1. Product Overview
This document provides the complete technical specifications for a high-brightness, brilliant yellow LED lamp. The device is part of a series engineered for applications demanding superior luminous output and reliability. It features a yellow diffused resin encapsulation, which helps in achieving a wide and uniform viewing angle, making it suitable for various indicator and backlighting purposes.
The core advantages of this LED include its robust construction, compliance with major environmental regulations such as RoHS, REACH, and Halogen-Free standards, and availability in user-friendly packaging formats like tape and reel for automated assembly processes. It is designed to serve as a reliable component in consumer electronics and display systems.
2. Technical Specifications Deep Dive
2.1 Absolute Maximum Ratings
The device's operational limits are defined to ensure long-term reliability and prevent catastrophic failure. The continuous forward current (IF) is rated at 25 mA, with a permissible peak forward current (IFP) of 60 mA under pulsed conditions (1/10 duty cycle @ 1 kHz). The maximum reverse voltage (VR) is 5 V. The power dissipation (Pd) must not exceed 60 mW. The operating temperature range (Topr) is from -40°C to +85°C, while the storage temperature (Tstg) extends to +100°C. The device can withstand a soldering temperature (Tsol) of 260°C for up to 5 seconds.
2.2 Electro-Optical Characteristics
Key performance parameters are measured at a standard test condition of 25°C ambient temperature and a forward current of 20 mA.
- Luminous Intensity (Iv): The typical value is 20 millicandelas (mcd), with a minimum of 10 mcd.
- Viewing Angle (2θ1/2): The device offers a very wide typical viewing angle of 180 degrees.
- Peak Wavelength (λp): The typical peak emission is at 591 nanometers (nm).
- Dominant Wavelength (λd): The typical dominant wavelength is 589 nm.
- Spectrum Radiation Bandwidth (Δλ): The typical spectral width is 20 nm.
- Forward Voltage (VF): Typically 2.0 V, ranging from a minimum of 1.7 V to a maximum of 2.4 V.
- Reverse Current (IR): Maximum of 10 μA when a reverse voltage of 5 V is applied.
Measurement uncertainties are noted: ±0.1V for forward voltage, ±10% for luminous intensity, and ±1.0nm for dominant wavelength.
2.3 Device Selection and Binning
The LED utilizes an AlGaInP chip material to produce its brilliant yellow color. The resin color is yellow diffused. The datasheet indicates a binning system for key parameters, though specific bin codes for luminous intensity (CAT), dominant wavelength (HUE), and forward voltage (REF) are referenced in the packing label explanation, suggesting the product is available in sorted performance grades to meet application-specific consistency requirements.
3. Performance Curve Analysis
The datasheet includes several characteristic graphs that provide deeper insight into the device's behavior under varying conditions.
3.1 Spectral and Angular Distribution
The Relative Intensity vs. Wavelength curve shows the emission spectrum centered around 591 nm. The Directivity pattern illustrates the 180-degree viewing angle, confirming the diffused lens's effectiveness in spreading light.
3.2 Electrical and Thermal Behavior
The Forward Current vs. Forward Voltage (IV Curve) depicts the non-linear relationship, crucial for designing current-limiting circuits. The Relative Intensity vs. Forward Current curve shows how light output increases with current, important for brightness control.
The Relative Intensity vs. Ambient Temperature and Forward Current vs. Ambient Temperature graphs are critical for thermal management design. They show how luminous efficiency decreases and the required forward current changes as the operating temperature rises, highlighting the need for adequate heat sinking in high-power or high-ambient-temperature applications.
4. Mechanical and Package Information
4.1 Package Dimensions
A detailed dimensional drawing is provided. Key notes specify that all dimensions are in millimeters, the flange height must be less than 1.5mm, and the general tolerance is ±0.25mm unless otherwise stated. This information is essential for PCB footprint design and ensuring proper fit within the assembly.
4.2 Polarity Identification and Mounting
While the specific lead identification is shown in the dimension diagram, standard practice for radial LEDs involves identifying the cathode (negative lead) often by a shorter lead, a flat spot on the lens, or a notch in the flange. The datasheet stresses the importance of aligning PCB holes exactly with the LED leads to avoid mounting stress.
5. Soldering and Assembly Guidelines
Proper handling is critical to maintain LED performance and longevity.
5.1 Lead Forming
- Bending must occur at least 3mm from the epoxy bulb base.
- Forming must be done before soldering.
- Avoid stressing the package; cutting should be done at room temperature.
- Precise alignment with PCB holes is mandatory to prevent stress.
5.2 Soldering Parameters
Recommended conditions are provided for both hand and dip soldering:
- Hand Soldering: Iron tip temperature max 300°C (30W max), soldering time max 3 seconds.
- Dip Soldering: Preheat temperature max 100°C (60 sec max), solder bath temperature max 260°C for 5 seconds.
- A minimum distance of 3mm must be maintained from the solder joint to the epoxy bulb for both methods.
- A soldering profile diagram is included, emphasizing a controlled ramp-up, peak temperature dwell, and controlled cool-down to prevent thermal shock.
- Soldering (dip or hand) should not be performed more than once.
- LEDs must be protected from mechanical shock until they cool to room temperature post-soldering.
5.3 Cleaning
If cleaning is necessary, use isopropyl alcohol at room temperature for no more than one minute. Ultrasonic cleaning is strongly discouraged but, if unavoidable, must be pre-qualified to avoid damaging the LED package.
5.4 Storage Conditions
LEDs should be stored at ≤30°C and ≤70% Relative Humidity. The storage life after shipping is 3 months. For longer storage (up to one year), they must be kept in a sealed container with a nitrogen atmosphere and desiccant.
6. Packaging and Ordering Information
6.1 Packing Specification
The LEDs are packed in anti-static bags, placed in inner cartons, and finally shipped in outside cartons. The standard packing quantity is a minimum of 200-500 pieces per bag, 5 bags per inner carton, and 10 inner cartons per master (outside) carton.
6.2 Label Explanation
Labels on the packaging contain several codes:
- CPN: Customer's Production Number
- P/N: Production Number (Device Part Number)
- QTY: Packing Quantity
- CAT, HUE, REF: Binning codes for Luminous Intensity, Dominant Wavelength, and Forward Voltage, respectively.
- LOT No: Manufacturing Lot Number for traceability.
7. Application Notes and Design Considerations
7.1 Typical Applications
This LED is well-suited for use as an indicator or backlight in:
- Television Sets
- Computer Monitors
- Telephones
- General Computer Peripherals
7.2 Critical Design Considerations
Heat Management: As highlighted in the performance curves, LED efficiency drops with temperature. The design must ensure the junction temperature remains within safe limits by considering the forward current, ambient temperature, and PCB thermal conductivity. Exceeding the maximum power dissipation (60mW) or operating temperature can drastically reduce lifespan and light output.
Current Driving: The LED must be driven with a constant current source or appropriate current-limiting resistor, calculated based on the supply voltage and the LED's forward voltage (typical 2.0V, max 2.4V). The circuit must respect the absolute maximum continuous current of 25 mA.
ESD and Moisture Sensitivity: The device is packaged in moisture-resistant, anti-static materials. Standard ESD (Electrostatic Discharge) precautions should be followed during handling to prevent damage from static electricity.
8. Technical Comparison and FAQs
8.1 Differentiation
Compared to standard yellow LEDs, this device's key differentiators are its very wide 180-degree viewing angle due to the diffused lens, its compliance with stringent halogen-free standards (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm), and its design for higher brightness applications. The AlGaInP chip technology typically offers higher efficiency and better color purity for yellow/amber colors compared to some older technologies.
8.2 Frequently Asked Questions
Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λp) is the point of maximum spectral power. Dominant wavelength (λd) is the single wavelength perceived by the human eye that matches the color of the light. For LEDs, they are often close but not identical.
Q: Can I drive this LED at 30mA for more brightness?
A: No. The Absolute Maximum Rating for continuous forward current is 25 mA. Exceeding this rating compromises reliability and may cause permanent damage. For higher brightness, select an LED rated for a higher current.
Q: Why is maintaining a 3mm distance from the solder joint to the bulb so important?
A: This prevents excessive heat from traveling up the lead and damaging the internal semiconductor die or the epoxy resin, which can cause cracking, delamination, or shifts in optical properties.
Q: How do I interpret the binning codes (CAT, HUE, REF) on the label?
A> These codes correspond to specific ranges of luminous intensity, dominant wavelength, and forward voltage, respectively. Consult the manufacturer's separate binning specification document to understand the exact performance range associated with each code, allowing for tighter consistency in your application.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |