Ceramic White LED Specification - 6.9x3.0x0.8mm - 14-17V - 1.5A - 1600-2200lm - English Technical Document

1. Product Overview

This document details the specifications for a high-performance white LED component designed primarily for demanding automotive exterior lighting applications. The device utilizes a ceramic package, offering superior thermal management and reliability compared to standard plastic packages. Its core function is to provide high luminous output for applications such as daytime running lights (DRLs), turn signals, and other exterior vehicle illumination where brightness, longevity, and performance under harsh environmental conditions are critical.

1.1 Product Description

The LED is a white light-emitting diode fabricated using a blue semiconductor chip combined with a phosphor coating. The phosphor converts a portion of the blue light into longer wavelengths, resulting in the perception of white light. The product is housed in a compact surface-mount device (SMD) package measuring 6.9mm in length, 3.0mm in width, and 0.8mm in height.

1.2 Key Features

• Ceramic Package: Provides excellent thermal conductivity, mechanical strength, and resistance to moisture and UV degradation.
• Wide Viewing Angle: Features an extremely wide emission pattern, typically 120 degrees, suitable for applications requiring broad area illumination.
• SMT Compatibility: Fully compatible with standard surface-mount technology (SMT) assembly and reflow soldering processes.
• Tape and Reel Packaging: Supplied on carrier tape and reel for automated pick-and-place assembly, enhancing manufacturing efficiency.
• Moisture Sensitivity: Rated at Moisture Sensitivity Level (MSL) 2, indicating it requires baking if exposed to ambient conditions for more than one year prior to soldering.
• Environmental Compliance: The product is compliant with the Restriction of Hazardous Substances (RoHS) directive.
• Automotive Qualification: The product qualification test plan is based on the AEC-Q102 stress test qualification guidelines for automotive-grade discrete optoelectronic semiconductors, ensuring reliability for automotive environments.

1.3 Target Applications

The primary application for this LED is in Automotive Lighting Exterior. This includes, but is not limited to:

• Daytime Running Lights (DRLs)
• Turn Signal Lights
• Position Lights
• Rear Combination Lamps
• Other exterior signal and illumination functions requiring high brightness and reliability.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters that define the LED's performance.

2.1 Electrical & Optical Characteristics (Ts=25°C)

The following parameters are measured at a standard junction temperature of 25°C. Designers must account for thermal rise in real applications.

• Forward Voltage (V_F): Ranges from a minimum of 14V to a maximum of 17V at a test current (I_F) of 1000mA. The typical value is not specified, indicating significant variation that is managed through the binning process. The measurement tolerance is ±0.1V.
• Reverse Current (I_R): Maximum of 10 µA when a reverse voltage (V_R) of 20V is applied. This is a leakage current parameter.
• Luminous Flux (Φ): The total visible light output. At I_F=1000mA, it ranges from a minimum of 1600 lumens (lm) to a maximum of 2200 lm. The measurement tolerance is ±10%. This high output is characteristic of LEDs designed for automotive forward lighting.
• Viewing Angle (2θ_1/2): The full angle at which light intensity drops to half of its maximum value. The typical value is 120 degrees, confirming the wide beam pattern.

2.2 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions, even momentarily. Operation beyond these limits may cause permanent damage.

• Power Dissipation (P_D): Absolute maximum of 5500 mW. The actual operating power (V_F * I_F) must be kept below this limit, considering thermal derating.
• Forward Current (I_F): Maximum continuous DC current is 1500 mA.
• Peak Forward Current (I_FP): Maximum pulsed current is 2000 mA, specified under conditions of 1/10 duty cycle and 10 ms pulse width. This is relevant for pulsed driving schemes.
• Reverse Voltage (V_R): Maximum allowable reverse voltage is 20V.
• Electrostatic Discharge (ESD): Human Body Model (HBM) rating of 8000V, indicating good inherent ESD protection, but standard ESD handling precautions are still necessary.
• Temperature Ranges:
  • Operating Temperature (T_OPR): -40°C to +125°C (ambient or case temperature).
  • Storage Temperature (T_STG): -40°C to +125°C.
  • Maximum Junction Temperature (T_J): 150°C.

2.3 Thermal Characteristics

Effective thermal management is crucial for maintaining performance and longevity.

• Thermal Resistance (R_thJS): This is the resistance to heat flow from the semiconductor junction (J) to the solder point (S) on the board.
  • Real (Measured): Typical 1.25 °C/W, Maximum 1.7 °C/W. This is the total thermal resistance of the package and interface.
  • Electrical Method (Derived): Typical 0.7 °C/W, Maximum 0.95 °C/W. This value, measured electrically at I_F=1000mA and 25°C, often represents the intrinsic package resistance and is typically lower than the real measured value which includes board effects.
• Photoelectric Conversion Efficiency (η_e): At 25°C under pulsed operation, this efficiency is stated as 44%. This metric indicates the percentage of electrical input power that is converted into optical output power (including non-visible wavelengths), with the remaining ~56% dissipated as heat.

3. Binning System Explanation

To ensure consistent performance in production, LEDs are sorted (binned) based on key parameters. This allows designers to select parts that meet specific system requirements.

3.1 Forward Voltage (V_F) and Luminous Flux (Φ) Binning

The binning is defined at a standard test current of I_F = 1000mA.

• Forward Voltage Bins:
  • L1: 14.0V – 15.0V
  • G1: 15.0V – 16.0V
  • H1: 16.0V – 17.0V
• Luminous Flux Bins:
  • EC: 1600 lm – 1750 lm
  • ED: 1750 lm – 1900 lm
  • EE: 1900 lm – 2050 lm
  • EF: 2050 lm – 2200 lm

A complete product code will specify both a V_F bin and a Flux bin (e.g., G1-ED). This system allows for precise matching of LEDs within an array to ensure uniform brightness and electrical behavior.

4. Mechanical & Package Information

4.1 Package Dimensions

The LED has a rectangular ceramic body with dimensions of 6.90mm (L) x 3.00mm (W) x 0.80mm (H). All dimensional tolerances are ±0.2mm unless otherwise noted. Key features include thermal pads on the bottom for soldering to the PCB, which are critical for heat dissipation.

4.2 Polarity Identification

The component has a clear polarity marking. One corner of the package is distinctly chamfered or notched. The cathode (-) terminal is typically associated with this marked corner. It is imperative to identify this marking during PCB layout and assembly to ensure correct orientation.

4.3 Recommended Solder Pad Pattern

A land pattern (footprint) is provided for PCB design. This pattern shows the recommended size and shape of the copper pads for the electrical terminals and the central thermal pad. Following this recommendation is essential for achieving reliable solder joints, proper heat transfer to the PCB, and preventing tombstoning during reflow.

5. Soldering & Assembly Guidelines

5.1 SMT Reflow Soldering Instructions

The LED is designed for standard SMT reflow soldering processes. While a specific reflow profile is not detailed in the provided excerpt, general guidelines for MSL Level 2, ceramic-packaged components should be followed:

• Moisture Handling: If the sealed moisture barrier bag has been opened or the exposure time exceeds 12 months, the components must be baked (e.g., at 125°C for 24 hours) before reflow to prevent "popcorning" damage.
• Reflow Profile: Use a lead-free (Pb-free) compatible reflow profile. The peak temperature should not exceed the maximum package temperature rating, typically around 260°C for a short duration (e.g., 10-30 seconds above 245°C). The ceramic package can withstand higher thermal stress than plastic, but the internal materials (solder, die attach) have limits.
• Thermal Pad Soldering: Ensure the PCB thermal pad design includes adequate vias to transfer heat to inner layers or a heatsink. Use a sufficient amount of solder paste on the thermal pad to voiding and ensure good thermal contact.

5.2 Handling Precautions

• ESD Protection: Although rated for 8000V HBM, handle the LEDs in an ESD-protected environment using grounded wrist straps and conductive work surfaces.
• Mechanical Stress: Avoid applying direct mechanical force or bending stress to the ceramic body or the solder terminals.
• Contamination: Keep the LED lens clean. Avoid touching the lens with bare fingers, as oils can contaminate the surface and affect light output. Use appropriate cleaning solvents if necessary.
• Current Control: Always drive the LED with a constant current source, not a constant voltage source, to prevent thermal runaway and ensure stable light output. The driver must be designed to respect the absolute maximum current ratings.

6. Packaging & Ordering Information

6.1 Packaging Specification

The LEDs are supplied in industry-standard packaging for automated assembly.

• Carrier Tape: Components are placed in embossed carrier tape. The tape dimensions (pocket size, pitch) are specified to be compatible with standard pick-and-place equipment.
• Reel: The carrier tape is wound onto a reel. Reel dimensions (diameter, hub size, width) are provided.
• Labeling: Each reel contains a label with specific information including part number, quantity, bin codes, lot number, and date code.

6.2 Moisture-Resistant Packing

The reels are packaged in a sealed moisture barrier bag along with a humidity indicator card (HIC) to show the internal moisture level. The bag is typically flushed with dry nitrogen to minimize moisture content.

7. Application Design Considerations

7.1 Thermal Management Design

This is the single most critical aspect of using this high-power LED.

• PCB Design: Use a multilayer PCB with thick copper layers (e.g., 2 oz). The thermal pad footprint must connect to a large copper pour, which should be stitched with multiple thermal vias to internal ground planes or dedicated thermal layers.
• Heatsinking: For applications requiring maximum drive current or operating in high ambient temperatures, an external heatsink attached to the PCB may be necessary. The thermal path from the LED junction to the ambient (R_thJA) must be low enough to keep T_J below 150°C, and preferably much lower for long-term reliability.
• Derating: Light output and lifetime decrease as junction temperature increases. Design the system to operate the LED at the lowest practical junction temperature. Consider derating the drive current if the thermal solution is limited.

7.2 Electrical Design

• Driver Selection: Choose an LED driver IC capable of delivering up to 1500mA constant current. The driver's output voltage compliance range must accommodate the maximum V_F of the selected bin plus any voltage drop in the wiring and PCB traces.
• Protection Circuits: Implement protection against over-voltage, reverse polarity, and load open/short conditions as per the driver IC's recommendations.
• Bin Selection: For designs using multiple LEDs in series or parallel, specify tight V_F and flux bins (e.g., a single bin code) to ensure uniform current sharing and brightness. Mixing bins can lead to visible differences in light output.

7.3 Optical Design

• Secondary Optics: The wide 120-degree viewing angle is often too broad for focused beam applications. Secondary optics (lenses, reflectors) will be required to collimate or shape the light into the desired beam pattern for automotive functions.
• Thermal Effects on Optics: Be aware that the color temperature and light output of white LEDs can shift with temperature. The optical design should account for this potential variation.

8. Reliability & Testing

The product is qualified according to AEC-Q102, which includes a comprehensive suite of stress tests simulating automotive lifetime conditions. Typical test items include:

• High Temperature Operating Life (HTOL)
• Temperature Cycling (TC)
• High Temperature High Humidity (H3TRB or similar)
• ESD and Electrical Overstress tests
• Mechanical shock and vibration tests

Specific test conditions and pass/fail criteria (e.g., maximum allowable change in forward voltage or luminous flux) are defined to ensure the component meets the rigorous demands of automotive applications over its intended lifespan.

9. Technical Comparison & Differentiation

Compared to standard mid-power LEDs in plastic packages, this component offers distinct advantages for automotive exterior lighting:

• Superior Thermal Performance: The ceramic package has a much lower thermal resistance than plastic (PCT or EMT), enabling higher drive currents and better lumen maintenance at high temperatures.
• Enhanced Reliability: Ceramic is inert, non-absorbent, and does not degrade under UV exposure or high humidity, making it inherently more reliable in harsh environments.
• Higher Power Handling: With a maximum power dissipation of 5.5W, it is suited for applications requiring very high luminous flux from a single point source or a small array.
• Automotive-Grade Qualification: The AEC-Q102 qualification is a key differentiator from commercial-grade LEDs, providing assurance of performance under automotive stress conditions.

10. Frequently Asked Questions (FAQs)

10.1 What is the main advantage of a ceramic package?

The primary advantage is superior thermal management. Ceramic conducts heat away from the LED chip much more effectively than plastic, leading to lower operating junction temperatures. This results in higher light output, better color stability, and significantly longer operational lifetime, which is critical for automotive applications where replacement is difficult or impossible.

10.2 How do I interpret the two different thermal resistance values (Real vs. Electrical)?

For practical thermal design, use the Real (measured) R_thJS value (max 1.7 °C/W). This value represents the total thermal resistance from the junction to the solder point under realistic conditions, including the interface between the package and the test board. The Electrical method value is useful for characterizing the package itself but may not fully represent the resistance in your specific PCB application. Always design using the more conservative (higher) value.

10.3 Can I drive this LED at the maximum continuous current of 1500mA?

You can, but only if your thermal management solution is exceptionally robust. Driving at the absolute maximum rating generates significant heat (P_D ≈ V_F * I_F ≈ 17V * 1.5A = 25.5W, which exceeds the P_D max of 5.5W, indicating the need for careful interpretation—likely the 5.5W is the heat dissipated at the junction, not total electrical power). In practice, most designs will operate at or below the typical test current of 1000mA to balance performance, efficiency, and reliability. Always perform thorough thermal analysis and testing at your intended operating point.

10.4 Why is binning important, and which bin should I choose?

Binning ensures consistency. For a single LED, any bin within the specified ranges will work. However, for applications using multiple LEDs (e.g., a string in a tail light), selecting a single, specific V_F and Flux bin (e.g., G1/ED) is crucial. This ensures all LEDs in the string have nearly identical electrical characteristics, promoting even current distribution and uniform brightness. Choosing a higher flux bin (EE, EF) provides more light output but may come at a premium cost.

11. Operating Principle

The device operates on the principle of electroluminescence in a semiconductor. When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine in the active region of the blue indium gallium nitride (InGaN) chip, releasing energy in the form of photons (light) with a wavelength in the blue spectrum. This blue light then strikes a layer of phosphor (typically yttrium aluminum garnet or YAG doped with cerium) deposited on or near the chip. The phosphor absorbs a portion of the blue photons and re-emits light across a broader spectrum, predominantly in the yellow region. The combination of the remaining blue light and the converted yellow light is perceived by the human eye as white light. The exact correlated color temperature (CCT) of the white light is determined by the composition and thickness of the phosphor layer.

12. Technology Trends

The development of high-power ceramic LEDs for automotive lighting follows several key industry trends:

• Increased Efficiency (lm/W): Ongoing improvements in chip epitaxy, phosphor technology, and package design continue to push luminous efficacy higher, reducing electrical power consumption and thermal load for the same light output.
• Miniaturization: There is a constant drive to achieve higher flux density (lumens per mm²) from smaller packages, enabling more compact and stylized lighting designs.
• Improved Reliability & Lifetime: Automotive applications demand lifetimes exceeding 10,000 hours. Advances in materials (ceramics, high-temperature solders, stable phosphors) and package sealing technologies are extending operational life and lumen maintenance (L70, L50).
• Smart & Adaptive Lighting: LEDs are enabling advanced functions like Adaptive Driving Beams (ADB), where individual LEDs or clusters can be dynamically controlled. This requires components with consistent performance and fast response times.
• Color Tuning & Quality: Beyond cool white, there is growing demand for LEDs with specific color temperatures (warm white) and high Color Rendering Index (CRI) for better aesthetic appeal and object recognition in lighting.