Table of Contents
- 1. Product Overview
- 2. Technical Parameters
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Performance Curve Analysis
- 3.1 Relative Intensity vs. Wavelength
- 3.2 Directivity Pattern
- 3.3 Forward Current vs. Forward Voltage (I-V Curve)
- 3.4 Relative Intensity vs. Forward Current
- 3.5 Thermal Characteristics
- 4. Mechanical and Packaging Information
- 4.1 Package Dimensions
- 4.2 Polarity Identification
- 5. Soldering and Assembly Guidelines
- 5.1 Lead Forming
- 5.2 Storage
- 5.3 Soldering Process
- 5.4 Cleaning
- 5.5 Heat Management
- 6. Packaging and Ordering Information
- 6.1 Packing Specification
- 6.2 Label Explanation
- 7. Application Suggestions and Design Considerations
- 7.1 Typical Application Circuits
- 7.2 Design Considerations
- 8. Technical Comparison and Differentiation
- 9. Frequently Asked Questions (FAQs)
- 9.1 Can I drive this LED at 30mA for more brightness?
- 9.2 What is the difference between Peak Wavelength and Dominant Wavelength?
- 9.3 Why is the storage condition (3 months) important?
- 9.4 How do I interpret the binning codes (CAT, HUE, REF)?
- 10. Practical Design Case Study
- 10.1 Designing a Panel-Mount Status Indicator
1. Product Overview
This document provides the technical specifications for a high-brightness, deep red LED lamp designed for general indicator and backlighting applications. The device utilizes AlGaInP chip technology encapsulated in a red diffused resin, producing light with a dominant wavelength of approximately 639 nm. It is characterized by a wide 120-degree viewing angle and is offered on tape and reel for automated assembly.
The product is designed to be reliable and robust, complying with relevant environmental and safety standards including RoHS, EU REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). Its primary applications include use in consumer electronics such as television sets, monitors, telephones, and computers where a clear, visible red indicator is required.
2. Technical Parameters
2.1 Absolute Maximum Ratings
The device must not be operated beyond these limits, as doing so may cause permanent damage.
- Continuous Forward Current (IF): 25 mA
- Electrostatic Discharge (ESD): 2000 V (Human Body Model)
- Reverse Voltage (VR): 5 V
- Power Dissipation (Pd): 60 mW
- Operating Temperature (Topr): -40°C to +85°C
- Storage Temperature (Tstg): -40°C to +100°C
- Soldering Temperature (Tsol): 260°C for 5 seconds maximum
2.2 Electro-Optical Characteristics
All parameters are measured at an ambient temperature (Ta) of 25°C and a forward current (IF) of 20 mA, unless otherwise specified.
- Luminous Intensity (Iv): Typical 16 mcd (Minimum 10 mcd)
- Viewing Angle (2θ1/2): 120 degrees (Typical)
- Peak Wavelength (λp): 650 nm (Typical)
- Dominant Wavelength (λd): 639 nm (Typical)
- Spectrum Radiation Bandwidth (Δλ): 20 nm (Typical)
- Forward Voltage (VF): Typical 2.0 V (Maximum 2.4 V)
- Reverse Current (IR): Maximum 10 μA at VR=5V
Note: Measurement uncertainties are ±10% for luminous intensity, ±0.1V for forward voltage, and ±1.0nm for dominant wavelength.
3. Performance Curve Analysis
The datasheet includes several characteristic curves that illustrate the device's behavior under varying conditions. These are essential for circuit design and thermal management.
3.1 Relative Intensity vs. Wavelength
This curve shows the spectral power distribution, centered around the 650 nm peak wavelength with a typical bandwidth of 20 nm, confirming the deep red color output.
3.2 Directivity Pattern
A polar plot illustrates the 120-degree viewing angle, showing the angular distribution of light intensity. The pattern is typical for a lamp-style LED with a diffused lens.
3.3 Forward Current vs. Forward Voltage (I-V Curve)
This graph depicts the non-linear relationship between current and voltage. The typical forward voltage is 2.0V at 20mA. Designers must use current-limiting resistors or constant-current drivers based on this curve.
3.4 Relative Intensity vs. Forward Current
Light output (relative intensity) increases with forward current but is not perfectly linear. Operating above the absolute maximum rating of 25mA is prohibited and will reduce lifetime.
3.5 Thermal Characteristics
Two key graphs are provided:
Relative Intensity vs. Ambient Temperature: Shows that light output decreases as ambient temperature increases. This must be factored into designs for high-temperature environments.
Forward Current vs. Ambient Temperature: Indicates how the maximum permissible forward current should be derated as the ambient temperature rises above 25°C to stay within the 60mW power dissipation limit.
4. Mechanical and Packaging Information
4.1 Package Dimensions
The LED is housed in a standard 5mm round package (often referred to as a T-1 3/4). Key dimensional notes include:
- All dimensions are in millimeters.
- The height of the flange (the rim at the base of the dome) must be less than 1.5mm.
- The general tolerance for dimensions is ±0.25mm unless otherwise specified on the drawing.
- The drawing shows the lead spacing, body diameter, and overall height, which are critical for PCB footprint design.
4.2 Polarity Identification
The longer lead denotes the anode (positive), and the shorter lead denotes the cathode (negative). This is the standard convention for through-hole LEDs. The cathode may also be indicated by a flat spot on the plastic lens flange.
5. Soldering and Assembly Guidelines
Proper handling is crucial to ensure reliability and prevent damage to the LED.
5.1 Lead Forming
- Bend leads at a point at least 3mm from the base of the epoxy bulb.
- Perform lead forming before soldering.
- Avoid stressing the package during bending.
- Cut leads at room temperature.
- Ensure PCB holes align perfectly with LED leads to avoid mounting stress.
5.2 Storage
- Store at ≤30°C and ≤70% Relative Humidity (RH). Shelf life is 3 months under these conditions.
- For storage beyond 3 months, use a sealed container with a nitrogen atmosphere and desiccant for up to 1 year.
- Avoid rapid temperature changes in humid environments to prevent condensation.
5.3 Soldering Process
General Rule: Maintain a minimum distance of 3mm from the solder joint to the epoxy bulb.
Hand Soldering:
- Iron Tip Temperature: Maximum 300°C (for a 30W max iron).
- Soldering Time: Maximum 3 seconds per lead.
Wave (DIP) Soldering:
- Preheat Temperature: Maximum 100°C (for max 60 seconds).
- Solder Bath Temperature & Time: Maximum 260°C for 5 seconds.
Critical Soldering Notes:
- Avoid stress on leads during and immediately after soldering while the LED is hot.
- Do not solder (dip or hand) more than once.
- Protect the LED from mechanical shock/vibration until it cools to room temperature.
- Use the lowest possible temperature that achieves a reliable solder joint.
- Follow the recommended soldering profile (preheat, laminar wave, cooling) to minimize thermal shock.
5.4 Cleaning
- If necessary, clean only with isopropyl alcohol at room temperature for ≤1 minute.
- Air dry at room temperature.
- Do not use ultrasonic cleaning unless absolutely necessary and only after pre-qualification tests confirm no damage occurs.
5.5 Heat Management
Thermal management must be considered during the application design phase. The forward current must be appropriately derated based on the operating ambient temperature to prevent exceeding the maximum junction temperature and power dissipation rating, thereby ensuring long-term reliability.
6. Packaging and Ordering Information
6.1 Packing Specification
The LEDs are packaged to prevent damage from electrostatic discharge (ESD) and moisture.
- Primary Packing: Anti-static bags.
- Secondary Packing: Inner cartons.
- Tertiary Packing: Outside cartons.
- Packing Quantity: 200 to 500 pieces per bag. 5 bags per inner carton. 10 inner cartons per outside carton.
6.2 Label Explanation
Labels on the packaging contain the following information:
- CPN: Customer's Production Number
- P/N: Production Number (Part Number)
- QTY: Packing Quantity
- CAT: Rank/Bin for Luminous Intensity
- HUE: Rank/Bin for Dominant Wavelength
- REF: Rank/Bin for Forward Voltage
- LOT No: Manufacturing Lot Number for traceability.
7. Application Suggestions and Design Considerations
7.1 Typical Application Circuits
For use with a constant voltage source (e.g., 5V or 12V), a current-limiting resistor is mandatory. The resistor value (R) can be calculated using Ohm's Law: R = (Vsupply - VF) / IF. Using the typical VF of 2.0V and a desired IF of 20mA with a 5V supply: R = (5V - 2.0V) / 0.020A = 150 Ω. A resistor with a power rating of at least (5V-2.0V)*0.020A = 0.06W should be selected.
7.2 Design Considerations
- Current Driving: Always drive with a constant current or use a series resistor. Never connect directly to a voltage source.
- Thermal Design: For continuous operation at high ambient temperatures or near maximum current, consider PCB copper area for heat sinking.
- Optical Design: The 120° viewing angle is suitable for wide-angle indicators. For more focused light, an external lens may be required.
- ESD Protection: Implement ESD protection measures in the assembly environment and on the PCB if the LED is user-accessible.
8. Technical Comparison and Differentiation
This deep red AlGaInP LED offers specific advantages:
- vs. Standard Red LEDs: The deep red wavelength (639nm dominant) is further into the red spectrum than standard red LEDs (~625nm), which can be beneficial for applications requiring specific spectral response.
- vs. High-Power LEDs: This is a low-power indicator lamp (60mW max). It is not designed for illumination but for status indication and backlighting where lower cost and simpler drive circuitry are priorities.
- Key Features: The combination of a wide 120° viewing angle, relatively low forward voltage (~2.0V), and compliance with modern environmental standards (RoHS, Halogen-Free) makes it suitable for a broad range of consumer electronics.
9. Frequently Asked Questions (FAQs)
9.1 Can I drive this LED at 30mA for more brightness?
No. The Absolute Maximum Rating for continuous forward current is 25 mA. Exceeding this rating will significantly reduce the LED's lifespan and may cause immediate failure due to overheating or overstress.
9.2 What is the difference between Peak Wavelength and Dominant Wavelength?
Peak Wavelength (650nm) is the wavelength at which the emitted optical power is maximum.
Dominant Wavelength (639nm) is the single wavelength that the human eye perceives as matching the color of the light source. It is the photometric equivalent. Designers should reference dominant wavelength for color-critical applications.
9.3 Why is the storage condition (3 months) important?
LED packages can absorb moisture from the atmosphere. If a moisture-laden package is subjected to high-temperature soldering, the rapid vaporization of the moisture can cause internal delamination or cracking ("popcorning"). The 3-month shelf life assumes standard factory dry packing. For longer storage, the recommended dry nitrogen environment is necessary.
9.4 How do I interpret the binning codes (CAT, HUE, REF)?
These codes specify which performance subgroup the LED belongs to. For example, all LEDs with a specific HUE code will have a dominant wavelength within a very narrow range (e.g., 638-640nm). This allows for tighter color and brightness matching in applications using multiple LEDs. Consult the manufacturer's detailed binning document for the exact ranges associated with each code.
10. Practical Design Case Study
10.1 Designing a Panel-Mount Status Indicator
Scenario: A power button on a device needs a bright, wide-angle red indicator. The available system voltage is 3.3V.
Design Steps:
- Current Selection: Choose a drive current. For good brightness and longevity, 15mA is selected (well below the 25mA max).
- Resistor Calculation: Using the maximum VF (2.4V) for a conservative design: R = (3.3V - 2.4V) / 0.015A = 60 Ω. The nearest standard value is 62 Ω.
- Resistor Power Rating: P = (3.3V - 2.4V) * 0.015A = 0.0135W. A standard 1/8W (0.125W) resistor is more than sufficient.
- PCB Layout: Place the current-limiting resistor in series with the LED's anode. Ensure the PCB hole spacing matches the LED's lead spacing. Provide a small copper pour connected to the cathode lead for minor heat dissipation.
- Mechanical Fit: Verify the 5mm lens diameter and the required flange height (<1.5mm) fit within the panel cutout and bezel.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |