively pure color emission.
Directivity Pattern: The radiation pattern illustrates the 90° viewing angle (half-angle), showing how light intensity decreases from the center axis.

3.2 Electrical and Thermal Characteristics

Forward Current vs. Forward Voltage (I-V Curve): This curve is essential for circuit design. It shows the non-linear relationship; the forward voltage typically rises to around 2.0V at 20mA. Designers must use a current-limiting resistor or driver.
Relative Intensity vs. Forward Current: Shows that light output increases with current but may not be perfectly linear, especially at higher currents. Operating above the absolute maximum rating is prohibited.
Relative Intensity vs. Ambient Temperature: Demonstrates the negative temperature coefficient of light output. Luminous intensity typically decreases as the junction temperature increases.
Forward Current vs. Ambient Temperature: A de-rating curve. It indicates the maximum allowable continuous forward current must be reduced as the ambient temperature increases to prevent exceeding the maximum junction temperature and power dissipation limits.

4. Mechanical and Package Information

4.1 Package Dimensions

The datasheet includes a detailed mechanical drawing. Key dimensional notes include:

• All dimensions are in millimeters (mm).
• The height of the flange must be less than 1.5mm (0.059\").
• Standard tolerance is ±0.25mm unless otherwise specified.

The drawing specifies the body size, lead spacing, and overall footprint critical for PCB (Printed Circuit Board) layout design.

4.2 Polarity Identification

The package drawing indicates the anode and cathode leads. Correct polarity is mandatory for operation. Typically, the cathode may be identified by a notch, a shorter lead, or a marking on the package. Refer to the dimension drawing for the specific marker.

5. Assembly and Handling Guidelines

Proper handling is crucial for reliability.

5.1 Lead Forming

• Bend leads at a point at least 3mm from the epoxy bulb base.
• Perform forming before soldering.
• Avoid stressing the package. Misalignment during PCB mounting can cause resin cracking.
• Cut leads at room temperature.

5.2 Soldering Process

Recommended Conditions:

Critical Notes:

• Avoid stress on leads during high-temperature phases.
• Do not solder (dip or hand) more than once.
• Protect the LED from shock/vibration until it cools to room temperature after soldering.
• Use the lowest effective temperature.

5.3 Cleaning

• If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
• Avoid ultrasonic cleaning unless pre-qualified, as it can damage the internal structure.

5.4 Storage

• Store at ≤30°C and ≤70% Relative Humidity after receipt.
• Standard storage life is 3 months. For longer storage (up to 1 year), use a sealed container with nitrogen and desiccant.
• Avoid rapid temperature changes in humid environments to prevent condensation.

5.5 Heat Management

LED performance and lifetime are strongly dependent on junction temperature.

• Consider thermal management during PCB design (copper pads, thermal vias).
• De-rate the operating current according to the \"Forward Current vs. Ambient Temperature\" curve.
• Control the ambient temperature around the LED in the final application.

5.6 ESD (Electrostatic Discharge) Precautions

This device is sensitive to electrostatic discharge. Handle with appropriate ESD precautions: use grounded workstations, wrist straps, and conductive containers.

6. Packaging and Ordering Information

6.1 Packing Specification

The LEDs are packed to prevent damage and ESD:

1. Primary Pack: Anti-electrostatic bags.
2. Secondary Pack: Inner cartons containing multiple bags.
3. Tertiary Pack: Outside cartons containing multiple inner cartons.

Packing Quantities:

• Minimum 200 to 500 pieces per bag.
• 5 bags per inner carton.
• 10 inner cartons per outside carton.

6.2 Label Explanation

Labels on packaging contain the following information:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 423-2UYC/S530-A6).
• QTY: Quantity in the pack.
• CAT, HUE, REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
• LOT No: Traceable manufacturing lot number.

7. Application Notes and Design Considerations

7.1 Circuit Design

To operate this LED, a current-limiting mechanism is mandatory. The simplest method is a series resistor. Calculate the resistor value (R) using: R = (Vsupply - VF) / IF. Where VF is the typical or maximum forward voltage from the datasheet (e.g., 2.4V), IF is the desired operating current (e.g., 20mA), and Vsupply is your circuit's voltage. Always ensure the calculated power dissipation in the resistor is within its rating.

7.2 PCB Layout

• Follow the recommended footprint from the package dimensions.
• Ensure solder pad sizes are adequate for a reliable joint.
• For improved thermal performance, consider using a slightly larger copper pad area connected to ground or a thermal plane via thermal vias, especially if operating near maximum ratings.
• Maintain the minimum 3mm distance from the solder joint to the epoxy bulb as specified.

7.3 Optical Integration

The 90° viewing angle provides a wide beam. For applications requiring a more focused or diffused light, secondary optics (lenses, light guides) may be necessary. The water-clear resin is suitable for use with external color filters if a specific shade is needed, though this will reduce overall light output.

8. Technical Comparison and Positioning

This AlGaInP-based brilliant yellow LED offers a balance of performance characteristics. Compared to older technology like GaAsP, AlGaInP provides higher efficiency and better color saturation for yellow/orange/red colors. Its 2.0V typical forward voltage is lower than that of blue or white InGaN LEDs, potentially simplifying power supply design in mixed-color systems. The 90° viewing angle is a common standard, making it a versatile drop-in component for many indicator applications.

9. Frequently Asked Questions (FAQ)

9.1 What is the difference between Peak Wavelength (λp) and Dominant Wavelength (λd)?

Peak Wavelength is the wavelength at which the spectral power distribution is maximum (591 nm typical). Dominant Wavelength is the single wavelength of monochromatic light that matches the perceived color of the LED (589 nm typical). For LEDs with a narrow spectrum, these values are very close.

9.2 Can I drive this LED with a 5V supply without a resistor?

No. Connecting it directly to 5V would attempt to force a current far exceeding its absolute maximum rating (25mA continuous), causing immediate and catastrophic failure due to overheating. Always use a current-limiting resistor or constant-current driver.

9.3 Why is the storage humidity important?

Plastic packages like this LED can absorb moisture. During the high-temperature soldering process, trapped moisture can rapidly expand, causing internal delamination or \"popcorning,\" which cracks the package and destroys the device. The storage guidelines help control moisture absorption.

9.4 How do I interpret the binning codes (CAT, HUE, REF)?

These codes are specific to the manufacturer and production lot. They allow you to select LEDs with tightly controlled parameters. For example, if your design requires very consistent color across multiple units, you would specify a narrow HUE bin. Consult the manufacturer's detailed binning specification document for the exact meaning of each code letter/number.

10. Practical Use Case Example

Scenario: Designing a status indicator panel for a network router.

1. Requirement: A brilliant yellow LED to indicate \"Standby/Activity.\"
2. Selection: The 423-2UYC/S530-A6 is chosen for its color, brightness (~200 mcd), wide viewing angle (good visibility from multiple angles), and SMD package (suitable for automated assembly).
3. Circuit Design: The router's internal logic supply is 3.3V. Using the typical VF of 2.0V and a target IF of 15mA (for longer life and lower heat), the series resistor is calculated: R = (3.3V - 2.0V) / 0.015A = 86.7Ω. A standard 91Ω resistor is selected. Power in resistor: P = I²R = (0.015)² * 91 = 0.02W, well within a 1/8W resistor rating.
4. PCB Layout: The recommended footprint is used. A small copper pour around the LED pads is connected to the ground plane for slight heat sinking.
5. Assembly: LEDs are supplied on tape and reel. The assembly house uses the recommended reflow profile with a peak temperature of 250°C, which is below the 260°C/5s limit.
6. Result: A reliable, consistently bright yellow status indicator that meets all design and regulatory requirements.

11. Operating Principle

This LED is based on a semiconductor chip made of AlGaInP (Aluminum Gallium Indium Phosphide). When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy of the semiconductor, which directly dictates the wavelength (color) of the emitted light. In this case, the composition is tuned to produce photons in the yellow region of the visible spectrum (~589-591 nm). The water-clear epoxy resin encapsulant protects the chip, acts as a lens to shape the light output, and may contain phosphors or dyes (though for a pure color LED like this, it is typically clear).

12. Technology Trends

LED technology continues to advance. While this is a standard component, broader industry trends include:

• Increased Efficiency: Ongoing material science and chip design improvements lead to higher luminous efficacy (more light output per electrical watt), allowing for lower power consumption or higher brightness.
• Improved Color Consistency: Advanced binning and tighter process controls yield LEDs with very small variations in wavelength and intensity, critical for applications like display backlighting.
• Miniaturization: The drive for smaller electronic devices pushes LED packages to become even smaller while maintaining or improving performance.
• Integrated Solutions: Growth in LEDs with built-in current-limiting resistors, protection diodes (Zener), or even driver ICs, simplifying end-user circuit design.
• Focus on Reliability and Lifetime: Enhanced packaging materials and thermal management designs are extending LED operational lifetimes, making them suitable for more demanding applications.

This datasheet represents a mature, reliable product that embodies well-established technology suitable for a vast array of common indicator and lighting tasks.