UV SMD LED Specification Sheet - Dimensions 6.6x6.6x4.6mm - Voltage 6.4-7.6V - Power 15.2W Peak - Wavelength 365-410nm - English Technical Document

1. Product Overview

This document details the specifications for a high-power Surface-Mount Device (SMD) LED utilizing an advanced ceramic and quartz lens package. Designed for demanding applications, this component is built for reliability and performance in various industrial and commercial settings. The ceramic substrate provides excellent thermal management, which is crucial for maintaining performance and longevity in high-power UV applications.

1.1 Product Positioning and Core Advantages

This product is positioned as a robust solution for UV-based processes requiring consistent and powerful light output. Its core advantages stem from its unique construction and technical characteristics.

• Superior Thermal Management: The ceramic package offers excellent heat dissipation, directly contributing to stable light output and extended operational life.
• High Optical Performance: Featuring a quartz lens, it ensures high transmittance in the UV spectrum, maximizing radiant flux output.
• Process Compatibility: Designed for standard SMT assembly lines, it is suitable for tape-and-reel packaging and standard reflow soldering processes, facilitating high-volume manufacturing.
• Application Versatility: Available in multiple UV wavelength ranges, making it suitable for a diverse set of applications from curing to disinfection.

1.2 Target Market and Applications

The primary target markets are industries utilizing ultraviolet light for material processing and sterilization. Key applications include:

• UV Curing Systems: For adhesives, coatings, inks, and resins in printing, electronics assembly, and dental equipment.
• Industrial and Medical Disinfection: Used in devices for air, water, and surface purification.
• General UV Illumination: For fluorescence analysis, counterfeit detection, and other specialized lighting needs.

2. In-depth Technical Parameter Analysis

A thorough understanding of the electrical and optical characteristics is essential for proper circuit design and thermal management.

2.1 Electrical and Optical Characteristics

The primary operating point is defined at a forward current (I_F) of 1400 mA. Key parameters at this condition, measured at a solder point temperature (T_s) of 25°C, are as follows:

• Forward Voltage (V_F): Ranges from 6.4V to 7.6V, depending on the specific voltage bin (B28, B30, B32). This parameter is critical for driver design and power consumption calculation.
• Total Radiant Flux (Φ_e): The optical power output, measured in milliwatts (mW). It is binned into three main power levels (1B42, 1B43, 1B44) across four different peak wavelength families (365-370nm, 380-390nm, 390-400nm, 400-410nm). The typical radiant flux can reach up to 5800mW for certain bins.
• Viewing Angle (2θ_1/2): A standard 60-degree full viewing angle, providing a focused beam suitable for many industrial applications.
• Thermal Resistance (R_THJ-S): A low junction-to-solder point thermal resistance of 4.5 °C/W. This value indicates how efficiently heat travels from the semiconductor junction to the PCB, which is vital for calculating the required heatsinking.

2.2 Absolute Maximum Ratings

Operating beyond these limits may cause permanent damage. Designers must ensure the application environment remains within these boundaries.

• Maximum Power Dissipation (P_D): 15.2 Watts.
• Peak Forward Current (I_FP): 2000 mA (under pulsed conditions with a 1/10 duty cycle and 0.1ms pulse width).
• Reverse Voltage (V_R): 10 V.
• Operating Temperature (T_OPR): -40°C to +80°C.
• Junction Temperature (T_J): Absolute maximum of 105°C. The actual operating current must be derated based on thermal management to keep the junction temperature below this limit.

2.3 Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins. This product utilizes a multi-parameter binning system:

• Forward Voltage Bin: LEDs are categorized as B28 (6.4-6.8V), B30 (6.8-7.2V), or B32 (7.2-7.6V). This allows designers to select components with tighter voltage tolerances for their power supply design.
• Radiant Flux Bin: Optical output is sorted into three power levels: 1B42 (~3550-4500mW), 1B43 (~4500-6300mW), and 1B44 (~6300-7100mW). This enables selection based on the required light intensity for the application.
• Wavelength Range: The product is offered in four distinct spectral bands: 365-370nm (UVA), 380-390nm (UVA), 390-400nm (UVA/borderline visible), and 400-410nm (violet). The choice depends on the specific photochemical reaction needed (e.g., initiator activation in curing) or application requirements.

2.4 Performance Curve Analysis

While specific graphs are referenced in the datasheet, understanding typical performance trends is crucial.

• Current-Voltage (I-V) Curve: The forward voltage exhibits a characteristic exponential rise with current. The specified V_F at 1400mA provides a key operating point for the driver.
• Optical Output vs. Current (L-I Curve): Radiant flux increases linearly with current in the typical operating range but will eventually saturate and decrease at very high currents due to thermal effects and efficiency droop.
• Thermal Derating: The maximum allowable forward current decreases as the ambient or junction temperature increases. This derating must be calculated using the thermal resistance (R_THJ-S) and the maximum junction temperature (T_J=105°C) to ensure reliable operation.
• Spectral Distribution: The LED emits in a narrow band within its specified wavelength range (e.g., 365-370nm). The exact peak wavelength and spectral width are typical for semiconductor-based UV sources.

3. Mechanical and Packaging Information

3.1 Physical Dimensions and Diagrams

The component has a compact footprint with an outline size of 6.6mm x 6.6mm and a height of 4.6mm. The dimensional drawings include top, side, and bottom views, along with polarity identification.

3.2 Recommended PCB Footprint (Soldering Pattern)

A land pattern design is provided to ensure proper soldering and mechanical stability. The recommended pad dimensions are 6.30mm x 2.90mm. Adhering to this footprint helps with thermal transfer to the PCB and prevents tombstoning or misalignment during reflow.

3.3 Polarity Identification

The cathode (negative) terminal is clearly marked on the bottom view of the component. Correct polarity orientation during PCB assembly is mandatory for the device to function.

4. Soldering and Assembly Guidelines

4.1 SMT Reflow Soldering Instructions

The component is compatible with standard infrared or convection reflow soldering processes. A typical lead-free reflow profile with a peak temperature not exceeding 260°C is applicable. The Moisture Sensitivity Level (MSL) is Level 3, meaning the components must be baked if exposed to ambient conditions for longer than 168 hours before soldering to prevent popcorn cracking during reflow.

4.2 Rework and Repair

If manual soldering is necessary for repair, using a temperature-controlled soldering iron is recommended. The iron tip temperature should be kept below 350°C, and contact time with the solder pad should be minimal (less than 3 seconds) to prevent thermal damage to the LED die or the ceramic package.

4.3 Storage and Handling Precautions

• ESD Protection: Although rated for 2000V (HBM), standard ESD precautions should be followed during handling and assembly.
• Moisture Barrier: If the dry-pack is opened, components should be used within the MSL Level 3 timeframe or re-baked according to standard IPC/JEDEC guidelines.
• Cleaning: Avoid using ultrasonic cleaning, which can damage the internal structure. Isopropyl alcohol with a soft brush is recommended if cleaning is necessary.
• Avoid Mechanical Stress: Do not apply direct pressure to the quartz lens.

5. Packaging and Ordering Information

5.1 Packaging Specification

The product is supplied in industry-standard tape-and-reel packaging for automated pick-and-place machines. Specifications for the carrier tape dimensions, reel size, and labeling format are provided to ensure compatibility with SMT assembly equipment.

5.2 Moisture-Resistant Packing

The reels are sealed in moisture barrier bags with desiccant and a humidity indicator card to maintain the MSL Level 3 rating during storage and transportation.

5.3 Model Numbering Rule

The part number encodes key attributes. For example, \"RF-C65S6-U※P-AR-22\" indicates the series, package size (C65), SMD type (S6), UV spectrum (U), specific wavelength/power bin (※), and other product revisions. Understanding this coding is essential for correct component selection.

6. Application Design Recommendations

6.1 Design Considerations for Optimal Performance

• Thermal Management is Paramount: Use a PCB with adequate thermal vias under the thermal pad (exposed area on the bottom). For high-power operation, consider attaching the PCB to an aluminum heatsink. Calculate the expected junction temperature using the formula: T_J = T_PCB + (R_THJ-S * P_D), where P_D = V_F * I_F.
• Constant Current Driving: Always use a constant current LED driver, not a constant voltage source, to ensure stable light output and prevent thermal runaway.
• Optical Design: The 60-degree viewing angle may require secondary optics (reflectors or lenses) to achieve the desired beam pattern for the application.

7. Technical Comparison and Differentiation

Compared to standard plastic SMD LEDs or lower-power UV LEDs, this product's key differentiators are:

• Ceramic vs. Plastic Package: Superior thermal conductivity and UV resistance, leading to higher maximum power handling and longer lifetime in UV applications where plastic can degrade.
• High Radiant Flux: Output measured in watts of optical power, not lumens, is significantly higher than common indicator-level UV LEDs, enabling shorter cure times or longer irradiation distances.
• Industrial-Grade Reliability: Designed and tested for continuous operation in industrial environments, as evidenced by its reliability test specifications.

8. Frequently Asked Questions (FAQs)

8.1 Based on Technical Parameters

Q: What is the difference between radiant flux (mW) and luminous flux (lm)?

A: Radiant flux measures total optical power in watts, relevant for UV applications. Luminous flux measures perceived brightness by the human eye (weighted by the photopic curve) and is not applicable to non-visible UV light.

Q: How do I select the right V_F bin?

A: Choose a bin based on your driver's voltage compliance range. Using a tighter bin (e.g., all B30) can simplify driver design and improve consistency across multiple LEDs in an array.

Q: Can I drive this LED at the peak current of 2000mA continuously?

A: No. The 2000mA rating is for pulsed operation only (0.1ms pulse, 1/10 duty cycle). Continuous operation must be based on the maximum power dissipation (15.2W) and thermal management, typically at or below the 1400mA test condition.

9. Practical Application Case Study

Scenario: Designing a UV Curing Module for a 3D Printer.

The module requires a 365nm light source to cure resin. An array of four LEDs is planned. Design steps include: 1) Selecting the 365-370nm wavelength bin and a high radiant flux bin (1B43 or 1B44) for faster curing. 2) Designing a constant current driver capable of supplying 1400mA per LED, accounting for the total V_F of the series/parallel configuration. 3) Implementing a metal-core PCB (MCPCB) with a large aluminum heatsink to maintain T_J below 85°C for reliability. 4) Adding a reflector to collimate the 60-degree beam onto the build area efficiently.

10. Introduction to Operating Principles

This LED operates on the principle of electroluminescence in a semiconductor material (typically based on aluminum gallium nitride - AlGaN). When a forward voltage is applied, electrons and holes recombine in the active region of the chip, releasing energy in the form of photons. The specific wavelength (UV in this case) is determined by the bandgap energy of the semiconductor materials used in the chip's multi-quantum well structure. The ceramic package serves primarily as a robust mechanical housing and, critically, as a highly efficient thermal pathway to draw heat away from the semiconductor junction.

11. Technology Trends

The UV LED market is driven by trends towards higher efficiency (more radiant flux per electrical watt), longer operational lifetimes, and lower cost per milliwatt. There is ongoing research into new semiconductor materials and chip designs to push peak wavelengths further into the UVC band (200-280nm) for germicidal applications while improving efficiency. Packaging technology continues to evolve, with advanced ceramics and novel thermal interface materials enabling higher power densities in ever-smaller form factors. The move towards mercury-free UV sources across all industries provides a significant growth driver for UV LED technology.